公开(公告)号：EP3956143A1

公开(公告)日：2022-02-23

申请号：EP20725521.7

申请日：2020-05-11

Applicant: Memjet Technology Limited

Inventor： ARNAL, Nicolas ,  QUIMPO, Troy, Pasiola ,  NORTH, Angus

IPC: B41J2/16

公开(公告)号：EP3758944A1

公开(公告)日：2021-01-06

申请号：EP19717838.7

申请日：2019-04-11

Applicant: Memjet Technology Limited

Inventor： PEREZ, Elmer Dimaculangan ,  NORTH, Angus ,  LOWE, Graeme ,  TAN, See-Huat ,  BARTON, Christopher

IPC: B41J2/14

公开(公告)号：EP3259134A1

公开(公告)日：2017-12-27

申请号：EP16702736.6

申请日：2016-02-03

Applicant: Memjet Technology Limited

Inventor： NORTH, Angus ,  O'REILLY, Ronan ,  MCAVOY, Gregory

IPC: B41J2/16 ,  B81C1/00

CPC classification number: B81C1/00611 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645 ,  B81B2201/052 ,  B81B2203/0353 ,  B81C2201/0104 ,  B81C2201/0121

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole; (ii) reflowing the first polymer; (iii) exposing the wafer substrate to a controlled oxidative plasma; (iv) optionally repeating steps (i) to (iii); (v) depositing a layer of a photoimageable second polymer; (vi) selectively removing the second polymer from regions outside a periphery of the holes using exposure and development; and (vii) planarizing the frontside surface to provide holes filled with a plug comprising the first and second polymers, which are different than each other. Each plug has a respective upper surface coplanar with the frontside surface.

公开(公告)号：EP3676098A1

公开(公告)日：2020-07-08

申请号：EP18807237.5

申请日：2018-11-14

Applicant: Memjet Technology Limited

Inventor： NORTH, Angus ,  WALKER, Matthew

IPC: B41J2/16

公开(公告)号：EP3259134B1

公开(公告)日：2018-08-08

申请号：EP16702736.6

申请日：2016-02-03

Applicant: Memjet Technology Limited

Inventor： NORTH, Angus ,  O'REILLY, Ronan ,  MCAVOY, Gregory

IPC: B41J2/16 ,  B81C1/00

CPC classification number: B81C1/00611 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645 ,  B81B2201/052 ,  B81B2203/0353 ,  B81C2201/0104 ,  B81C2201/0121

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole; (ii) reflowing the first polymer; (iii) exposing the wafer substrate to a controlled oxidative plasma; (iv) optionally repeating steps (i) to (iii); (v) depositing a layer of a photoimageable second polymer; (vi) selectively removing the second polymer from regions outside a periphery of the holes using exposure and development; and (vii) planarizing the frontside surface to provide holes filled with a plug comprising the first and second polymers, which are different than each other. Each plug has a respective upper surface coplanar with the frontside surface.