公开(公告)号：EP2798313B1

公开(公告)日：2019-03-13

申请号：EP13824299.5

申请日：2013-11-14

申请人： Micro-Epsilon Messtechnik GmbH & Co. KG

发明人： SCHMIDEDER, Sabine ,  HOENICKA, Reinhold ,  SCHALLMOSER, Guenter

IPC分类号： G01D11/24

公开(公告)号：EP2516321A2

公开(公告)日：2012-10-31

申请号：EP11817213.9

申请日：2011-10-10

申请人： Micro-Epsilon Messtechnik GmbH & Co. KG

发明人： SCHMIDEDER, Sabine ,  THELEMANN, Torsten ,  NAGL, Josef ,  ASCHENBRENNER, Heinrich ,  HOENICKA, Reinhold

IPC分类号： B81B7/00

CPC分类号： H05K1/181 ,  B81B7/0006 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/32 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4629 ,  H05K2201/10151 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10356 ,  Y10T29/49128 ,  H01L2924/00

摘要： A sensor comprises a preferably multilayered ceramic substrate (2) and at least one sensor element (1) arranged in, at or on the ceramic substrate (2). Contact can be made with the sensor element (1) via a metallic contact (6), wherein the metallic contact (6) is produced by means of a soldering connection that electrically connects the contact (6) to the sensor element (1) and in the process produces a fixed mechanical connection of the contact (6) relative to the ceramic substrate (2). A method for producing the sensor according to the invention is furthermore claimed.

公开(公告)号：EP2516321B1

公开(公告)日：2019-03-06

申请号：EP11817213.9

申请日：2011-10-10

申请人： Micro-Epsilon Messtechnik GmbH & Co. KG

发明人： SCHMIDEDER, Sabine ,  THELEMANN, Torsten ,  NAGL, Josef ,  ASCHENBRENNER, Heinrich ,  HOENICKA, Reinhold

IPC分类号： B81B7/00

公开(公告)号：EP2798313A1

公开(公告)日：2014-11-05

申请号：EP13824299.5

申请日：2013-11-14

申请人： Micro-Epsilon Messtechnik GmbH & Co. KG

发明人： SCHMIDEDER, Sabine ,  HOENICKA, Reinhold ,  SCHALLMOSER, Guenter

IPC分类号： G01D11/24

CPC分类号： G01D11/245

摘要： A contactless sensor is designed with a metal housing (2) and a substantially ceramic sensor unit (4), which is at least partially arranged in the housing (2) and which has an integrated measuring element. The housing (2) and the sensor unit (4) have different thermal expansion coefficients. The sensor is characterized in that at least one compensation element (3) is provided between the housing (2) and the sensor unit (4), the at least one compensation element having at least one material property that compensates for the different expansion coefficients.