公开(公告)号：EP2608255A1

公开(公告)日：2013-06-26

申请号：EP11195720.5

申请日：2011-12-23

申请人： Micronit Microfluidics B.V.

发明人： Van 't Oever, Ronny ,  Blom, Marko Theodoor ,  Haneveld, Jeroen ,  Oonk, Johannes ,  Olde Riekerink, Marinus Bernardus ,  Tijssen, Peter ,  Tigelaar, Hendrik Jan Hildebrand ,  Fehr, Jean-Noël ,  Roulet, Jean-Christophe ,  Gupta, Amitava

IPC分类号： H01L23/10 ,  B81C1/00 ,  H01L21/50

CPC分类号： B81C1/00269 ,  B81B2201/058 ,  B81C3/001 ,  B81C2201/0132 ,  B81C2203/0118 ,  B81C2203/019 ,  C23F1/02 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T428/239 ,  H01L2924/00

摘要： The invention relates to method for bonding at least two substrates, for example made from glass, silicon or ceramic, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of:
a) providing said two substrates;
b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates;
c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and
d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate.
The invention also relates to a device comprising two substrates, for example made from glass, silicon or ceramic, and an intermediate thin film metal layer.

摘要翻译： 本发明涉及通过使用用于提供粘合的中间薄膜金属层来将至少两个基板（例如由玻璃，硅或陶瓷制成）接合的方法，所述方法包括以下步骤：a）提供所述两个基板; b）在所述两个基板的第一基板的表面的至少一部分上沉积所述薄膜金属层; c）使所述第二基板的表面与所述第一基板的所述表面上的所述薄膜金属层接触，从而提供所述第一基板上的所述第二基板与所述薄膜金属层之间的接合; 以及d）至少局部加强第一基板上的第二基板和薄膜金属层之间的接合。 本发明还涉及包括例如由玻璃，硅或陶瓷制成的两个基底和中间薄膜金属层的器件。

公开(公告)号：EP2269947B1

公开(公告)日：2015-04-01

申请号：EP10167629.4

申请日：2010-06-29

申请人： Micronit Microfluidics B.V.

发明人： Van 't Oever, Ronny ,  Blom, Marko Theodoor

IPC分类号： B81C99/00

CPC分类号： B81C99/004 ,  B81B2201/058 ,  Y10T29/49764

公开(公告)号：EP2772306A1

公开(公告)日：2014-09-03

申请号：EP14157523.3

申请日：2014-03-03

申请人： Micronit Microfluidics B.V.

发明人： Olde Riekerink, Marinus Bernardus ,  Buesink, Wilfred ,  Koelewijn-Hubers, Arenda Hendrika Jacoba ,  Blom, Marko Theodoor ,  van't Oever, Ronny

IPC分类号： B01J19/00 ,  B01L3/00 ,  B81B1/00 ,  B81C1/00

摘要： The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of:
(a) providing a starting material;
(b) forming at least one shared capillary in the starting material, said shared capillary comprising an fluidic inlet and an fluidic outlet;
(c) functionalizing the chips by supplying a functionalization fluid to the shared capillary; and
(d) dividing the starting material into separate chips.
The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply.
The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.

摘要翻译： 本发明涉及一种用于制造具有至少一个毛细管的微流体芯片，用于通过流动的流体的方法，包括以下步骤：（a）提供一起始材料; （B）在起始材料中形成至少一个共享的毛细管，所述共享毛细管流体入口和流体的出口，包括： （C）官能化通过供应官能流体到共享毛细管的芯片; 和（d）将所述起始原料为单独的芯片。 本发明还涉及一种设备，用于官能化具有用于通流的流体的，所述装置包括一个材料保持器用于在官能化过程中的固定位置保持起始材料的至少一个毛细管的微流体芯片，所述材料保持器包括至少一个入口 连接器，用于连接在起始材料而形成的流体供给官能的至少一个共享的毛细管。 本发明还涉及到微流体芯片和用于保持微流体芯片的装置。

公开(公告)号：EP2269947A3

公开(公告)日：2014-02-26

申请号：EP10167629.4

申请日：2010-06-29

申请人： Micronit Microfluidics B.V.

发明人： Van 't Oever, Ronny ,  Blom, Marko Theodoor

IPC分类号： B81C99/00

CPC分类号： B81C99/004 ,  B81B2201/058 ,  Y10T29/49764

摘要： The invention relates to a method for manufacturing and testing microfluidic chips having at least one capillary for through-flow of a fluid. The method comprises the following steps:
- providing a starting material;
- forming at least one shared capillary in the starting material;
- arranging a plurality of functional elements in or over the shared capillary, thus forming a plurality of chips;
- testing the chips by supplying a test fluid to the shared capillary; and
- dividing the starting material into separate chips.
The invention further relates to a device for testing microfluidic chips having at least one capillary for through-flow of a fluid. This device comprises a material holder for holding a starting material in a fixed position during testing, and an inlet connector for connecting a shared capillary formed in the starting material to a test fluid supply.

公开(公告)号：EP2269947A2

公开(公告)日：2011-01-05

申请号：EP10167629.4

申请日：2010-06-29

申请人： Micronit Microfluidics B.V.

发明人： Van 't Oever, Ronny ,  Blom, Marko Theodoor

IPC分类号： B81C99/00

CPC分类号： B81C99/004 ,  B81B2201/058 ,  Y10T29/49764

摘要： The invention relates to a method for manufacturing and testing microfluidic chips having at least one capillary for through-flow of a fluid. The method comprises the following steps:
- providing a starting material;
- forming at least one shared capillary in the starting material;
- arranging a plurality of functional elements in or over the shared capillary, thus forming a plurality of chips;
- testing the chips by supplying a test fluid to the shared capillary; and
- dividing the starting material into separate chips.
The invention further relates to a device for testing microfluidic chips having at least one capillary for through-flow of a fluid. This device comprises a material holder for holding a starting material in a fixed position during testing, and an inlet connector for connecting a shared capillary formed in the starting material to a test fluid supply.

摘要翻译： 本发明涉及用于制造和测试具有至少一个用于流体流通的毛细管的微流体芯片的方法。 该方法包括以下步骤： - 提供原料; - 在起始材料中形成至少一个共用毛细管; - 在共享毛细管内或上方布置多个功能元件，从而形成多个芯片; - 通过向共享毛细管提供测试流体来测试芯片; 和 - 将起始材料分成单独的芯片。 本发明还涉及一种用于测试具有至少一个用于流体流通的毛细管的微流体芯片的装置。 该装置包括用于在测试期间将起始材料保持在固定位置的材料保持器和用于将形成在起始材料中的共用毛细管连接到测试流体供应的入口连接器。