公开(公告)号：EP2608255A1

公开(公告)日：2013-06-26

申请号：EP11195720.5

申请日：2011-12-23

申请人： Micronit Microfluidics B.V.

发明人： Van 't Oever, Ronny ,  Blom, Marko Theodoor ,  Haneveld, Jeroen ,  Oonk, Johannes ,  Olde Riekerink, Marinus Bernardus ,  Tijssen, Peter ,  Tigelaar, Hendrik Jan Hildebrand ,  Fehr, Jean-Noël ,  Roulet, Jean-Christophe ,  Gupta, Amitava

IPC分类号： H01L23/10 ,  B81C1/00 ,  H01L21/50

CPC分类号： B81C1/00269 ,  B81B2201/058 ,  B81C3/001 ,  B81C2201/0132 ,  B81C2203/0118 ,  B81C2203/019 ,  C23F1/02 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T428/239 ,  H01L2924/00

摘要： The invention relates to method for bonding at least two substrates, for example made from glass, silicon or ceramic, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of:
a) providing said two substrates;
b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates;
c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and
d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate.
The invention also relates to a device comprising two substrates, for example made from glass, silicon or ceramic, and an intermediate thin film metal layer.

摘要翻译： 本发明涉及通过使用用于提供粘合的中间薄膜金属层来将至少两个基板（例如由玻璃，硅或陶瓷制成）接合的方法，所述方法包括以下步骤：a）提供所述两个基板; b）在所述两个基板的第一基板的表面的至少一部分上沉积所述薄膜金属层; c）使所述第二基板的表面与所述第一基板的所述表面上的所述薄膜金属层接触，从而提供所述第一基板上的所述第二基板与所述薄膜金属层之间的接合; 以及d）至少局部加强第一基板上的第二基板和薄膜金属层之间的接合。 本发明还涉及包括例如由玻璃，硅或陶瓷制成的两个基底和中间薄膜金属层的器件。