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    Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed
    2.
    发明公开
    Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed 审中-公开
    在印刷电路板的方法以及用于印刷焊膏装置

    公开(公告)号：EP1265469A3

    公开(公告)日：2005-01-19

    申请号：EP02011615.8

    申请日：2002-05-28

    申请人： NEC CORPORATION

    发明人： Sakai, Hiroshi ,  Suzuki, Motoji ,  Igarashi, Makoto ,  Tanaka, Akihiro

    IPC分类号： H05K3/12

    CPC分类号： H05K3/3484 ,  H05K3/1233 ,  H05K3/3463 ,  H05K2203/086

    摘要： The solder paste printing method of the present invention mounts a solder paste containing therein as a solder material a Sn-Zn system solder on a mask, and urges the solder paste to make rolling over the mask from one end thereof toward the opposite thereof by means of a squeegee to thereby fill the solder paste into apertures formed in the mask. At this time, by maintaining moisture contained in the atmosphere surrounding the solder paste at a value equal to or less than a predetermined value, as the solder paste is suppressed from causing an increase in the viscosity thereof due to the reaction with the moisture in the surrounding atmosphere during the solder paste printing process, the rolling ability of the solder paste during the printing process can be kept, and attachment of the solder paste to the squeegee can be prevented.

    A method of packaging electronic components with high reliability
    9.
    发明公开
    A method of packaging electronic components with high reliability 审中-公开
    维尔法赫恩ZurBestückungvon elektronischen Bauteilen mit hoherZuverlässigkeit

    公开(公告)号：EP1263271A3

    公开(公告)日：2004-06-02

    申请号：EP02011617.4

    申请日：2002-05-28

    申请人： NEC CORPORATION

    发明人： Sakai, Hiroshi ,  Suzuki, Motoji ,  Igarashi, Makoto ,  Tanaka, Akihiro

    IPC分类号： H05K3/34

    CPC分类号： H05K3/3484 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y02P70/613 ,  Y10T29/49144

    摘要： An electronic component that is provided with leads at a narrow pitch that are plated with solder is packaged by soldering the leads to lands (14) on a printed circuit board on which the lands (14) have been formed in a pattern of arrangement that corresponds to said leads. When packaging, solder paste (11) is printed over areas on the lands (14) that are greater in area than the area of the lands (14). The leads are then placed on this solder paste (11), and the solder paste (11) is subjected to reflow to solder the leads onto the lands (14).

    摘要翻译： 通过将引线焊接到印刷电路板上的焊盘（14）上，以窄的间距设置有电镀有焊料的电子部件，该印刷电路板已经形成有以对应的布置图案形成的印刷电路板 到线索 当包装时，将焊膏（11）印刷在具有比区域（14）的面积大的区域上的区域上。 然后将引线放置在该焊膏（11）上，并且将焊膏（11）进行回流以将引线焊接到焊盘（14）上。