HONEYCOMB STRUCTURE
    4.
    发明公开
    HONEYCOMB STRUCTURE 审中-公开
    蜂窝结构

    公开(公告)号:EP3070069A1

    公开(公告)日:2016-09-21

    申请号:EP16160283.4

    申请日:2016-03-15

    IPC分类号: C04B35/515 C04B38/00

    摘要: Provided is a honeycomb structure having low heat capacity and high thermal diffusivity, and that follows the ambient temperature change rapidly. A honeycomb structure 100 includes a pillar-shaped honeycomb structure body 4 having a porous partition wall 1. The honeycomb structure body 4 includes a plurality of cells 2 defined by the partition wall 1 so as to extend from a first end face 11 to a second end face 12 of the honeycomb structure body 4, the partition wall 1 is formed by a porous body including a silicon phase as a main phase, and the silicon phase as the main phase has content of each of metals other than silicon and metals making up silicide that is 0.3 part by mass or less with respect to 100 parts by mass of silicon.

    摘要翻译: 本发明提供一种热容量低且热扩散性高,且随着周围温度的变化而迅速变化的蜂窝结构体。 蜂窝结构体100具备具有多孔质的隔壁1的柱状的蜂窝结构体4.蜂窝结构体4具有由隔壁1划分出的多个单元2,该多个单元2从第一端面11延伸至第二端面 在蜂窝结构体4的端面12上,隔壁1由以硅相为主相的多孔体形成,作为主相的硅相除了硅以外,还含有金属 硅化物相对于硅100质量份为0.3质量份以下。