公开(公告)号：EP4446455A1

公开(公告)日：2024-10-16

申请号：EP22904062.1

申请日：2022-11-25

Applicant: NHK Spring Co., Ltd.

Inventor： YOKOYAMA, Hibiki ,  FUTAKUCHIYA, Jun ,  KANEDA, Noriyoshi ,  SONE, Michiyoshi ,  FUJII, Masahiro ,  NAMBU, Takatoshi

IPC: C23C4/02 ,  H01L21/683

Abstract: The metal mask has a body having a first surface in contact with a surface of a workpiece, a second surface opposite the first surface and a third surface between the first surface and the second surface, and an eave portion continuous with the body portion and projecting outwards from the first surface, the eave portion being arranged away from the surface of the workpiece. The third surface (side surface) of the body portion of the metal mask may have a stepped portion formed of the eave portion. The third surface (side surface) of the body part has an inclined surface that extends from the first surface to the second surface and may have a structure in which the eave portion is arranged above the inclined surface.

公开(公告)号：EP4456121A1

公开(公告)日：2024-10-30

申请号：EP22910829.5

申请日：2022-12-02

Applicant: NHK Spring Co., Ltd.

Inventor： OTSUKA, Yusuke ,  KIDA, Naoya ,  FUTAKUCHIYA, Jun ,  KANEDA, Noriyoshi ,  YOKOYAMA, Hibiki ,  SONE, Michiyoshi ,  SAKAMOTO, Hiroki

IPC: H01L21/683 ,  B32B9/04 ,  B32B15/04 ,  B32B15/20 ,  C23C14/50 ,  H01L21/205 ,  H01L21/31

Abstract: A laminate structure of the invention is a laminate structure for a semiconductor manufacturing device, and includes a substrate containing aluminum and including a first face, an intermediate layer arranged on the first face of the substrate and containing aluminum oxide, and a cover layer arranged on the intermediate layer and containing metal atoms. The intermediate layer includes a partition wall forming a plurality of voids in a cross-sectional shape parallel to the first face. The intermediate layer includes a boundary layer covering the first face of the substrate. The cover layer is arranged in some of the plurality of voids in the intermediate layer. The plurality of voids includes voids adjacent to the boundary layer and separated from the cover layer.

公开(公告)号：EP4502225A1

公开(公告)日：2025-02-05

申请号：EP23779146.2

申请日：2023-02-28

Applicant: NHK Spring Co., Ltd.

Inventor： HIRANO, Satoshi ,  TAKAHARA, Go ,  NAMBU, Takatoshi ,  KANEDA, Noriyoshi ,  YOKOYAMA, Hibiki ,  SONE, Michiyoshi

IPC: C23C4/12

Abstract: This rotary device comprises a rotary stage detachably supporting a base material having an inlet and an outlet for a liquid at a predetermined temperature, and a flow path connecting the inlet to the outlet, a rotary support which supports a rotary table, a rotary mechanism which rotates the rotary support, and a liquid supply part which supplies the liquid to the base material. The rotary stage has a liquid supply port for supplying the liquid to the base material, and a liquid discharge port for discharging the liquid from the base material. The rotary support has therein a first pipe connected to the liquid supply port, and a second pipe connected to the liquid discharge port. In addition, the thermal spraying apparatus comprises the rotary device and a thermal spray gun.

公开(公告)号：EP4491757A1

公开(公告)日：2025-01-15

申请号：EP23766622.7

申请日：2023-02-27

Applicant: NHK Spring Co., Ltd.

Inventor： YOKOYAMA, Hibiki ,  KANEDA, Noriyoshi ,  SONE, Michiyoshi ,  HIRANO, Satoshi ,  TAKAHARA, Go ,  NAMBU Takatoshi

IPC: C23C4/00 ,  B05B7/16 ,  B05B12/12 ,  B05D1/08 ,  B05D3/00

Abstract: According to an embodiment of the present invention, a thermal spraying device including a thermal spraying machine that includes a thermal spraying torch which thermally sprays a material to a base material, one or more peripheral devices that are used together with the thermal spraying machine, and a centralized control board that is capable of collectively controlling the thermal spraying machine and the one or more peripheral devices is provided. According to an embodiment of the present invention of the present invention, a spraying control method that is executed by a thermal spraying device including a thermal spraying machine, one or more peripheral devices that are used together with the thermal spraying machine, and a centralized control board, the method including collectively controlling the thermal spraying machine and the one or more peripheral devices by the centralized control board is provided.

公开(公告)号：EP4213183A1

公开(公告)日：2023-07-19

申请号：EP21866441.5

申请日：2021-08-06

Applicant: NHK Spring Co., Ltd.

Inventor： YOKOYAMA, Hibiki ,  KIDA, Naoya ,  FUTAKUCHIYA, Jun ,  KANEDA, Noriyoshi ,  SONE, Michiyoshi

IPC: H01L21/3065 ,  H01L21/683

Abstract: A stage includes a base material including a step portion and an insulating film. The step portion includes a first surface recessed from a top surface of the base material and a second surface recessed from a side surface of the base material. The insulating film includes a plurality of first layers on the first surface and a plurality of second layers on the second surface. In the step portion, each first end portion of the plurality of first layers and each second end portion of the plurality of second layers are alternately stacked. The first surface and the second surface are connected via a corner, and each first end portion and each second end portion are alternately stacked at the corner.