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公开(公告)号：EP0171091A3
公开(公告)日：1986-08-20
申请号：EP85111660
申请日：1981-09-22
发明人： Kinase, Takashi , Ichimura, Seiji , Mashiko, Masayoshi , Kinjo, Yoshio , Matsumoto, Yosuke , Suzuki, Keijiro
CPC分类号： C25D11/34 , C25D3/52 , C25D5/48 , Y10T428/12875
摘要： A process for improving the wear resistance and enhancing the black color of a black or blue rhodium-plated article is disclosed. In this process the rhodium-plated article is subject to anodic electrolysis, said electrolysis being carried out in a bath comprising one or more selected ingredients with a direct current of a current density of 0.004 to 20 A/dm 2 and a bath temperature of 20 to 60°C for 3 to 60 minutes.
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公开(公告)号：EP0171091B1
公开(公告)日：1989-12-06
申请号：EP85111660.8
申请日：1981-09-22
发明人： Kinase, Takashi , Ichimura, Seiji , Mashiko, Masayoshi , Kinjo, Yoshio , Matsumoto, Yosuke , Suzuki, Keijiro
CPC分类号： C25D11/34 , C25D3/52 , C25D5/48 , Y10T428/12875
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公开(公告)号：EP0171091A2
公开(公告)日：1986-02-12
申请号：EP85111660.8
申请日：1981-09-22
发明人： Kinase, Takashi , Ichimura, Seiji , Mashiko, Masayoshi , Kinjo, Yoshio , Matsumoto, Yosuke , Suzuki, Keijiro
CPC分类号： C25D11/34 , C25D3/52 , C25D5/48 , Y10T428/12875
摘要： A process for improving the wear resistance and enhancing the black color of a black or blue rhodium-plated article is disclosed. In this process the rhodium-plated article is subject to anodic electrolysis, said electrolysis being carried out in a bath comprising one or more selected ingredients with a direct current of a current density of 0.004 to 20 A/dm 2 and a bath temperature of 20 to 60°C for 3 to 60 minutes.
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4.发明公开Tin whisker-free tin or tin alloy plated article and coating technique thereof 失效米奇whiskerfreiem Zinn oder whiskerfreier Zinnlegierung plattierter Gegenstand und Beschichtungstechnikdafür。
公开(公告)号：EP0346888A1
公开(公告)日：1989-12-20
申请号：EP89110828.4
申请日：1989-06-14
CPC分类号： H05K3/244 , C23C18/31 , C25D5/10 , H01L23/49582 , H01L23/49866 , H01L2924/0002 , H01L2924/09701 , Y10T428/12681 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
摘要： A tin or tin alloy plated article, particularly a film carrier which is protected against the generation of tin whiskers characterized in having an indium plated layer on the subsrtrate thereof and a tin or tin alloy plated layer on said indium plated layer. There are also disclosed a coating process therefor as well as a novel and unique electroless indium plating bath therefor, said indium plating bath is an acidic, electroless plating bath characterized by including an indium salt and thiourea or a derivative thereof.
摘要翻译： 一种锡或锡合金电镀制品，特别是防止产生锡晶须的膜载体，其特征在于在其下层上具有铟镀层，并且在所述铟镀层上具有锡或锡合金镀层。 还公开了一种涂覆方法以及一种新颖独特的无电镀铟浴，所述铟电镀浴是一种酸性无电镀浴，其特征在于包括铟盐和硫脲或其衍生物。
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5.发明授权Tin whisker-free tin or tin alloy plated article and coating technique thereof 失效与whiskerfreiem锡或锡合金镀whiskerfreier对象和涂层技术它。
公开(公告)号：EP0346888B1
公开(公告)日：1994-03-16
申请号：EP89110828.4
申请日：1989-06-14
CPC分类号： H05K3/244 , C23C18/31 , C25D5/10 , H01L23/49582 , H01L23/49866 , H01L2924/0002 , H01L2924/09701 , Y10T428/12681 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
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