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公开(公告)号：EP2393134A3
公开(公告)日：2014-09-03
申请号：EP11168781.0
申请日：2011-06-06
发明人： Matsuda, Hirokazu , Suehiro, Ichiro
IPC分类号： H01L33/00 , H01L33/50 , H01L25/075
CPC分类号： H01L33/50 , H01L33/505 , H01L2224/48091 , H01L2933/0041 , H01L2933/005 , Y10T428/24752 , H01L2924/00014
摘要： The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.
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2.发明公开Resin sheet, method of producing the same and through-hole forming apparatus 审中-公开Kunststofffolie，Herstellungsverfahrendafürund Perforationsapparat
公开(公告)号：EP2551079A1
公开(公告)日：2013-01-30
申请号：EP12176866.7
申请日：2012-07-18
发明人： Suehiro, Ichiro
IPC分类号： B26F1/14
CPC分类号： B26F1/14 , Y10T428/24273
摘要： A method of producing a resin sheet (2) includes the steps of arranging a resin sheet (2) between a substrate (4) and a die (5) opposed to the substrate, and forming a through-hole (3) in the resin sheet (2) to pass through the resin sheet (2) in a pressing direction by relatively pressing the die (5) against the substrate (4). The die (5) includes a first protrusion (7) protruding toward a downstream side in the pressing direction. A second protrusion (9) protruding toward the downstream side in the pressing direction is formed on a peripheral edge portion of an end portion of the first protrusion on the downstream side in the pressing direction. An end portion of the second protrusion (9) on the downstream side in the pressing direction is formed at an acute angle in sectional view along the pressing direction.
摘要翻译： 树脂片（2）的制造方法包括在基板（4）和与基板相对的模具（5）之间配置树脂片（2），在树脂中形成贯通孔（3）的工序 片材（2）通过相对地将模具（5）压靠在基板（4）上而在挤压方向上通过树脂片材（2）。 模具（5）包括朝向按压方向的下游侧突出的第一突起（7）。 在按压方向的下游侧的第一突起的端部的周缘部形成有沿着按压方向向下游侧突出的第二突起（9）。 在按压方向的下游侧的第二突起（9）的端部沿着按压方向以剖视图形成为锐角。
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公开(公告)号：EP1439406A1
公开(公告)日：2004-07-21
申请号：EP04000872.4
申请日：2004-01-16
发明人： Suehiro, Ichiro , Sadayori, Naoki , Hotta, Yuji
CPC分类号： G02B3/0031 , C08G18/025 , C08G18/71 , C08G18/724 , C08G18/7607 , G02B1/041
摘要： A microlens array having a resin layer forming convex lenses, wherein the resin layer comprises a cured product of a polycarbodiimide resin represented by formula:
wherein R represents a diisocyanate residue; R 1 represents a monoisocyanate residue; and n represents an integer of 1 to 100.摘要翻译： 一种具有形成凸透镜的树脂层的微透镜阵列，其中所述树脂层包含由式：CHEM表示的聚碳二亚胺树脂的固化产物，其中R表示二异氰酸酯残基; R 1表示单异氰酸酯残基; n表示1〜100的整数
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公开(公告)号：EP2219242A2
公开(公告)日：2010-08-18
申请号：EP10153757.9
申请日：2010-02-17
发明人： Hirokazu, Matsuda , Ryuichi, Kimura , Koji, Akazawa , Kazuya, Fujioka , Hideyuki, Usui , Suehiro, Ichiro
CPC分类号： H01L33/54 , B29C33/68 , H01L33/52 , Y10T428/24521
摘要： The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet.
摘要翻译： 用于光半导体封装的片材技术领域本发明涉及一种用于光半导体封装的片材，该片材具有层压在其上的剥离片和密封树脂层，其中该剥离片包含具有凹入形状和/或凸出形状的凹凸部分形成层， 与封装树脂层形成密封树脂层，封装树脂层具有与脱模片的凹面形状嵌合的凸形状和/或在与脱模片的界面处与脱模片的凸形状嵌合的凹形状。
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5.发明公开Resin sheet for encapsulating optical semiconductor element and optical semiconductor device 审中-公开Harzfolie zur Verkapselung optischer Halbleiterementment und optisches Halbleiterbauelement
公开(公告)号：EP2105975A1
公开(公告)日：2009-09-30
申请号：EP09004125.2
申请日：2009-03-23
发明人： Suehiro, Ichiro , Akazawa, Kouji , Usui, Hideyuki
CPC分类号： H01L21/561 , H01L24/97 , H01L33/44 , H01L33/483 , H01L33/52 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/12041 , H01L2924/181 , Y10T428/24851 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer (3), an adhesive resin layer (4), a metal layer (5) and a protective resin layer (2), in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element (6) encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.
摘要翻译： 本发明提供一种用于封装光学半导体元件的树脂片，该树脂片含有密封树脂层（3），粘合树脂层（4），金属层（5）和保护树脂层（2） 将密封树脂层和附着在粘合树脂层上的金属层彼此相邻配置，将保护树脂层层叠在密封树脂层和金属层上，以覆盖密封树脂层和金属层两者 并且所述密封树脂层具有向保护树脂层扩展的锥形形状; 以及包含通过使用树脂片封装的光学半导体元件（6）的光学半导体器件。 本发明的光半导体元件封装树脂片可以适用于液晶屏，交通信号灯，大型室外显示器，广告牌等的背光。
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公开(公告)号：EP1439406B1
公开(公告)日：2006-04-19
申请号：EP04000872.4
申请日：2004-01-16
发明人： Suehiro, Ichiro , Sadayori, Naoki , Hotta, Yuji
CPC分类号： G02B3/0031 , C08G18/025 , C08G18/71 , C08G18/724 , C08G18/7607 , G02B1/041
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公开(公告)号：EP1589590A2
公开(公告)日：2005-10-26
申请号：EP05007797.3
申请日：2005-04-08
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , G02F1/133603 , H01L2933/0091 , Y10S362/80
摘要： The present invention provides a direct-type backlight having: a resin sealing member (3) including at least one resin layer, which has a light reflecting section (4) formed on the outermost surface of the resin sealing member (3); an optical semiconductor element (2) sealed by the resin sealing member (3); and plural circular light scattering grooves (5) formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.
摘要翻译： 本发明提供一种直接型背光源，具有：具有至少一个树脂层的树脂密封构件（3），该树脂层具有形成在树脂密封构件（3）的最表面上的光反射部分（4）; 由树脂密封构件（3）密封的光学半导体元件（2）; 以及同心地形成在树脂层的至少一个表面上的多个圆形光散射槽（5），其中中心的圆的面积和各个同心圆之间的面积基本相同。
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公开(公告)号：EP2219242A3
公开(公告)日：2014-04-16
申请号：EP10153757.9
申请日：2010-02-17
发明人： Hirokazu, Matsuda , Ryuichi, Kimura , Koji, Akazawa , Kazuya, Fujioka , Hideyuki, Usui , Suehiro, Ichiro
CPC分类号： H01L33/54 , B29C33/68 , H01L33/52 , Y10T428/24521
摘要： The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet.
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公开(公告)号：EP2393134A2
公开(公告)日：2011-12-07
申请号：EP11168781.0
申请日：2011-06-06
发明人： Matsuda, Hirokazu , Suehiro, Ichiro
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L33/505 , H01L2224/48091 , H01L2933/0041 , H01L2933/005 , Y10T428/24752 , H01L2924/00014
摘要： The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.
摘要翻译： 本发明涉及一种光半导体用密封片，其包含：含荧光体的含荧光体层; 以及密封树脂层，该密封树脂层含有密封树脂并层压在所述含荧光体层上，其中在所述含荧光体层的所述层压表面上，所述含荧光体层的边缘从所述密封树脂层的边缘突出，并且突出长度 所述含荧光体层的厚度为所述密封树脂层的厚度的1〜10倍。
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公开(公告)号：EP1589590A3
公开(公告)日：2010-09-15
申请号：EP05007797.3
申请日：2005-04-08
IPC分类号： H01L33/54
CPC分类号： H01L33/54 , G02F1/133603 , H01L2933/0091 , Y10S362/80
摘要： The present invention provides a direct-type backlight having: a resin sealing member (3) including at least one resin layer, which has a light reflecting section (4) formed on the outermost surface of the resin sealing member (3); an optical semiconductor element (2) sealed by the resin sealing member (3); and plural circular light scattering grooves (5) formed concentrically on at least one surface of the resin layer, wherein an area of a circle in the center and an area among the respective concentric circles are substantially the same.
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