Abstract:
Water vapour enhanced focused particle-beam-machining speeds up the removal of polymer-based dielectric materials from areas surrounding metallic interconnects on integrated circuits while at the same time decreasing the rate of removal of aluminium. Selective material removal protects metal interconnects from machining damage and greatly reduces the time that protective material is exposed to the particle beam.
Abstract:
Water vapour enhanced focused particle-beam-machining speeds up the removal of polymer-based dielectric materials from areas surrounding metallic interconnects on integrated circuits while at the same time decreasing the rate of removal of aluminium. Selective material removal protects metal interconnects from machining damage and greatly reduces the time that protective material is exposed to the particle beam.