公开(公告)号：EP1494281A3

公开(公告)日：2009-03-11

申请号：EP03026554.0

申请日：2003-11-18

申请人： NORTHROP GRUMMAN CORPORATION

发明人： Hathaway, James A. ,  Crossman, Brian F. ,  Din, Salah

IPC分类号： H01L23/498 ,  H01L23/66

CPC分类号： H01L23/66 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099

摘要： An electronic device packaging assembly (10) that includes a ball grid array (60) and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly (10) includes a thin base plate (14) made of a suitable rigid material. Power vias (48), signal vias (26) and ground vias (46) are formed through the base plate (14) to be coupled to traces, circuit components, and/or the device (12) within the packaging assembly (10). An impedance matching compensation network (28) provides impedance matching between the device (12) and the signal vias (26). The ball grid array (60) includes a plurality of solder balls (68), including ground solder balls (72), signal solder balls (74) and power solder balls (76), electrically coupled to the appropriate via extending through the base plate (14).

公开(公告)号：EP1494281A2

公开(公告)日：2005-01-05

申请号：EP03026554.0

申请日：2003-11-18

申请人： Northrop Grumman Corporation

发明人： Hathaway, James A. ,  Crossman, Brian F. ,  Din, Salah

IPC分类号： H01L23/498 ,  H01L23/66

CPC分类号： H01L23/66 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099

摘要： An electronic device packaging assembly (10) that includes a ball grid array (60) and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly (10) includes a thin base plate (14) made of a suitable rigid material. Power vias (48), signal vias (26) and ground vias (46) are formed through the base plate (14) to be coupled to traces, circuit components, and/or the device (12) within the packaging assembly (10). An impedance matching compensation network (28) provides impedance matching between the device (12) and the signal vias (26). The ball grid array (60) includes a plurality of solder balls (68), including ground solder balls (72), signal solder balls (74) and power solder balls (76), electrically coupled to the appropriate via extending through the base plate (14).

摘要翻译： 一种包括球栅阵列（60）的专用结构的电子设备包装组件（10），能够以最小的寄生损耗从DC到50GHz的操作。 包装组件（10）包括由合适的刚性材料制成的薄的底板（14）。 电源通孔（48），信号通路（26）和接地通孔（46）通过基板（14）形成以耦合到包装组件（10）内的迹线，电路部件和/或设备（12） 。 阻抗匹配补偿网络（28）提供设备（12）和信号通孔（26）之间的阻抗匹配。 球栅阵列（60）包括多个焊球（68），其包括接地焊球（72），信号焊球（74）和电焊球（76），电耦合到穿过基板的适当通孔 （14）。