摘要:
The disclosure relates to bipolar transistor devices and a method of fabricating the same. The device comprises a field plate, in an isolation region adjacent to a base-collector junction of said active region. The isolation region comprises a gate terminal arranged to be biased independently of a collector, base or emitter terminal of said transistor.
摘要:
Disclosed is an integrated circuit (100) comprising a cavity (52) defined over a substrate (10) and a membrane (42, 50) arranged to be exposed to infrared radiation suspended over said cavity, said membrane comprising a conductive body (42) and an infrared radiation absorbing polymer (50) covering said conductive body such that the conductive body is shielded from said radiation by said polymer, said conductive body being conductively coupled to a pair of electrodes. A body detection system including such an IC and a method of manufacturing such an IC are also disclosed.
摘要:
A GaN heterojunction device (and method) has a region at the gate edge processed differently to provide a region which enables a reduction in leakage currents.
摘要:
A GaN heterojunction structure has a three-layer dielectric structure. The lowermost and middle portions of the gate electrode together define the gate foot, and this is associated with two dielectric layers. A thinner first dielectric layer is adjacent the gate edge at the bottom of the gate electrode. The second dielectric layer corresponds to the layer in the conventional structure, and it is level with the main portion of the gate foot.
摘要:
Disclosed is a semiconductor device comprising a group 13 nitride heterojunction comprising a first layer having a first bandgap and a second layer having a second bandgap, wherein the first layer is located between a substrate and the second layer; and a Schottky electrode and a first further electrode each conductively coupled to a different area of the heterojunction, said Schottky electrode comprising a central region and an edge region, wherein the element comprises a conductive barrier portion located underneath said edge region only of the Schottky electrode for locally increasing the Schottky barrier of the Schottky electrode. A method of manufacturing such a semiconductor device is also disclosed.
摘要:
Disclosed is a method of manufacturing a bipolar transistor, the method comprising providing a semiconductor substrate (10) including a collector region(11); forming a base layer (30) on the semiconductor substrate; forming an etch protect layer (32, 34) on a portion of the base layer defining an emitter region; forming a base contact layer (35) over the etch protect layer and the base layer; forming an electrically insulating layer (60) over the base layer; etching an opening (70) in the resultant structure formed after the formation of the electrically insulating layer, said opening comprising an emitter window portion (72) exposing at least a part of the etch protect layer and a field plate trench portion (74) adjacent to the emitter window portion extending through the base layer, the base contact layer and into the collector region; lining said opening with an electrically insulating material (52, 54); exposing said emitter region; and filling the lined opening with an electrically conductive material. A bipolar transistor manufactured in accordance with this method and an IC including such a bipolar transistor are also disclosed.
摘要:
Disclosed is a semiconductor device comprising at least one active layer (14, 16) on a substrate (10) and a first contact (24, 26, 28) to the at least one active layer, the first contact comprising a metal in contact with the at least one active layer and a titanium tungsten nitride (TiW(N)) layer (30) on the metal. A method of manufacturing such a semiconductor device is also disclosed.
摘要:
Disclosed is a method of manufacturing a bipolar transistor, comprising providing a substrate (10) comprising a first isolation region (12) separated from a second isolation region by an active region (11) comprising a collector impurity; forming a layer stack over said substrate, said layer stack comprising a base layer (14, 14'), an etch protection portion (30, 32, 34) covering the base layer over the active region, a polysilicon layer (16) over said base layer and etch protection portion and an insulating layer (18) over the polysilicon layer; forming a emitter window (40) in said layer stack, said emitter window exposing at least part of said active region; oxidizing the exposed regions (16') of the polysilicon layer in the emitter window; removing the etch protection portion; forming sidewall spacers (22) in the base window; and filling the base window with an emitter material (24). A bipolar transistor manufactured in accordance with this method is also disclosed.