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    Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
    3.
    发明公开
    Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture 有权
    引线框架，气腔封装和带有偏置通气孔的电子设备及其制造方法

    公开(公告)号：EP2704192A3

    公开(公告)日：2017-06-14

    申请号：EP13179590.8

    申请日：2013-08-07

    申请人： NXP USA, Inc.

    发明人： Bowles, Philip H. ,  Hooper, Stephen R.

    IPC分类号： H01L23/495 ,  H01L23/498 ,  H01L23/10 ,  H01L23/04

    CPC分类号： H01L23/10 ,  H01L23/49548 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A leadframe (300, 700) (e.g., incorporated in a device package) includes a feature (310, 322, 710, 722) (e.g., a die pad or lead) with a vent hole (336, 736) formed between first and second opposed surfaces (410, 412). The cross-sectional area of the vent hole varies substantially between the surfaces (e.g., the vent hole has a constricted portion (460)). The vent hole may be formed from a first opening (420) extending from the first surface toward the second surface to a first depth (452) that is less than a thickness (450) of the leadframe feature, and a second opening (430) extending from the second surface toward the first surface to a second depth (454) that is less than the thickness of the leadframe feature, but that is large enough for the second opening to intersect the first opening. Vertical central axes (428, 429) of the openings are horizontally offset from each other, and the constricted portion of the vent hole corresponds to the intersection of the openings.

    摘要翻译： 引线框架（300,700）（例如，并入器件封装中）包括具有形成在第一和第二引线框之间的通气孔（336,736）的特征（310,322,710,722）（例如，管芯焊盘或引线） 第二相对表面（410,412）。 通气孔的横截面积在表面之间基本上变化（例如，通气孔具有收缩部分（460））。 通气孔可以由从第一表面朝向第二表面延伸到小于引线框架特征的厚度（450）的第一深度（452）的第一开口（420）和第二开口（430）形成， 从所述第二表面朝向所述第一表面延伸到小于所述引线框架特征的厚度但是足够大以使所述第二开口与所述第一开口相交的第二深度（454）。 开口的垂直中心轴线（428,429）彼此水平偏移，并且通风孔的收缩部分对应于开口的交点。