专利检索 ap:("Nashua Corporation") AND inv:"LOCHUN, Darren" 第 1 页

1.

发明公开
CIRCUIT ELEMENTS HAVING AN EMBEDDED CONDUCTIVE TRACE AND METHODS OF MANUFACTURE 审中-公开
标题翻译：根据上述制造嵌入导体和方法的电路元件

公开(公告)号：EP1397946A1

公开(公告)日：2004-03-17

申请号：EP02719412.5

申请日：2002-04-01

申请人： Nashua Corporation

发明人： LOCHUN, Darren , IRELAND, John, J.

IPC分类号： H05K3/22 , H05K3/38 , H05K1/03

CPC分类号： H05K3/246 , G08B13/244 , H01F5/003 , H01F41/041 , H01F2017/006 , H05K1/036 , H05K1/095 , H05K3/107 , H05K3/1258 , H05K3/245 , H05K3/38 , H05K2201/0129 , H05K2201/0347 , H05K2203/0278 , H05K2203/107 , H05K2203/1105 , Y10S428/901 , Y10T428/24917 , Y10T428/2982 , Y10T428/31645 , Y10T428/31721 , Y10T428/31786 , Y10T428/31855 , Y10T428/31909 , Y10T428/31928 , Y10T428/31931 , Y10T428/31935

摘要： Diclosed is a circuit element (200) that includes a thermoplastic substrate (210) and a conductive trace (220) at least partially embedded in the thermoplastic substrate (210). Also disclosed is a method of forming a circuit element (200). The method includes the steps of providing a thermoplastic substrate (210) having a softening temperature, printing a conductive ink onto the thermoplastic substrate to form a trace (220), and embedding the trace into the thermoplastic substrate (210) by heating the thermoplastic substrate (210) to a temperature above about the softening temperature about the trace (220).