公开(公告)号：EP2483595A1

公开(公告)日：2012-08-08

申请号：EP10785381.4

申请日：2010-11-17

Applicant: OSRAM AG

Inventor： KAMPFRATH, Andreas ,  STRAUSS, Steffen

IPC: F21S4/00 ,  H05K3/32

CPC classification number: H05K3/325 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/10401 ,  H05K2203/1189 ,  H01L2924/00

Abstract: The invention relates to a lighting device (1) comprising a printed circuit board (2), wherein the printed circuit board (2) comprises wiring on the front side (3) and/or back side (5) thereof, each wiring (7) being covered by at least one potting layer (8), the lighting device (1) further comprising at least one electrically conductive punched bushing (12) and the punched bushing (12) extending through a potting layer (8) at least to the wiring and contacting the wiring. The method serves for contacting a lighting device (1) comprising a printed circuit board (2), wherein the printed circuit board (2) comprises wiring on the front side (3) and/or back side (5) thereof, each wiring being covered by at least one potting layer (8), wherein the method comprises at least the following step of: pressing an electrically conductive punched bushing (12) through the potting layer (8) to the a wiring, such that the punched bushing (12) contacts the wiring.

公开(公告)号：EP2452116A1

公开(公告)日：2012-05-16

申请号：EP10723613.5

申请日：2010-06-16

Applicant: OSRAM AG

Inventor： PREUSCHL, Thomas ,  STRAUSS, Steffen ,  ZEUS, Florian

IPC: F21S4/00

CPC classification number: H05K3/284 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/2072

Abstract: The invention relates to a luminous device (1) comprising at least one flexible printed circuit board (3) that is populated with at least one semiconductor light source (2), wherein at least one populated side of the printed circuit board (3) is provided with a potting material (10) that leaves at least one radiation surface of the semiconductor light source (2) exposed, and wherein the semiconductor light source (2) is at least partially covered by an adhesive element (7) on the upper side, wherein the adhesive element (7) protrudes from the potting material (10), is surrounded on the side by the potting compound (10) in an adhesive manner and has better adhesion to the potting compound (10) than the semiconductor light source (2).

Abstract translation: 一种照明装置（1; 15），包括至少一个柔性印刷电路板（3），所述至少一个柔性印刷电路板（3）装有至少一个半导体光源，包括覆盖在所述印刷电路板的至少一个填充侧上的灌封材料，以便离开 半导体光源（2）的至少一个发射表面露出; 至少部分地覆盖所述半导体光源的顶侧的粘合元件，其中所述粘合元件（7）从所述封装化合物（10）部分突出，以粘合方式围绕所述封装化合物（10）封闭，并且 与半导体光源相比，对灌封化合物（10）具有更好的附着力。

公开(公告)号：EP2425176A1

公开(公告)日：2012-03-07

申请号：EP10720375.4

申请日：2010-04-29

Applicant: OSRAM AG

Inventor： KRAUS, Robert ,  PREUSCHL, Thomas ,  STRAUSS, Steffen ,  WELS, Birgit

IPC: F21S4/00 ,  F21V23/06 ,  F21Y101/02

CPC classification number: F21S4/003 ,  F21S4/20 ,  F21V23/06 ,  F21Y2115/10 ,  H01R13/717

Abstract: The invention relates to a lighting system, comprising at least one connection element (15), in particular a plug and/or clamping connection element (15), and at least one luminous band (1) having at least one band-shaped unit circuit board (2), wherein the unit circuit board (2) is equipped with at least two semi-conductor light sources (4), in particular light emitting diodes (4), and has at least one contact area (13) arranged between at least two semi-conductor light sources (4), wherein the contact area (13) is formed so that it can be severed, and the contact area (13) and the connection element (15) are designed such that after severing the contact area (13) the connection element (15) can be applied to the contact area (13), and at least one circuit can be closed on the unit circuit board (2) by applying the connection element (15) onto the contact area (13).

公开(公告)号：EP2494265A2

公开(公告)日：2012-09-05

申请号：EP10787725.0

申请日：2010-11-26

Applicant: OSRAM AG

Inventor： KAMPFRATH, Andreas ,  STRAUSS, Steffen

IPC: F21S4/00 ,  F21V23/06 ,  F21Y101/02

CPC classification number: F21S6/001 ,  F21S4/10 ,  F21V23/04 ,  F21V23/06 ,  F21V31/04 ,  F21Y2115/10 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/325 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2203/0195 ,  H05K2203/1322 ,  Y10T29/49105 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49798

Abstract: The invention relates to a method serving to bond a lighting device, wherein the lighting device has a circuit board which is covered by a sealing compound layer and can be separated at a separating point into two lighting device sections and each of the lighting device sections each has at least one electrical contact adjacent to the separating point; wherein the method comprises at least the following steps: removing of at least the sealing compound layer on both sides of the separating point beyond the adjacent contacts of the lighting device sections so that the contacts remain covered by a thinner, remaining sealing compound layer; separating the lighting device on the separating point; fastening a connection element at least on the remaining sealing compound layer of at least one of the lighting device sections, wherein the connection element has at least one contacting element, which contacts a respective contact covered by the remaining sealing compound layer after separation or breaking through the remaining sealing compound layer. The tool according to the invention is a pair of cutting pliers having a vertical double cutting edge and a horizontally movable cutting edge. The connection element has at least one contacting element for separating or breaking through a remaining sealing compound layer of the lighting device.

Abstract translation: 提供了一种用于接触的照明装置的方法，worin所述照明装置具有一电路板，其全部由密封化合物层覆盖至少部分; worin照明装置可以在一个分离点被分离成两个部分的照明装置，并且每个所述的照明装置部分的具有至少一个电接触。 该方法可以包括：至少在所述分离点的bothsides除去密封化合物层所以没有接触保持由较薄的，其余密封化合物层覆盖; 分离在分离点的照明装置; 附着至少一个连接元件的照明装置的部分中的至少一个的其余密封化合物层，worin连接元件具有至少一个接触元件，其中接触respectivement接触的分离或渗透后通过其余密封化合物层覆盖 的其余密封化合物层。

公开(公告)号：EP2435755A1

公开(公告)日：2012-04-04

申请号：EP10721762.2

申请日：2010-05-11

Applicant: OSRAM AG

Inventor： BERTRAM, Ralph ,  FROST, Tobias ,  HERBOLD, Christian ,  STRAUSS, Steffen

IPC: F21S4/00

CPC classification number: F21V29/70 ,  F21S4/20 ,  F21V3/061 ,  F21V3/062 ,  F21V7/005 ,  F21V7/22 ,  F21V23/02 ,  F21V29/004 ,  F21V29/20 ,  F21V29/506 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/0999 ,  H05K2201/10106

Abstract: The invention relates to an illumination module (2) having at least one flexible, particularly ribbon-shaped, carrier (4) for several heat sources, including light sources (6), wherein the carrier is intended to be bent across at least part of its width. The illumination device is provided with a curved base (9) and at least one illumination module, wherein the illumination module is flatly attached to the base with its widthwise curved part, at least sectionally.

Abstract translation: 照明模块可以包括用于多个热源的至少一个柔性载体，包括光源，其中所述载体设置成在其宽度的至少一部分上弯曲。