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公开(公告)号：EP3351852B1
公开(公告)日：2019-10-30
申请号：EP18152940.5
申请日：2018-01-23
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公开(公告)号：EP3351852A1
公开(公告)日：2018-07-25
申请号：EP18152940.5
申请日：2018-01-23
摘要： A lighting device (10) includes:
- an elongated laminar substrate (12) having opposed front and back surfaces,
- one or more electrically-powered light radiation sources (14), e.g. LED sources, at the front surface of the substrate (12),
- a protective encapsulation (160, 162a, 162b, 20) sealingly encapsulating the substrate (12) and the light radiation source(s) (14), the encapsulation being light-permeable to facilitate propagation of light radiation from the device.
The encapsulation includes thermally-conductive material (20) at the back surface of the substrate (12) .-
公开(公告)号：EP3357661A1
公开(公告)日：2018-08-08
申请号：EP18153393.6
申请日：2018-01-25
CPC分类号： F21V15/01 , B29C33/36 , B29C33/40 , B29C35/10 , B29C39/006 , B29C39/142 , B29C39/24 , B29C39/38 , B29C41/28 , B29C41/32 , B29C41/36 , B29C41/44 , B29C41/46 , B29C2035/0827 , B29K2083/005 , B29K2995/0026 , B29K2995/003 , B29L2011/00 , B29L2031/747
摘要： A method of manufacturing housings (12) of lighting devices, comprising:
- providing a profiled mold (16) having a molding seat (20),
- dispensing curable liquid material (21) into said molding seat (20),
- curing said curable liquid material (21) in said profiled mold (16) so as to form an elongated housing (12), and
- extracting said elongated housing (12) from said profiled mold (16).
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