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1.发明公开
公开(公告)号：EP4255157A1
公开(公告)日：2023-10-04
申请号：EP23160329.1
申请日：2023-03-07
发明人： FURUTA, Hironori , KOSAKA, Toru , SUZUKI, Takahito , TANIGAWA, Kenichi , ISHIKAWA, Takuma , KITAJIMA, Yutaka , KONISHI, Akio , KANAMORI, Hiroaki , IIZUKA, Takeshi
IPC分类号： H10N30/076 , B06B1/06 , H10N30/00 , H10N30/853 , H10N30/87
摘要： An object is to increase the performance of a piezoelectric film integrated device by providing two or more types of monocrystalline piezoelectric films on the same substrate. A piezoelectric film integrated device includes a substrate (33), a first electrode (34a) provided on the substrate (33), a second electrode (34b) provided on the substrate (33), a monocrystalline PZT film as a first monocrystalline piezoelectric film (15) provided on the first electrode (34a), a monocrystalline AlN film as a second monocrystalline piezoelectric film (25) provided on the second electrode (34b) and having a crystal structure different from a crystal structure of the first monocrystalline piezoelectric film (15), a third electrode (16) provided on the first monocrystalline piezoelectric film (15), and a fourth electrode (26) provided on the second monocrystalline piezoelectric film (25) .
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2.发明公开
公开(公告)号：EP4255158A1
公开(公告)日：2023-10-04
申请号：EP23160335.8
申请日：2023-03-07
发明人： FURUTA, Hironori , KOSAKA, Toru , SUZUKI, Takahito , TANIGAWA, Kenichi , ISHIKAWA, Takuma , KITAJIMA, Yutaka , KONISHI, Akio , KANAMORI, Hiroaki , IIZUKA, Takeshi
IPC分类号： H10N30/076 , B06B1/06 , H10N30/00 , H10N30/853 , H10N30/87
摘要： An object is to increase the performance of a piezoelectric film integrated device by providing two or more types of monocrystalline piezoelectric films on the same substrate. A piezoelectric film integrated device (100)-includes a substrate (33), an electrode (34) that is provided on the substrate (33), a first piezoelectric element that is provided on the electrode (34) and includes a first monocrystalline piezoelectric film (25 or 15) and a first electrode film (26 or 16) superimposed on the first monocrystalline piezoelectric film (25 or 15), and a second piezoelectric element that is provided on the first piezoelectric element and includes a second monocrystalline piezoelectric film (15 or 25) and a second electrode film (16 or 26) superimposed on the second monocrystalline piezoelectric film (15 or 25).
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公开(公告)号：EP4439644A1
公开(公告)日：2024-10-02
申请号：EP24153031.0
申请日：2024-01-22
发明人： FURUTA, Hironori , KOSAKA, Toru , IDA, Takahiro , ISHIKAWA, Takuma , TANIGAWA, Kenichi , SUZUKI, Takahito , KITAJIMA, Yutaka
IPC分类号： H01L21/78
CPC分类号： H01L21/7813
摘要： A manufacturing method of a substrate unit includes forming a semiconductor laminated body (110, 210) on a substrate (101, 201), forming a sacrificial layer (105, 205) on the semiconductor laminated body (110, 210), forming a semiconductor functional layer (120, 220) on the sacrificial layer (105, 205), and forming a protective film (109, 209) that covers at least a back surface (101b, 201b) of the substrate (101, 201) different from a formation surface (101a, 201a) on which the semiconductor laminated body (110, 210) is formed, a side face (101c, 201c) of the substrate (101, 201), and a side face (110c, 210c) of the semiconductor laminated body (110, 210).
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4.发明公开
公开(公告)号：EP4362066A1
公开(公告)日：2024-05-01
申请号：EP23189698.6
申请日：2023-08-04
发明人： JUMONJI, Shinya , KOSAKA, Toru , SUZUKI, Takahito , TANIGAWA, Kenichi , NAKAI, Yusuke , KAWADA, Hiroto , MATSUO, Genichirou , KITAJIMA, Yutaka
IPC分类号： H01L21/02 , H01L21/306
CPC分类号： H01L21/02002 , H01L21/30625 , H01L33/0095 , H01L21/7806
摘要： A manufacturing method of a semiconductor element includes forming a plurality of semiconductor layers (12) on a sapphire substrate (11), each of the semiconductor layers (12) having a first surface (12s) on the sapphire substrate (11) side and a second surface (12t) on the opposite side, joining the second surfaces (12t) of the plurality of semiconductor layers (12) to a retention member (15) via an adhesive member (14), peeling off the plurality of semiconductor layers (12) from the sapphire substrate (11) by irradiating the first surfaces (12s) of the plurality of semiconductor layers (12) with laser light, and polishing the first surfaces (12s) of the plurality of semiconductor layers (12). At least one semiconductor layer (12) among the plurality of semiconductor layers (12) includes a polishing indication part (12h) extending from the second surface (12t) toward the first surface (12s). The polishing is executed until the polishing indication part (12h) is exposed to the polished surface.
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5.发明公开
公开(公告)号：EP4439643A1
公开(公告)日：2024-10-02
申请号：EP24152520.3
申请日：2024-01-18
发明人： KAWADA, Hiroto , ISHIKAWA, Takuma , FURUTA, Hironori , SUZUKI, Takahito , TANIGAWA, Kenichi , NAKAI, Yusuke , KITAJIMA, Yutaka
IPC分类号： H01L21/78 , H01L21/683 , H01L33/00 , H01L21/67
CPC分类号： H01L21/7806 , H01L21/6835 , H01L33/0093 , H01L31/00
摘要： A manufacturing method of an electronic structure (1) includes a step of forming a second sacrificial layer (13) extending from a substrate (10) to a function part (12) of a layered substrate including the substrate (10), a first sacrificial layer (11) formed on the substrate (10), and the function part (12) formed on the first sacrificial layer (11). The manufacturing method includes a step of forming a cover layer (14) extending from the substrate (10) to the second sacrificial layer (13), and a step of removing the first sacrificial layer (11) and the second sacrificial layer (13).
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公开(公告)号：EP4184598A1
公开(公告)日：2023-05-24
申请号：EP22205972.7
申请日：2022-11-08
发明人： FURUTA, Hironori , MATSUO, Genichirou , IINO, Akihiro , SUZUKI, Takahito , TANIGAWA, Kenichi , NAKAI, Yusuke , JUMONJI, Shinya , SHINOHARA, Yuuki
摘要： An electronic structure (1, 201, 301) includes a substrate (10) having a first surface (10A); a functional unit (2, 202, 302) including a functional section (13, 16, 14) that has an electronic function and a protective member (12, 17, 217) that protects the functional section (13, 16, 14) and having a second surface (2B) formed on the first surface (10A)'s side; and a support layer (11, 211, 311) provided at a position to contact the first surface (10A) and having a third surface (11A) in contact with the second surface (2B) of the functional unit (2), area of the third surface (11A) being smaller than area of the second surface (2B), wherein one of part of the functional unit (2, 202, 302) forming the second surface (2B) of the protective member (12, 17, 217) and part of the support layer (11, 211, 311) forming the third surface (11A) contains organic material as its principal component and the other contains inorganic material as its principal component.
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公开(公告)号：EP4255160A1
公开(公告)日：2023-10-04
申请号：EP23160680.7
申请日：2023-03-08
发明人： FURUTA, Hironori , KOSAKA, Toru , SUZUKI, Takahito , TANIGAWA, Kenichi , ISHIKAWA, Takuma , KITAJIMA, Yutaka
摘要： A piezoelectric-body film joint substrate (100) includes a substrate (33), a substrate electrode (34) provided on the substrate (33), a first piezoelectric-body film (27) stuck on the substrate electrode (34) and including a first piezoelectric film (25) and a first upper electrode film (26) formed on the first piezoelectric film (25), and a second piezoelectric-body film (17) stuck on the first upper electrode film (26) and including a second piezoelectric film (15) different from the first piezoelectric film (25) and a second upper electrode film (16) formed on the second piezoelectric film (15).
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公开(公告)号：EP4255159A1
公开(公告)日：2023-10-04
申请号：EP23161265.6
申请日：2023-03-10
发明人： FURUTA, Hironori , KOSAKA, Toru , SUZUKI, Takahito , TANIGAWA, Kenichi , ISHIKAWA, Takuma , KITAJIMA, Yutaka
IPC分类号： H10N30/076 , B06B1/06 , H10N30/00 , H10N30/853 , H10N30/87
摘要： A piezoelectric-body film joint substrate (100) includes a substrate (33); a first electrode (34a), a first piezoelectric-body film (17) stuck on the first electrode (34a) and including a first piezoelectric film (15) and a first upper electrode film (16) formed on the first piezoelectric film (15), a second electrode (34b), and a second piezoelectric-body film (27) stuck on the second electrode (34b) and including a second piezoelectric film (25) different from the first piezoelectric film (15) and a second upper electrode film (26) formed on the second piezoelectric film (25). A height from an upper surface of the substrate (33), on which the first electrode (34a) and the second electrode (34b) are formed, to a top of the first upper electrode film (16) and a height from the upper surface of the substrate (33) to a top of the second upper electrode film (26) differ from each other.
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9.发明公开
公开(公告)号：EP4002500A1
公开(公告)日：2022-05-25
申请号：EP21203338.5
申请日：2021-10-19
发明人： ISHIKAWA, Takuma , SUZUKI, Takahito , TANIGAWA, Kenichi , FURUTA, Hironori , KOSAKA, Toru , NAKAI, Yusuke , JYUMONJI, Shinya , MATSUO, Genichiro , TAKAHASHI, Chihiro , KAWADA, Hiroto , SHINOHARA, Yuuki
IPC分类号： H01L33/62 , H01L25/075
摘要： A composite integrated film (1) includes a base member thin film (2) having a base member first surface (2A) and a base member second surface (2B) facing each other, one or more penetration parts (2V, 2V1 - 2V4) penetrating the base member first surface (2A) and the base member second surface (2B) of the base member thin film (2), one or more electrodes (20 - 23) each including an electrical path part formed between the base member first surface (2A) and the base member second surface (2B) via the penetration part (2V, 2V1 - 2V4) and an electrode surface (20B - 24B) in a planar shape formed on the base member second surface's side, and one or more elements (10 - 13) provided on the base member first surface (2A) of the base member thin film (2) and electrically connected to the electrodes (20 - 23), wherein the electrode surface (20B - 24B) and the base member second surface (2B) form a same flat surface.
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10.发明公开
公开(公告)号：EP3945574A1
公开(公告)日：2022-02-02
申请号：EP21185754.5
申请日：2021-07-15
发明人： FURUTA, Hironori , SUZUKI, Takahito , TANIGAWA, Kenichi , NAKAI, Yusuke , JUMONJI, Shinya , MATSUO, Genichiro , ISHIKAWA, Takuma , KAWADA, Hiroto
IPC分类号： H01L25/075 , H01L33/62
摘要： Provided are a light emitting device, a light emitting element film and a light emitting display to which failure is unlikely to occur, and a method of manufacturing a light emitting device that is unlikely to cause failure to the light emitting device. A light emitting device (100) includes a substrate (110) including electrodes (111, 112), a film member (130), light emitting elements (140) arranged on the film member, and conductive members (151, 152) that electrically connect the light emitting elements and the electrodes to each other. The film member has through holes (131, 132) formed at positions corresponding to the electrodes. The conductive member includes a first conductive part (151a, 152a) extending from the light emitting element (140) to the through hole (131, 132) and a second conductive part (151b, 152b) connecting the first conductive part and the electrode to each other via the through hole.
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