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公开(公告)号:EP3344147B1
公开(公告)日:2023-11-01
申请号:EP16843099.9
申请日:2016-09-02
发明人: LI, Wei , FREY, Gregg , HSU, Simon
IPC分类号: B06B1/06 , A61B8/00 , H10N30/088 , H10N30/072 , H10N30/20
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2.
公开(公告)号:EP3849081B1
公开(公告)日:2023-08-16
申请号:EP19857980.7
申请日:2019-09-06
IPC分类号: H10N30/072 , H03H9/02 , H03H9/25 , H03H3/08
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公开(公告)号:EP4219026A1
公开(公告)日:2023-08-02
申请号:EP23163129.2
申请日:2016-09-02
发明人: LI,, Wei , FREY,, Gregg , HSU,, Simon
IPC分类号: B06B1/06 , A61B8/00 , H10N30/072 , H10N30/088 , H10N30/20
摘要: Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.
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公开(公告)号:EP3525347B1
公开(公告)日:2024-08-07
申请号:EP17858489.2
申请日:2017-10-05
IPC分类号: H10N30/072 , H10N30/073 , H10N30/04 , H03H3/08 , H03H9/02
CPC分类号: H03H3/08 , C30B29/22 , C30B31/22 , C30B33/06 , H03H9/02574 , H03H9/02559 , H10N30/04 , H10N30/072 , H10N30/073
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公开(公告)号:EP4255160A1
公开(公告)日:2023-10-04
申请号:EP23160680.7
申请日:2023-03-08
发明人: FURUTA, Hironori , KOSAKA, Toru , SUZUKI, Takahito , TANIGAWA, Kenichi , ISHIKAWA, Takuma , KITAJIMA, Yutaka
摘要: A piezoelectric-body film joint substrate (100) includes a substrate (33), a substrate electrode (34) provided on the substrate (33), a first piezoelectric-body film (27) stuck on the substrate electrode (34) and including a first piezoelectric film (25) and a first upper electrode film (26) formed on the first piezoelectric film (25), and a second piezoelectric-body film (17) stuck on the first upper electrode film (26) and including a second piezoelectric film (15) different from the first piezoelectric film (25) and a second upper electrode film (16) formed on the second piezoelectric film (15).
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公开(公告)号:EP3900064B1
公开(公告)日:2023-05-03
申请号:EP19842811.2
申请日:2019-12-12
发明人: GHYSELEN, Bruno
IPC分类号: H10N30/072
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公开(公告)号:EP4461108A1
公开(公告)日:2024-11-13
申请号:EP23700072.4
申请日:2023-01-05
申请人: SOITEC
IPC分类号: H10N30/01 , H10N30/071 , H10N30/072 , H10N30/073 , H10N30/074 , H10N30/853
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公开(公告)号:EP4399738A1
公开(公告)日:2024-07-17
申请号:EP22765845.7
申请日:2022-08-17
申请人: SOITEC
IPC分类号: H01L21/18 , H01L21/762 , H10N30/072 , H01L21/02
CPC分类号: H01L21/185 , H01L21/76254 , H01L21/02002 , H10N30/072
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公开(公告)号:EP3731259B1
公开(公告)日:2024-05-08
申请号:EP18923149.1
申请日:2018-06-21
IPC分类号: H01L21/02 , H10N30/072
CPC分类号: H01L21/02002 , H10N30/072
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10.
公开(公告)号:EP3985869B1
公开(公告)日:2024-11-06
申请号:EP20821583.0
申请日:2020-02-18
发明人: HORI, Yuji , YAMADERA, Takahiro
IPC分类号: H03H3/08 , H03H9/25 , H03H9/02 , H10N30/072 , H10N30/086 , H10N30/853
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