公开(公告)号：EP3220492A1

公开(公告)日：2017-09-20

申请号：EP17151401.1

申请日：2017-01-13

Applicant: Omron Corporation

Inventor： FUKUI, Hiroshi ,  YOKOI, Tadamasa ,  OGAKI, Tatsuo ,  TANI, Shuichi ,  SAKAMOTO, Tatsunori ,  ISHIZU, Yuichi

IPC: H01S3/13 ,  H01S3/067

CPC classification number: H01S3/067 ,  H01S3/0064 ,  H01S3/06758 ,  H01S3/06779 ,  H01S3/094003 ,  H01S3/09415 ,  H01S3/10007 ,  H01S3/10038 ,  H01S3/10046 ,  H01S3/1618

Abstract: A light amplifier according to an aspect of the present invention includes: a seed light source (2) configured to generate a pulsing seed light; an excitation light source (3, 7) configured to generate excitation light; a light amplifying fiber (1, 9) configured to amplify the seed light by the excitation light and output the amplified light; and a control unit (20) configured to control the seed light source (2) and the excitation light source (3, 7). The control unit (20) has a mode to control the excitation light's power such that as a set value of a pulse width of the amplified light increases, the amplified light's peak energy increases within a threshold value at a minimum set value of the pulse width.

Abstract translation: 根据本发明的一个方面的光放大器包括：种子光源（2），被配置为生成脉冲种子光; 激励光源（3,7），其被配置为产生激励光; 光放大光纤（1,9），被配置为通过激发光放大种子光并输出放大的光; 和控制单元（20），其被配置为控制种子光源（2）和激发光源（3,7）。 控制单元（20）具有控制激发光的功率的模式，使得随着放大光的脉冲宽度的设定值增加，放大的光的峰值能量在阈值内以脉冲宽度的最小设定值 。

公开(公告)号：EP3922399A2

公开(公告)日：2021-12-15

申请号：EP21176596.1

申请日：2021-05-28

Applicant: OMRON Corporation

Inventor： YOSHITAKE, Naoki ,  ASHIHARA, Yoshimitsu ,  SAKAMOTO, Tatsunori ,  TSUCHIMICHI, Kazumi ,  YOKOI, Tadamasa

IPC: B23K26/361

Abstract: A laser processing apparatus (1, 1B) comprises: an exposure unit (26, 26B) adapted to expose a workpiece (8) to a laser beam (W); a reception unit (216) adapted to receive a processing pattern and a condition for exposure to the laser beam (W); and a control unit (211) adapted to control exposure to the laser beam (W). After the workpiece (8) is processed based on the processing pattern, the control unit (211) subjects the workpiece (8) to deburring in a processing pattern identical to that applied in processing the workpiece (8), with the laser beam (W) focused to a position shifted from a processed surface of the workpiece (8).

公开(公告)号：EP3219430A1

公开(公告)日：2017-09-20

申请号：EP17150190.1

申请日：2017-01-03

Applicant: Omron Corporation

Inventor： FUKUI, Hiroshi ,  FUTAGAMI, Yoshihiro ,  MINATOGUCHI, Shinya ,  ASHIHARA, Yoshimitsu ,  SAKAMOTO, Tatsunori

IPC: B23K26/03 ,  B23K26/362 ,  B23K26/38 ,  B23K26/382 ,  B23K26/042 ,  B23K26/082 ,  B23K101/00

CPC classification number: B23K26/032 ,  B23K26/042 ,  B23K26/082 ,  B23K26/36 ,  B23K26/362 ,  B23K26/38 ,  B23K26/382 ,  B23K2201/007

Abstract: A laser marker (2) has: a controller (21) having an oscillator (240) configured to oscillate a laser beam (L); and a head (26) configured to scan a machining surface of a machining target (8) with the laser light (L) based on control of the controller (21). The controller (21) is configured to transmit, to the image processing apparatus (3), a command for instructing the image processing apparatus (3) to perform a predetermined scene, when the controller (21) is set to cause the image processing apparatus (3) to perform the scene. When the command is received, the image processing apparatus (3) is configured to calculate a deviation amount of the machining target (8) relative to a reference position (P) using image data of an image of the machining target (8) captured by the marker head (26) and to notify the deviation amount to the controller (21). The controller (21) is configured to correct a position to be scanned with the laser beam (L) based on the deviation amount and then cause the marker head (26) to perform the scanning.

Abstract translation: 激光打标机（2）具有：具有振荡器（240）的控制器（21），所述振荡器被构造成使激光束（L）振荡; 以及基于所述控制器（21）的控制，利用所述激光（L）扫描加工对象物（8）的加工面的头部（26）。 控制部（21）构成为，在将控制部（21）设定为使图像处理装置（3）执行图像处理装置（3）的指示图像处理装置 （3）执行现场。 在接收到指令的情况下，图像处理装置（3）构成为，使用由图像处理装置（3）拍摄的加工对象物（8）的图像的图像数据，计算加工对象物（8）相对于基准位置（P）的偏移量 标记头（26）并将偏差量通知给控制器（21）。 控制器（21）被配置为基于偏差量校正利用激光束（L）扫描的位置，然后使标记头（26）执行扫描。

公开(公告)号：EP3922399A3

公开(公告)日：2021-12-29

申请号：EP21176596.1

申请日：2021-05-28

Applicant: OMRON Corporation

Inventor： YOSHITAKE, Naoki ,  ASHIHARA, Yoshimitsu ,  SAKAMOTO, Tatsunori ,  TSUCHIMICHI, Kazumi ,  YOKOI, Tadamasa

IPC: B23K26/361 ,  B23K26/354 ,  B23K26/352 ,  B23K26/082 ,  B23K26/362 ,  B23K26/40

Abstract: A laser processing apparatus (1, 1B) comprises: an exposure unit (26, 26B) adapted to expose a workpiece (8) to a laser beam (W); a reception unit (216) adapted to receive a processing pattern and a condition for exposure to the laser beam (W); and a control unit (211) adapted to control exposure to the laser beam (W). After the workpiece (8) is processed based on the processing pattern, the control unit (211) subjects the workpiece (8) to deburring in a processing pattern identical to that applied in processing the workpiece (8), with the laser beam (W) focused to a position shifted from a processed surface of the workpiece (8).