公开(公告)号：EP1814371A1

公开(公告)日：2007-08-01

申请号：EP07250254.5

申请日：2007-01-22

Applicant: Pace Micro Technology PLC

Inventor： Skow, Paul ,  Belford, James William ,  McGonigal, Colin

IPC: H05K3/34 ,  H01L23/488 ,  H01L23/367

CPC classification number: H05K3/341 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K1/0268 ,  H05K1/111 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/10969 ,  H05K2203/162 ,  Y02P70/613

Abstract: A printed circuit board (PCB) is provided. The PCB has at least a first surface and a second surface. One or more pre-defined areas defined on the first surface comprise a PCB plane (8) for the location of one or more electrical components thereon. One or more test pads (18) provided on the second surface allow electrical testing of the solder connection between said PCB and/or one or more electrical components. Two or more connectivity points (10) are provided on the first surface in each of said pre-defined areas. The connectivity points are a spaced distance apart and are substantially electrically isolated from each other before soldering. The connectivity points are capable of electrical connection in case of sufficient solder being present between the PCB and the electrical component.

Abstract translation: 提供印刷电路板（PCB）。 PCB至少具有第一表面和第二表面。 限定在第一表面上的一个或多个预定义区域包括用于在其上定位一个或多个电气部件的PCB平面（8）。 设置在第二表面上的一个或多个测试焊盘（18）允许对所述PCB和/或一个或多个电气部件之间的焊料连接进行电气测试。 在每个所述预定义区域中的第一表面上提供两个或多个连接点（10）。 连接点是间隔开的距离，并且在焊接之前基本上彼此电隔离。 在PCB和电气部件之间存在足够的焊料的情况下，连接点能够电连接。