公开(公告)号：EP3031308A1

公开(公告)日：2016-06-15

申请号：EP14747950.5

申请日：2014-08-07

Applicant: Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg

Inventor： EHRMANN, Steffen ,  ZICK, Stefan

IPC: H05K1/11

CPC classification number: H05K1/181 ,  H03K17/567 ,  H03K17/687 ,  H05K1/021 ,  H05K1/111 ,  H05K1/119 ,  H05K3/202 ,  H05K3/3452 ,  H05K2201/066 ,  H05K2201/09118 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  Y02P70/611

Abstract: The present invention relates to a circuit board assembly, comprising a circuit board which has a first and a second solder region, which is galvanically separated from the first, and which furthermore has a separator arranged between the solder regions and rising out from the solder regions, having a power semiconductor component which has a housing having an output connection side, from which at least one control connection and a plurality of output connections protrude, which are arranged substantially adjacent to each other on the output connection side, wherein the control connection is electrically and mechanically connected to the first solder region and the output connections are electrically and mechanically connected to the second solder region and the control connection is separated from the output connections via the raised separator. The present invention furthermore relates to a control device for a cooler fan module of a motor vehicle and to a method for assembling a power semiconductor component on a circuit board.

公开(公告)号：EP2849544A1

公开(公告)日：2015-03-18

申请号：EP14178499.1

申请日：2014-07-25

Applicant: Alps Electric Co., Ltd.

Inventor： Okano, Shinichiro

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K1/0209 ,  H05K2201/10969

Abstract: An electronic circuit module (100) includes a wiring board (2), an electronic component (1) which is mounted on the wiring board (2), a conductor pattern (3) for heat dissipation which is provided in the wiring board (2), a plurality of through holes (4) for heat dissipation which are provided in the wiring board (2) and are connected to the conductor pattern (3) for heat dissipation, and a heat generation member (1b) which is provided in the electronic component (1). The plurality of through holes (4) for heat dissipation are formed only on a circumference of one virtual circle (C1) surrounding a center point (P1) of the heat generation member (1b).

Abstract translation: 电子电路模块（100）包括布线板（2），安装在布线板（2）上的电子部件（1），设置在布线板（2）中的用于散热的导体图案 ），设置在所述布线基板（2）上并与所述导体图案（3）连接以散热的多个用于散热的通孔（4），以及设置在所述导线图案 电子元件（1）。 多个用于散热的通孔（4）仅形成在围绕发热构件（1b）的中心点（P1）的一个假想圆（C1）的圆周上。

公开(公告)号：EP2628176A4

公开(公告)日：2014-04-09

申请号：EP11832720

申请日：2011-10-10

Applicant: LG INNOTEK CO LTD

Inventor： PARK HYUN GYU ,  CHO IN HEE ,  AN YUN HO ,  PARK JAE MAN ,  KIM EUN JIN ,  KIM HAE YEON ,  LEE HYUK SOO

IPC: H01L23/34 ,  H01L33/64 ,  H05K1/02 ,  H05K3/00 ,  H05K7/20

CPC classification number: H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

公开(公告)号：EP2385402A3

公开(公告)日：2014-04-02

申请号：EP11164694.9

申请日：2011-05-04

Applicant: Funai Electric Co., Ltd.

Inventor： Tajiri, Tomohisa ,  Suzuki, Yuto

IPC: G02B6/00 ,  G02F1/13357 ,  H05K1/00 ,  F21K99/00 ,  F21V29/00 ,  F21V8/00 ,  H05K3/00 ,  H05K1/18 ,  F21Y101/02

CPC classification number: F21V29/004 ,  F21V29/70 ,  F21Y2115/10 ,  G02B6/0085 ,  G02B6/009 ,  G02F1/133603 ,  G02F2001/133628 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10969 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A light source structure includes a light-emitting diode (20), an optical component (90), a frame (40) and a mounting substrate (10). The light-emitting diode emits light. The frame has an inside face (45) defining an inside area and outside face (43) with an attachment opening (42) extending between the inside and outside faces. The light-emitting diode (20) is disposed in the attachment opening (42) to emit the light toward the inside area of the frame. The frame (40) houses the optical component (90) in the inside area of the frame. The mounting substrate (10) has a base member (11), a copper layer (12) that is laminated on the base member, and a resist film (13) that is laminated on the copper layer. The resist film has a first aperture with the light-emitting diode extending through the first aperture such that the light-emitting diode is electrically coupled to and mounted on the copper layer. The mounting substrate is disposed on the outside face of the frame.

公开(公告)号：EP2515622A2

公开(公告)日：2012-10-24

申请号：EP12163689.8

申请日：2012-04-11

Applicant: LG Innotek Co., Ltd.

Inventor： Lee, Sangwoo ,  Park, Dongwook ,  Jin, Hongboem

IPC: H05K1/02 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L25/075 ,  H01L24/73 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H05K1/0209 ,  H05K1/11 ,  H05K1/181 ,  H05K3/32 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

Abstract: Disclosed is a light emitting device array. The light emitting device array comprises a light emitting device and a body comprises first and second lead frames electrically connected to the light emitting device and a substrate on which the light emitting device package is disposed, the substrate comprises a base layer and a metal layer disposed on the base layer and electrically connected to the light emitting device package, wherein the metal layer comprises first and second electrode patterns electrically connected to the first and second lead frames and a heat dissipation pattern insulated from at least one of the first or(and) second electrode patterns, absorbing heat generated from at least one of the base layer or(and) the light emitting device package and then dissipating the heat.

Abstract translation: 公开了一种发光器件阵列。 发光器件阵列包括发光器件，并且本体包括电连接到发光器件的第一引线框架和第二引线框架以及设置有发光器件封装的衬底，衬底包括基底层和设置的金属层 在所述基底层上并电连接到所述发光器件封装，其中所述金属层包括电连接到所述第一引线框架和所述第二引线框架的第一和第二电极图案以及与所述第一或第二引线框架中的至少一个绝缘的散热图案， 第二电极图案，吸收从基底层或（和）发光器件封装中的至少一个产生的热量，然后散热。

公开(公告)号：EP2136610A4

公开(公告)日：2011-07-13

申请号：EP08722297

申请日：2008-03-17

Applicant: IBIDEN CO LTD

Inventor： ITO SOTARO ,  TAKAHASHI MICHIMASA ,  MIKADO YUKINOBU

IPC: H05K3/46

CPC classification number: H05K1/185 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82045 ,  H01L2224/83385 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/0218 ,  H05K2201/0723 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/09709 ,  H05K2201/10969 ,  Y10T29/4913 ,  H01L2924/00

Abstract: The objective of the present invention is to provide a multilayer printed wiring board in which malfunctions occurring in electronic components caused by electromagnetic-wave interference are prevented and high-density mounting of electronic components is attained. Especially, it is intended to protect other electronic components in the substrate from electromagnetic-wave interference generated in some circuits in the substrate. Multilayer wiring board (1) is structured with a multilayer wiring substrate in which conductive circuits (2) and insulation layers (11a, 11b, 12, 13, 14, 15) are formed and conductive circuits (2) separated by insulation layers (11a, 11b, 12, 13, 14, 15) are electrically connected to each other through vias (3); concave parts (21, 22) formed in insulation layers (11a, 11b, 12, 13, 14, 15); electromagnetic shielding layers (31, 32, 4 1 a, 41b, 42) formed on the bottom surface and at least on one side surface of concave parts (21, 22) and having a roughened surface; and electronic components (4A, 4B) accommodated in concave parts (21, 22).

Abstract translation: 本发明的目的是提供一种多层印刷线路板，其中防止由电磁波干扰引起的电子部件中发生的故障，并实现电子部件的高密度安装。 特别地，旨在保护基板中的其它电子部件免受在基板中的一些电路中产生的电磁波干扰。 多层布线板（1）由形成有导体电路（2）和绝缘层（11a，11b，12,13,14,15）的多层布线基板构成，导电电路（2）由绝缘层（11a ，11b，12,13,14,15）通过通孔（3）彼此电连接; 形成在绝缘层（11a，11b，12,13,14,15）中的凹部（21,22） 形成在凹部（21,22）的底面和至少一个侧面上并具有粗糙面的电磁屏蔽层（31,32,31a，41b，42） 以及容纳在凹部（21,22）中的电子部件（4A，4B）。

公开(公告)号：EP1671524A4

公开(公告)日：2009-08-05

申请号：EP04784579

申请日：2004-09-17

Applicant: MOTOROLA INC

Inventor： WALDVOGEL JOHN M ,  BIELICK BRIAN R ,  MILLER HERMAN J ,  VAN CANNON BILLY J

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40

CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/042 ,  H05K2203/063

Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

公开(公告)号：EP1827062A2

公开(公告)日：2007-08-29

申请号：EP07002932.7

申请日：2007-02-12

Applicant: DENSO CORPORATION

Inventor： Ito, Atsushi ,  Honda, Takayoshi

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/114 ,  H05K3/341 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/09709 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: In an electronic device , a QFN is surface-mounted on a printed board . The QFN includes a main body containing an IC chip , a reinforcement portion , and multiple terminal portions . The reinforcement portion is exposed from a bottom portion of the main body and mechanically coupled with multiple reinforcement lands on the printed board. The multiple terminal portions are exposed from a peripheral of the main body and electrically coupled with multiple lands on the printed board. In the printed board, the multiple lands are connected with multiple conductive wires Some of the multiple conductive wires are outside of the surface-mounted area . The others are inside of the surface-mounted area to face the reinforcement lands. This enhances a mounting efficiency in the printed board.

Abstract translation: 在电子设备中，QFN表面安装在印刷电路板上。 QFN包括包含IC芯片的主体，加强部分和多个端子部分。 加强部分从主体的底部暴露并且与印刷板上的多个加强焊盘机械耦合。 多个端子部分从主体的外围暴露并且与印刷板上的多个焊盘电耦合。 在印刷电路板中，多个连接盘与多个导电线连接。多个导电线中的一些在表面安装区域外。 其他人在表面安装区域内面对加固地。 这提高了印刷电路板的安装效率。

公开(公告)号：EP0982798B1

公开(公告)日：2007-05-30

申请号：EP99115696.9

申请日：1999-08-09

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kurita, Junichi ,  Yuasa, Atsuyuki ,  Kawahata, Kazunari

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/24

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/0243 ,  H05K1/115 ,  H05K2201/0715 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

公开(公告)号：EP1113495B1

公开(公告)日：2007-03-21

申请号：EP00311681.1

申请日：2000-12-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Russell, Ashdown G

IPC: H01L23/367

CPC classification number: H01L23/3672 ,  H01L2924/0002 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00