公开(公告)号：EP3407687A1

公开(公告)日：2018-11-28

申请号：EP18168724.5

申请日：2018-04-23

Applicant: Realtek Semiconductor Corp.

Inventor： LAI, Chao-Min ,  YEN, Shou-Te

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/115 ,  H05K1/0243 ,  H05K1/0248 ,  H05K1/113 ,  H05K1/114 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2201/10712 ,  H05K2201/10734

Abstract: A control device (2) is provided. The control device (2) operates in cooperation with together with a packaged electronic component (1) and a circuit board (3). The packaged electronic component (1) includes a predetermined contact pad array (10) having a plurality of first contact pads (A11-A33), the circuit board (3) includes a plurality of conductive vias (Cll-C43) passing through the circuit board (3), and the conductive vias (C11-C43) includes a plurality of first conductive vias (C11-C33) arranged corresponding to the first contact pads (A11-A33). The control device (2) includes a signal contact array (20) including a plurality of first signal contacts (B11-B33). When the control device (2) is disposed on one side of the circuit board (3) and the packaged electronic component (1) is disposed on another side of the circuit board (3), the control device (2) at least partially overlaps with the packaged electronic component (1) in a thickness direction of the circuit board (3), and each of the first signal contacts (B11-B33) is electrically connected to the corresponding one of the first contact pads (All-A33) via the corresponding one of the first conductive vias (C11-C33).

公开(公告)号：EP1978558B1

公开(公告)日：2017-09-13

申请号：EP08154036.1

申请日：2008-04-03

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Shiraishi, Akinori ,  Murayama, Kei ,  Sunohara, Masahiro ,  Koizumi, Naoyuki ,  Higashi, Mitsutoshi

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/055 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48 ,  H01L33/48 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1147 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A substrate (101) includes a storage portion (101C) which is defined by a base for mounting a light emitting element (102) and a wall portion standing up on and from the base. A package (100) is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion (101C) is connected to a cover (103) to thereby seal a light emitting element. A seal structure (130; 330; 430) is composed of an uneven portion (140; 340) formed on the lower surface side surface of the base (101A), a close contact layer (150) formed on the surface of the uneven portion (140; 340), a power supply layer (160) formed on the close contact layer (150), and an electrode layer (170) formed on the surface of the power supply layer (160). The uneven portion(140; 340) includes a first recessed portion (180) formed at a position spaced in the radial direction from the outer periphery of a through electrode (107) or from the inner wall of a through hole (120), and a second recessed portion (190) formed at a position spaced further outwardly from the first recessed portion (180).

Abstract translation: 衬底（101）包括由用于安装发光元件（102）的底座和竖立在底座上的壁部分限定的储存部分（101C）。 封装（100）构造成使得围绕存储部分（101C）的周边形成的壁部分的上端连接到盖（103），从而密封发光元件。 密封结构（130; 330; 430）由形成在基座（101A）的下表面侧表面上的不平坦部分（140; 340），形成在不平坦部分的表面上的紧密接触层 （140; 340），形成在所述紧密接触层（150）上的电源层（160）以及形成在所述电源层（160）的表面上的电极层（170）。 凹凸部（140,340）具有：第一凹部（180），其形成在从贯通电极（107）的外周或者贯通孔（120）的内壁向径向隔开的位置;以及 第二凹陷部分（190），形成在从第一凹陷部分（180）向外间隔开的位置处。

公开(公告)号：EP3177116A1

公开(公告)日：2017-06-07

申请号：EP16201867

申请日：2016-12-02

Applicant: SAMSUNG DISPLAY CO LTD

Inventor： KIM BYOUNGYONG ,  YEO INSEOK ,  JANG EUIYUN ,  LEE SANGJUN ,  HWANG JEONGHO

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/113 ,  H05K1/111 ,  H05K1/118 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10545 ,  Y02P70/611

Abstract: Provided is a printed circuit board including a base substrate, first row pads, and second row pads. The base substrate has two sides, that can be adjacent, respectively extending in first and second directions. A plurality of pad group areas successively positioned along the first direction are defined on the base substrate. The first row pads are respectively disposed within the pad group areas and successively positioned along a third direction. The second row pads are respectively disposed within the pad group areas, successively positioned along the third direction, and spaced apart from the first row pads. Each of the second row pads is a predetermined distance from a corresponding one of the first row pads in the second direction.

Abstract translation: 提供了一种印刷电路板，其包括基底，第一行垫和第二行垫。 基础衬底具有两个侧面，这两个侧面可以相邻，分别在第一和第二方向上延伸。 在基板上限定了沿第一方向连续放置的多个焊盘组区域。 第一行垫分别设置在焊盘组区域内并沿着第三方向连续定位。 第二行垫分别设置在焊盘组区域内，沿着第三方向连续定位，并与第一行焊盘间隔开。 每个第二行垫在第二方向上与相应的第一行垫的预定距离。

公开(公告)号：EP3016485A3

公开(公告)日：2016-06-22

申请号：EP15183432.2

申请日：2015-09-02

Applicant: ROBERT BOSCH GMBH

Inventor： Gerhaeusser, Martin

IPC: H05K1/14 ,  H05K1/18 ,  H05K5/00 ,  H05K3/28 ,  H05K3/36

CPC classification number: H05K1/147 ,  H05K1/189 ,  H05K3/281 ,  H05K3/363 ,  H05K5/0082 ,  H05K2201/09481 ,  H05K2203/1311

Abstract: Die Erfindung betrifft ein elektrisches Gerät 1 für den Einsatz in einem kontaminierenden Medium, mit einem Leiterbahnsubstrat 2, das auf wenigstens einer Oberfläche 21 des Leiterbahnsubstrats 2 wenigstens eine elektrische Kontaktfläche 22 aufweist, und mit einer Schutzfolie 3, welche an dem Gerät 1 derart angeordnet ist, dass die wenigstens eine elektrische Kontaktfläche 22 zwischen der Schutzfolie 3 und dem Leiterbahnsubstrat 2 vor dem kontaminierenden Medium geschützt angeordnet ist. Es wird vorgeschlagen, dass die Schutzfolie 3 durch eine flexible Leiterbahnfolie 30 gebildet wird, die wenigstens eine dem Leiterbahnsubstrat 2 zuweisende elektrische Anschlussfläche 36 aufweist, die mit der wenigstens einen elektrischen Kontaktfläche 22 elektrisch leitend verbunden ist. Ferner betrifft die Erfindung ein Verfahren zur Herstellung eines solchen Gerätes.

公开(公告)号：EP2520139B1

公开(公告)日：2016-03-16

申请号：EP10800869.9

申请日：2010-12-29

Applicant: E. I. du Pont de Nemours and Company

Inventor： NAIR, Kumaran, Manikantan ,  GORDON, Scott, E. ,  MCCOMBS, Mark, Frederick

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/00 ,  H01B1/22 ,  H05K1/09

CPC classification number: H05K3/0094 ,  H01B1/22 ,  H05K1/09 ,  H05K1/092 ,  H05K1/095 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/032 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1126

公开(公告)号：EP2658354B1

公开(公告)日：2015-09-16

申请号：EP12861057.3

申请日：2012-10-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： YAO, Kai ,  ZHU, Yongfa ,  HUANG, Yingpei

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/117 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10416

公开(公告)号：EP2880358A1

公开(公告)日：2015-06-10

申请号：EP13744492.3

申请日：2013-07-26

Applicant: M.D. SRL

Inventor： PIETRELLA, Diego

IPC: F21S6/00 ,  F21V21/26 ,  F21V23/00 ,  H05K1/00 ,  F21Y101/02

CPC classification number: F21V23/06 ,  F21S6/003 ,  F21V21/00 ,  F21V21/26 ,  F21V23/00 ,  F21V23/04 ,  F21Y2115/10 ,  H05K1/116 ,  H05K1/142 ,  H05K2201/09481 ,  H05K2201/10409

Abstract: A lamp (100) comprising a base PCB (1), at least one support PCB (2) connected to the base PCB, a lighting assembly (4) connected to the support PCB (2) and at least one light source and power supply connected to conductive tracks of the base PCB (1).

Abstract translation: 灯具有基底PCB，连接到基底PCB的至少一个支撑PCB，连接到支撑PCB的照明组件和连接到基座PCB的导电轨迹的至少一个光源和电源。

公开(公告)号：EP2658354A4

公开(公告)日：2014-03-26

申请号：EP12861057

申请日：2012-10-26

Applicant: HUAWEI TECH CO LTD

Inventor： YAO KAI ,  ZHU YONGFA ,  HUANG YINGPEI

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/117 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10416

公开(公告)号：EP2461656A3

公开(公告)日：2012-08-01

申请号：EP12000096.3

申请日：2007-03-14

Applicant: Sumitomo Bakelite Company, Ltd.

Inventor： Chuma, Toshiaki ,  Inaba, Makoto

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/148 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481

Abstract: There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion.

公开(公告)号：EP2328393A1

公开(公告)日：2011-06-01

申请号：EP10187464.2

申请日：2010-10-13

Applicant: NITTO DENKO CORPORATION

Inventor： Hanazono, Hiroyuki

IPC: H05K1/16 ,  H01M8/02 ,  H05K1/00 ,  H05K1/02

CPC classification number: H05K1/16 ,  H01M8/0269 ,  H01M8/1011 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/244 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09481 ,  Y02E60/523

Abstract: A rectangular collector portion is formed on each of a first insulating portion and a second insulating portion. A cover layer is provided on the first insulating portion to cover the collector portion, and a cover layer is provided on the second insulating portion to cover the collector portion. A seal region is provided on the first insulating portion to surround the cover layer. A seal region is provided on the second insulating portion to surround the cover layer. Rectangular drawn-out conductor portions are formed on the back surface of the base insulating layer. The collector portion and the drawn-out conductor portion are electrically connected to each other, and the collector portion and the drawn-out conductor portion are electrically connected to each other.

Abstract translation: 在第一绝缘部分和第二绝缘部分中的每一个上形成矩形收集部分。 覆盖层设置在第一绝缘部分上以覆盖集电器部分，并且覆盖层设置在第二绝缘部分上以覆盖集电器部分。 密封区域设置在第一绝缘部分上以包围覆盖层。 密封区域设置在第二绝缘部分上以包围覆盖层。 矩形拉出导体部分形成在基底绝缘层的背面上。 集电体部分和引出导体部分彼此电连接，并且集电极部分和引出导体部分彼此电连接。