公开(公告)号：EP3338519A1

公开(公告)日：2018-06-27

申请号：EP16758108.1

申请日：2016-08-18

Applicant: Schreiner Group GmbH & Co. KG

Inventor： BECKER, Johannes

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/16

CPC classification number: H05K1/028 ,  A61F13/42 ,  A61F2013/424 ,  A61J1/035 ,  A61J2200/70 ,  B65D75/367 ,  G01N27/223 ,  H05K1/0239 ,  H05K1/147 ,  H05K1/162 ,  H05K1/165 ,  H05K1/18 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10681

Abstract: The invention relates to an object (100) which comprises at least a first conductor structure (1), at least one electronic unit (5), at least a second conductor structure (2), which is galvanically isolated from the first conductor structure (1) and/or from the electronic unit (5), but can be electrically coupled thereto, and a carrier structure (15) having at least a first carrier layer (10), a first carrier layer region (11) of the first carrier layer (10) and a second carrier layer region (21). The carrier structure (15) is designed as a layer stack (16) in a base surface region (G) which comprises at least a part of the base surface of the carrier structure (15). The layer stack (16) comprises at least the first carrier layer region (11) of the first carrier layer (10) and the second carrier layer region (21). Furthermore, at least a part of the first (1) and the second conductor structure (2) is arranged in the base surface region (G). The first conductor structure (1) and/or the electronic unit (5) is soldered or bonded to the first carrier layer region (11) or is otherwise connected to the first carrier layer region (11), whereas the second conductor structure (2) is soldered or bonded to the second carrier layer region (12; 21) or otherwise connected to the second carrier layer region (21).

公开(公告)号：EP2991465A4

公开(公告)日：2017-04-19

申请号：EP14789081

申请日：2014-04-23

Applicant: HITACHI AUTOMOTIVE SYSTEMS LTD

Inventor： HIRAOKA MIKI ,  YAMASHITA SHIRO ,  YATSUGI TOMISHIGE

IPC: H05K3/34 ,  H05K1/02 ,  H05K1/05

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/10621 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: The objective of the present invention is to improve reliability in a solder connection portion between an electronic component and a wiring pattern. A pair of wiring patterns (31A and 31B) are formed on a circuit wiring board (30) with an insulation layer (37) therebetween. Each wiring pattern (31A and 31B) has a land (33a or 33b) and a wiring portion (34a or 34b) that is narrower than the land. By way of solder (42), a chip component (41) is soldered to the lands (33a and 33b). The x (width) direction center (Xa) of each connection portion (53) where a respective wiring portion (34a or 34b) is connected to a respective land (33a or 33b) is disposed at a position that is outside of both the region in which a region of predetermined width (Wc) of the chip component (41) extends in the x (longitudinal) direction, and the region in which a region of predetermined length (Lc) of the chip component (41) extends in a y (transverse) direction.

Abstract translation: 本发明的目的在于提高电子部件与布线图案之间的焊料连接部分的可靠性。 一对布线图案（31A和31B）通过绝缘层（37）形成在电路布线板（30）上。 每个布线图案（31A和31B）具有平台（33a或33b）和比平台更窄的布线部分（34a或34b）。 通过焊料（42）将芯片元件（41）焊接到焊盘（33a和33b）上。 将各布线部分（34a或34b）连接到相应焊盘（33a或33b）的每个连接部分（53）的x（宽度）方向中心（Xa）设置在两个区域 其中芯片部件（41）的预定宽度（Wc）的区域在x（纵向）方向上延伸，并且芯片部件（41）的预定长度（Lc）的区域以ay（ 横向）方向。

公开(公告)号：EP2873309A1

公开(公告)日：2015-05-20

申请号：EP13734072.5

申请日：2013-07-04

Applicant: Robert Bosch GmbH

Inventor： SCHMITT, Michael ,  CARLE, Wolfgang

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0269 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2203/046 ,  H05K2203/161 ,  Y02P70/611 ,  Y02P70/613

Abstract: The invention relates to a printed circuit board comprising at least one substrate and an electrically conductive layer connected to the substrate. Preferably, at least one conductor track is formed by the electrically conductive layer. The printed circuit board has at least one component, wherein the component has at least one electrical connection which is electrically connected to a contact region of the electrically conductive layer by means of a solder. According to the invention, the electrical connection of the component and the contact region extend at least partly or predominantly or exclusively between the component and the substrate of the printed circuit board. The conductor track has a solder-guiding capillary proceeding from the contact region, wherein the capillary extends beyond a boundary of the component, more particularly of a housing of the component.

公开(公告)号：EP2112723A3

公开(公告)日：2013-04-17

申请号：EP09005731.6

申请日：2009-04-23

Applicant: Iriso Electronics Co., Ltd.

Inventor： Sugaya, Yujiro ,  Saito, Tomomitsu

IPC: H01R13/66 ,  H01R43/02 ,  H01R13/658 ,  H05K3/32

CPC classification number: H01R43/0221 ,  H01R13/6585 ,  H01R13/6666 ,  H05K1/189 ,  H05K3/328 ,  H05K2201/0112 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2203/107 ,  H05K2203/1136

Abstract: An object of the present invention is to provide a laser welding method in which when a laser beam is made incident on a thin film, carbide generated by the heat of the laser beam is prevented from being ejected between respective metallic thin plates. In the present invention, it is configured such that in each of second conductive sections 43 made of a metallic thin plate, a slit 43b which extends from a welding position to the end of the second conductive section 43 is provided, and that the second conductive sections 43 are respectively welded to the terminals 20 by making the laser beam incident at the respective welding positions of the substrate 41 (thin film). Thereby, even when a resin at the laser beam incident portion is carbonized by the thermal energy of the laser beam and thereby the resin carbide is ejected from the welding portion, it is possible to discharge the carbide to the outside from the lower end of the second conductive section 43 via the slit 43b of the second conductive section 43. Thereby, the carbide is prevented from being ejected between the second conductive sections 43 adjacent to each other. As a result, it is possible to effectively prevent the lowering of the insulation resistance between the respective second conductive sections 43 due to the carbide.

公开(公告)号：EP2117044B1

公开(公告)日：2013-02-27

申请号：EP09251275.5

申请日：2009-05-07

Applicant: Nitto Denko Corporation

Inventor： Ebe, Hirofumi ,  Ishimaru, Yasuto

IPC: H01L23/498 ,  H05K1/02

CPC classification number: H05K1/0271 ,  H01L23/3735 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0209 ,  H05K1/189 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10674

公开(公告)号：EP2330528A3

公开(公告)日：2011-10-05

申请号：EP10172139.7

申请日：2010-08-06

Applicant: NCR Corporation

Inventor： McNicoll, Grant ,  Walker, Ian ,  Harrow, Charles

IPC: G06F21/00

CPC classification number: G06F21/86 ,  G06F21/75 ,  G06Q20/4012 ,  H05K1/0275 ,  H05K1/11 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2203/063

Abstract: A secure circuit board assembly (10) is provided. The secure circuit board assembly (10) comprises: a control board (12) including a cryptographic processor (30); a spacer portion (14) mounted on the control board (12); and a lid (16) mounted on the spacer portion (14). The control board (12), the spacer portion (14), and the lid (16) collectively provide a secure enclosed chamber in which the cryptographic processor (30) is mounted. The spacer portion (14) provides protection against side-on attacks against the cryptographic processor (30).

Abstract translation: 提供了一种安全的电路板组件（10）。 安全电路板组件（10）包括：包括密码处理器（30）的控制板（12）; 安装在所述控制板（12）上的间隔部分（14）; 以及安装在间隔件部分（14）上的盖（16）。 控制板（12），间隔部分（14）和盖子（16）共同提供安装密封处理器（30）的安全封闭室。 间隔部分（14）提供防止针对加密处理器（30）的侧向攻击的保护。

公开(公告)号：EP1793658B1

公开(公告)日：2011-06-15

申请号：EP04799462.9

申请日：2004-11-02

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Fujikawa, Katsuhiko, c/o (A170) Intellectual Property Department ,  Tanaka, Koji, c/o (A170)Intellectual Property Department

IPC: H05K1/11 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K1/111 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/611

Abstract: A wiring board module (10) is provided with a multilayer wiring board (11), and on a mounting surface (11a) of the multilayer wiring board (11), a crystal oscillator (1), an IC component (2) and the like are mounted. On the mounting surface (11a), a mounting land (12) for the IC component (2), a mounting land (13) for the crystal oscillator (1) and a mounting land (14) for other surface mounting component are formed. Particularly, the mounting land (13) for the crystal oscillator (1) is not like the conventional land solely having a large area. Adjacent four land pieces (13a) are electrically connected through one external terminal (1a) of the crystal oscillator (1) to function as a mounting land for the external terminal (1a). In other words, a plurality of the mounting lands (13) provided at positions corresponding to each of the outer terminal (1a) of the crystal oscillator (1) are divided into four land pieces (13a).

公开(公告)号：EP2323466A1

公开(公告)日：2011-05-18

申请号：EP09806652.5

申请日：2009-08-03

Applicant: Sharp Kabushiki Kaisha

Inventor： SUMIDA, Yukihiro ,  MURAOKA, Takeshi

IPC: H05K1/11 ,  G02F1/1345 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K3/361 ,  G02F1/13452 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/323 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/09936

Abstract: Provided is a flexible substrate wherein a connection portion between the flexible substrate and an electric circuit board meets requirements of narrow wiring pitch and low resistance at the connection portion. An electric circuit structure, which has the flexible substrate and the electric circuit board to which the flexible substrate is connected, is also provided. A wiring pattern (22) is formed on a flexible base film (21), a connection terminal (25) connected electrically to an electrode terminal of another electric circuit board is arranged at an end portion of the wiring pattern (22), and the connection terminal (25) includes wide connection terminals (25b, 25c) having a terminal width extending across plural lines of the wiring pattern (22).

Abstract translation: 提供一种柔性基板，其中柔性基板和电路板之间的连接部分满足连接部分处的窄布线间距和低电阻的要求。 还提供了一种电路结构，其具有柔性基板和连接柔性基板的电路板。 布线图案（22）形成在柔性基膜（21）上，与布线图案（22）的端部配置有与电路基板的电极端子电连接的连接端子（25） 连接端子（25）包括具有延伸穿过布线图案（22）的多条线的端子宽度的宽连接端子（25b，25c）。

公开(公告)号：EP2207244A2

公开(公告)日：2010-07-14

申请号：EP09001669.2

申请日：2009-02-04

Applicant: ERNI Electronics GmbH

Inventor： Lappöhn, Jürgen

IPC: H01R24/12

CPC classification number: H05K1/0219 ,  H01R12/716 ,  H01R12/724 ,  H01R13/6585 ,  H05K1/0237 ,  H05K3/308 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: Die Erfindung betrifft einen mehrpoliger Steckverbinder (10a, 10b) zur Kontaktierung mit einer Multilayerplatine (40), der Signal-Kontakte (11a, 11b; 12a, 12b) aufweist, denen ein erstes und wenigstens ein zweites Abschirm-Kontaktelement (17a, 17b, 17a', 17b'; 18a, 18b, 18a', 18b') zugeordnet und benachbart zum Signal-Kontakt (11 a, 11 b; 12a, 12b) angeordnet sind. Der Steckverbinder (10a, 10b) zeichnet sich dadurch aus, dass zumindest auf der obersten Schicht (41) der Multilayerplatine (40) Ausnehmungen (54, 54', 54") vorgesehen sind, welche zur Aufnahme und Durchführung von wenigstens zwei Abschirm-Kontaktelementen (17a', 17b'; 18a, 18b) bemessen sind, die benachbarten Signal-Kontakten (11a, 11b; 12a, 12b) zugeordnet sind.

Abstract translation: 多极插头连接器（10b）具有信号触头（11b，12b）。 凹槽设置在多层板的上层上。 凹口限制了两个屏幕接触元件（17b'，18b）的接收和执行。

公开(公告)号：EP2100783A2

公开(公告)日：2009-09-16

申请号：EP09155248.9

申请日：2009-03-16

Applicant: Guardian Industries Corp.

Inventor： Veerasamy, Vijayen S.

IPC: B60S1/08 ,  B32B17/10 ,  G01D5/24 ,  G01N21/25 ,  H05K1/02

CPC classification number: B60S1/0825 ,  B32B17/10036 ,  B32B17/10174 ,  B32B17/10761 ,  B32B17/10788 ,  B60S1/0822 ,  B60S1/087 ,  G01D5/2405 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09663

Abstract: A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). In certain example embodiments, a plurality of sensing capacitors are supported by a window such as a vehicle windshield, the capacitors each having a different field and/or pattern. A sensing circuit outputs an analog signal that is based on and/or related to the capacitances of one or more of the sensing capacitors. In certain example embodiments, a flexible printed circuit board (PCB) mountable in or on a vehicle window is provided. First and second sensing circuits are formed on opposing sides of the flexible PCB, with each said sensing circuit comprising a plurality of different fractal structures. A ground plane is located between the first and second sensing circuits, with the ground plane being arranged so as to decouple the first and second capacitor arrays and to shield the first capacitor array from fields emanating from the second capacitor array and vice versa. The electronic device is configured to detect moisture on an exterior surface of the vehicle window, humidity on an interior surface of the vehicle window, and EMI.

Abstract translation: 用于感测诸如车辆窗口（例如，车辆挡风玻璃，天窗或背衬）的窗户上的湿气（例如雨）和/或其他材料的存在的系统和/或方法。 在某些示例性实施例中，多个感测电容器由诸如车辆挡风玻璃的窗户支撑，每个电容器具有不同的场和/或图案。 感测电路输出基于和/或与一个或多个感测电容器的电容相关的模拟信号。 在某些示例性实施例中，提供可安装在车窗中或其上的柔性印刷电路板（PCB）。 第一和第二感测电路形成在柔性PCB的相对侧上，每个所述感测电路包括多个不同的分形结构。 接地平面位于第一感测电路和第二感测电路之间，其中接地平面布置成使第一和第二电容器阵列去耦，并且使第一电容器阵列与从第二电容器阵列发出的场屏蔽起来，反之亦然。 电子设备被配置为检测车辆窗口的外表面上的湿气，车窗内表面上的湿度和EMI。