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    Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
    2.
    发明公开
    Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method 审中-公开
    一种用于通过加成法的装置，印刷电路板和与该方法获得的多层印刷电路板制造电路板的方法

    公开(公告)号：EP2592912A1

    公开(公告)日：2013-05-15

    申请号：EP13000238.9

    申请日：2009-04-30

    申请人： Panasonic Corporation

    发明人： Yoshioka, Shingo ,  Fujiwara, Hiroaki

    IPC分类号： H05K1/02 ,  H05K1/16 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46

    CPC分类号： H05K3/107 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/111 ,  H05K1/162 ,  H05K3/0032 ,  H05K3/184 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0565 ,  H05K2203/161

    摘要： The present invention relates to a circuit board comprising:
    a circuit groove having at least one land region for surface mounting of electronic parts and at least one circuit wiring region formed integrally with the land region, and
    a partial reinforcing structure formed in the land region of the circuit groove,
    wherein the partial reinforcing structure is at least one structure selected from a group consisting of:
    an irregular shape having a ten-point average roughness (Rz) of 0.1 to 20 µm formed on the groove surface in the land region,
    a groove shape having the groove depth in the land region larger than that of the circuit wiring region to form a plated film having thickness in the land region thicker than that of the circuit wiring region, and
    a structure formed by forming at least one protrusion on the periphery of the groove in the land region.

    摘要翻译： 本发明涉及一种电路板，包括：具有用于电子部件表面安装的至少一个国家区域和与国家，地区一体形成的至少一个电路布线区域，并在土地区域形成的局部加固结构的电路槽 所述电路凹槽，worin的局部加固结构是从以下一组中选出的至少一种结构：具有0.1微米至20微米的十点平均粗糙度（Rz）在陆地区域形成的凹槽表面上的不规则形状，一个 具有在陆地区域比电路布线区域的较大的槽深的槽形状，以形成在该国区域比电路布线区域的较厚的电镀具有膜厚，并通过形成在所述至少一个突起形成的结构 在陆地区域中的槽的周边上。