公开(公告)号：EP1242236A1

公开(公告)日：2002-09-25

申请号：EP00968951.4

申请日：2000-10-13

Applicant: Polyeitan Composites Ltd.

Inventor： COHEN, Yachin ,  REIN, Dmitry ,  VAYKHANSKY, Lev

IPC: B32B3/00 ,  B32B5/06

CPC classification number: B32B27/02 ,  B32B7/12 ,  B32B2323/043 ,  B32B2323/046 ,  B32B2457/08 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24628 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/2938 ,  Y10T428/31649 ,  Y10T428/31681

Abstract: A polyolefin composite for a printed circuit board or an antenna base material. A base material (12) including the composite and electronic modules including the base material (12). The base material includes at least one dielectic layer including a polyolefin composite and at least one electroconductive layer (16) including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another through an adhesive (14).

Abstract translation: 一种用于印刷电路板或天线基材的聚烯烃复合材料。 包括含有基材（12）的复合材料和电子模块的基材（12）。 基材包括至少一个包含聚烯烃复合材料的介电层和至少一个包含导电材料的导电层（16），所述介电材料和导电层通过粘合剂（14）彼此紧密结合。