公开(公告)号：EP3232744A1

公开(公告)日：2017-10-18

申请号：EP15866751.9

申请日：2015-08-07

Applicant: Toppan Printing Co., Ltd.

Inventor： OHARA, Takanori ,  YAMAMOTO, Kyoichi ,  KUBOTA, Kentaro ,  HAYASHI, Kenji

IPC: H05K1/02 ,  H05K3/12 ,  H05K1/16

CPC classification number: H05K3/4664 ,  H05K1/0284 ,  H05K1/0386 ,  H05K1/092 ,  H05K1/095 ,  H05K1/16 ,  H05K3/0014 ,  H05K3/103 ,  H05K3/12 ,  H05K3/1275 ,  H05K3/207 ,  H05K3/22 ,  H05K3/245 ,  H05K3/32 ,  H05K3/38 ,  H05K3/4046 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K2203/302

Abstract: An ink layer of an electrically conductive ink is formed on a sheet-like base (2) and then the base (2) is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring (3). The ink layer is pliable during the bending deformation of the base (2), preventing breakage of the ink layer associated with the bending deformation of the base (2), and preventing damage to the wiring (3) even when the wiring (3) is finely formed.

Abstract translation: 在片状基体（2）上形成导电油墨的油墨层，然后在油墨层固化之前使基体（2）弯曲变形，随后使油墨层固化，从而形成布线（3） 。 油墨层在基体（2）的弯曲变形过程中是柔软的，防止了与基体（2）的弯曲变形相关的油墨层的破损，并且即使在布线（3）被破坏时也防止损坏布线（3） 形成良好。

公开(公告)号：EP3189268A1

公开(公告)日：2017-07-12

申请号：EP15736853.1

申请日：2015-07-20

Applicant: DSM IP Assets B.V.

Inventor： FRISSEN, Richard Jacques Theodoor ,  SUBRAMONIAN, Siva Esakimuthu

IPC: F21K99/00

CPC classification number: C08K7/14 ,  B60Q1/0483 ,  B60Q1/18 ,  C08K3/013 ,  C08K5/0008 ,  F21S41/141 ,  F21S43/14 ,  F21Y2115/10 ,  H01L33/62 ,  H05K1/0353 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0145 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/10106 ,  H05K2203/107

Abstract: Light emitting diode (LED) based daylight running light (DRL) comprising a carrier, comprising a polymer composition comprising polyethylene terephthalate and glass fibers, the surface of the carrier comprises conductor tracks for mounting one or more LED's.

Abstract translation: 包括载体的基于发光二极管（LED）的日光行驶灯（DRL）包括包含聚对苯二甲酸乙二醇酯和玻璃纤维的聚合物组合物，载体的表面包括用于安装一个或多个LED的导体轨道。

公开(公告)号：EP2810540A1

公开(公告)日：2014-12-10

申请号：EP13743076.5

申请日：2013-01-30

Applicant: Stora Enso Oyj

Inventor： SIRVIÖ, Petri ,  MAIJALA, Juha

IPC: H05K3/10 ,  H05K3/12

CPC classification number: B05C1/003 ,  B05C19/008 ,  B05D1/007 ,  B05D1/28 ,  B05D3/0263 ,  B05D3/029 ,  B05D3/06 ,  B05D3/12 ,  C23C26/02 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/102 ,  H05K3/1241 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2201/0293 ,  H05K2203/0126 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/102 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1545 ,  H05K2203/1581

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

公开(公告)号：EP2799493A1

公开(公告)日：2014-11-05

申请号：EP11878850.4

申请日：2011-12-29

Applicant: Shengyi Technology Co., Ltd

Inventor： MENG, Yundong ,  FANG, Kehong

IPC: C08L71/12 ,  C08L63/00 ,  C08L79/04 ,  B32B17/04 ,  B32B19/02

CPC classification number: C08L79/00 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08J2479/00 ,  C08K5/5313 ,  C08L63/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2205/03 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T428/31522 ,  Y10T442/20 ,  C08L79/04

Abstract: The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

Abstract translation: 本发明涉及一种热固性树脂组合物，以及由其制成的印刷电路板用预浸料和层叠体。 热固性树脂组合物包含以下组分：低分子量的含磷聚苯醚树脂，环氧树脂，氰酸酯树脂和促进剂。 使用树脂组合物制造的预浸料通过浸渍和干燥将基材和热固性树脂组合物粘附到基材上。 使用该树脂组合物制造的印刷电路板用层压体包括多层叠预浸料，通过压制覆盖层叠预浸料坯的一面或两面的金属箔，每个预浸料坯包含基材，并且热固性树脂组合物粘附于基材 材料通过浸渍和干燥。 本发明的热固性树脂组合物具有低介电常数和介电损耗因子，高耐热性，高玻璃化转变温度和阻燃性等特性。使用该印刷电路板制造的印刷电路板的层压板具有优异的 金属箔剥离强度，耐热性和介电性能，适用于高频高速电路板。

公开(公告)号：EP2676799B1

公开(公告)日：2014-06-11

申请号：EP12760231.6

申请日：2012-03-16

Applicant: Mitsubishi Chemical Europe GmbH ,  Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou ,  SCHRAUWEN, Bernardus Antonius Gerardus

IPC: B41M5/26 ,  H05K1/03 ,  C08J5/04 ,  C08L77/00 ,  C08K3/22 ,  C08K9/02 ,  C08L55/02 ,  H05K3/18

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

公开(公告)号：EP2676799A1

公开(公告)日：2013-12-25

申请号：EP12760231.6

申请日：2012-03-16

Applicant: Mitsubishi Chemical Europe GmbH ,  Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou ,  SCHRAUWEN, Bernardus Antonius Gerardus

IPC: B41M5/26 ,  H05K1/03 ,  C08J5/04 ,  C08L77/00 ,  C08K3/22 ,  C08K9/02 ,  C08L55/02 ,  H05K3/18

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. THe thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract translation: 本发明提供一种具有优异的弯曲强度，弯曲模量和却贝冲击强度，在其上镀敷层可以在一个成功的方式形成的热塑性树脂成形体。 用于激光直接结构化热塑性树脂组合物按重量计的激光直接结构化添加剂，其包括，每100份（重量）热塑性树脂，10〜150重量份的无机纤维和1〜30重量份，所述激光直接结构化添加剂含 铜，锑和锡，和具有1.5的莫氏硬度或大于所述无机纤维的莫氏硬度更小一些中的至少一个。

公开(公告)号：EP0908559B1

公开(公告)日：2009-09-16

申请号：EP98118922.8

申请日：1998-10-07

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Gaku, Morio c/o Mitsubishi Gas Chemical Co., Inc. ,  Nozaki, Mitsuru c/o Mitsubishi Gas Chem. Co., Inc. ,  Saimen, Kenji c/o Kuraray Co., Ltd. ,  Esaki, Tamemaru c/o Kuraray Co., Ltd.

IPC: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/00

CPC classification number: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24322 ,  Y10T442/2475

公开(公告)号：EP1707315B1

公开(公告)日：2009-03-11

申请号：EP05703853.1

申请日：2005-01-13

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： HAYASHI, Fumihiro Sumitomo Electric Industries Ltd ,  MASUDA, Yasuhito Sumitomo Electric Industries, Ltd ,  OKUDA, Yasuhiro Sumitomo Electric Industries, Ltd.

IPC: B24C1/04 ,  C23C18/16 ,  H05K3/10 ,  B24C3/32 ,  H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  B24C11/00

CPC classification number: B24C3/322 ,  B24C1/04 ,  B24C11/00 ,  C23C18/1605 ,  C23C18/1644 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/182 ,  H05K3/184 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/025 ,  H05K2203/0565 ,  Y10T428/24479 ,  Y10T428/24496 ,  Y10T428/24612 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T442/674

Abstract: A production method for a porous molding in which complicated and fine penetrated portions and recesses are pattern-worked. A pattern-worked porous molding or non-woven fabric in which a plated layer is selectively formed on the surfaces of penetrated portions and recesses. A mask having pattern-form penetrated portions is disposed on at least one surface of a porous molding or non-woven fabric, and fluid or fluid containing abrasive grains is sprayed over the mask to form penetrated portions or recesses or the both of them, to which the opening shape of the mask’s penetrated portion is transferred, on the porous molding or non-woven fabric. A porous molding or non-woven fabric and an electric circuit components or the like in which a plated layer is selectively formed on the surfaces of penetrated portions or recesses or the both of them.

公开(公告)号：EP1963567A2

公开(公告)日：2008-09-03

申请号：EP06840315.3

申请日：2006-12-19

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： LEVIT, Mikhail, R.

IPC: D21H11/20

CPC classification number: D21H11/20 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: The invention concerns a paper useful as an structural component, the paper comprising 20 to 100 percent by weight of polypyridobisimidazole fiber and a binder material, wherein the paper has (i) a density of 0.08 to 1.5 grams per cubic centimeter and (ii) a basis weight of from 10 to 150 grams per square meter, and the paper, when impregnated with at least 15 % by weight of phenolic resin, has a specific tensile stiffness of at least 100 (N/cm)/(g/m2), wherein the weight % is based on the total weight of the paper and resin.

公开(公告)号：EP1927940A1

公开(公告)日：2008-06-04

申请号：EP06024978.6

申请日：2006-12-02

Applicant: Sokymat GmbH

Inventor： Michalk, Manfred ,  Hirschfeld, Kay

IPC: G06K19/077

CPC classification number: H05K3/103 ,  H05K1/0366 ,  H05K1/182 ,  H05K2201/0293 ,  H05K2201/10287 ,  Y10T428/249953 ,  Y10T428/249986

Abstract: The invention refers to a functional laminate (6) comprising at least one electrically conductive component (2.1, 2.1', 2.2), particularly an antenna coil or a track, arranged on a non-woven substrate (1) with a grammage of less than 25 g/m 2 .

Abstract translation: 本发明涉及一种功能层压板（6），其包括布置在无纺基底（1）上的至少一个导电部件（2.1,2.1'，2.2），特别是天线线圈或轨道，其克重小于 25g / m 2。