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1.发明授权Method of manufacturing an uniaxially electrically conductive article 失效Verfahren zum Herstellen采用单轴电动机
公开(公告)号：EP0327399B1
公开(公告)日：1996-04-17
申请号：EP89301106.4
申请日：1989-02-03
申请人： RAYCHEM LIMITED
CPC分类号： H01L21/486 , B23K1/0016 , B23K20/023 , B23K31/02 , B23K2201/40 , B23K2203/42 , B23K2203/50 , H01L23/145 , H01L23/3733 , H01L23/49827 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/00013 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/3011 , H05K1/0326 , H05K1/0333 , H05K1/0346 , H05K1/036 , H05K3/0017 , H05K3/0032 , H05K2201/0116 , H05K2201/0154 , H05K2201/10378 , H05K2203/107 , H01L2924/00014 , H01L2924/00 , H01L2224/29099
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公开(公告)号：EP0329314A1
公开(公告)日：1989-08-23
申请号：EP89301107.2
申请日：1989-02-03
申请人： RAYCHEM LIMITED
CPC分类号： H01L24/12 , B23K1/0016 , B23K20/023 , B23K31/02 , B23K2201/40 , H01L21/486 , H01L23/145 , H01L23/3733 , H01L23/4922 , H01L23/49827 , H01L23/4985 , H01L24/11 , H01L24/16 , H01L24/50 , H01L24/81 , H01L2224/05624 , H01L2224/1012 , H01L2224/11334 , H01L2224/13099 , H01L2224/16238 , H01L2224/81101 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H05K1/0326 , H05K1/0333 , H05K1/0346 , H05K1/036 , H05K3/0017 , H05K3/0032 , H05K2201/0116 , H05K2201/0154 , H05K2201/10378 , H05K2203/107 , H01L2224/29099 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： Polymer (preferably polyimide) sheets (10) with laser ablated through-holes plated with metal (20) are used for making electrical connections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting-point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4,4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phenylenediamine, preferably p-phenylenediamine).
摘要翻译： 使用具有镀金属（20）的激光烧蚀通孔的聚合物（优选聚酰亚胺）片（10）用于与指定的微电路，特别是未印刷的微芯片和带自动键合（TAB）制品的电连接。 公开了在镀孔的相对端处与不同熔点材料的接合。 优选的聚酰亚胺是衍生自4,4'-联苯二酐和（4,4'-二氨基联苯或4,4'-二氨基联苯醚或苯二胺，优选对苯二胺）的聚合的衍生物。
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公开(公告)号：EP0327399A1
公开(公告)日：1989-08-09
申请号：EP89301106.4
申请日：1989-02-03
申请人： RAYCHEM LIMITED
CPC分类号： H01L21/486 , B23K1/0016 , B23K20/023 , B23K31/02 , B23K2201/40 , B23K2203/42 , B23K2203/50 , H01L23/145 , H01L23/3733 , H01L23/49827 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/00013 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/3011 , H05K1/0326 , H05K1/0333 , H05K1/0346 , H05K1/036 , H05K3/0017 , H05K3/0032 , H05K2201/0116 , H05K2201/0154 , H05K2201/10378 , H05K2203/107 , H01L2924/00014 , H01L2924/00 , H01L2224/29099
摘要： Miscellaneous UNIAX concepts.
The present concepts include "1:1" uniax (40) with one conductive through-hole per chip connection site, "mirror chip" testing, heat-sink bonding to chips, avoiding contact with conductive cleaved edge of chip, indium solid columns, metal recessed (41) in the through-holes. All of these are subject to preferred materials (UPILEX polyimide) and techniques (U.V. laser ablation, minimum taper of holes).摘要翻译： 其他UNIAX概念。 本发明的概念包括每芯片连接位置具有一个导电通孔的“1：1”单轴（40），“镜像芯片”测试，与芯片的散热片接合，避免与芯片的导电裂边接触，铟固体柱， 金属凹入（41）在通孔中。 所有这些都受到优选材料（UPILEX聚酰亚胺）和技术（U.V.激光烧蚀，孔的最小锥度）的限制。
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