摘要:
The invention concerns a method of testing connections produced using ultrasonic wire bonding, the method calling for the strength of the connection to be measured and taken as the parameter determining the quality of the bond. The invention proposes that the speed, or change with time, of the deformation of the wire and the change with time of the bond wedge size are measured during the bonding operation as the parameters determining the strength of the connection and compared with predefined quality-standard data stored in a process-control module. This enables the strength of each individual connection to be tested without interrupting the process or wasting time.
摘要:
The invention concerns a method of testing connections produced using ultrasonic wire bonding, the method calling for the strength of the connection to be measured and taken as the parameter determining the quality of the bond. The invention proposes that the speed, or change with time, of the deformation of the wire and the change with time of the bond wedge size are measured during the bonding operation as the parameters determining the strength of the connection and compared with predefined quality-standard data stored in a process-control module. This enables the strength of each individual connection to be tested without interrupting the process or wasting time.