Hydrogen assisted reduced oxide soldering system
    1.
    发明公开
    Hydrogen assisted reduced oxide soldering system 失效
    系统使用含有氢气的还原气氛钎焊。

    公开(公告)号:EP0640424A1

    公开(公告)日:1995-03-01

    申请号:EP93120431.7

    申请日:1993-12-17

    发明人: Tench, Morgan D.

    IPC分类号: B23K1/20 B23K35/38

    摘要: A system is provided for regenerating reducing agents used in ancillary chemical or electrochemical processes such as restoring solderability of electronic components to be soldered in a fluxless soldering process. The system includes a cathode, an anode, and an electrolyte system that is separated by a semipermeable ionic barrier into a catholyte and an anolyte. The catholyte includes the reduced member of a redox couple, which can be regenerated electrochemically. The redox couple of the electrolyte system is charged like a battery and discharged during the ancillary process. Regeneration of the reduced member of the redox couple is accomplished at the cathode, which may evolve hydrogen gas. Chemical balance is maintained by the semipermeable ionic barrier, which permits proton migration from the anolyte to the catholyte but acts as a barrier against diffusion and migration of cations from the catholyte to the anolyte. Ideally, the anodic reaction is breakdown of water to form oxygen, which is vented, and protons that migrate across the ionic barrier to the catholyte replacing protons consumed in the ancillary process. The overall reaction in a fluxless soldering system is reduction of metallic oxides to metal, electrochemical regeneration of reducing agents, release of oxygen, and evolution of hydrogen to produce a reducing atmosphere in an enclosed chamber containing the fluxless soldering system.

    摘要翻译: 一种系统提供了一种用于再生在辅助化学或电化学过程中使用的还原剂:如恢复的电子部件的可焊性在无焊剂焊接工艺进行焊接。 该系统包括一阴极,阳极电解液在阳极和电解质至系统并通过半透离子阻挡分离成阴极电解液和上。 阴极电解液包含氧化还原对,它可以电化学再生的减压部件。 氧化还原对电解质体系的充电等的电池,并在所述辅助过程中排出。 氧化还原电对的还原构件的再生是在阴极,其可产生氢气来完成。 化学平衡由半透离子屏障,其允许质子迁移从阳极电解液的阴极电解液,但作为防止扩散和阳离子的迁移的阻挡从阴极到阳极电解液保持。 理想情况下,阳极反应为水击穿以形成氧气,所有这一切都被排出,和质子没有跨过离子迁移屏障以在辅助过程中消耗的阴极电解液代替质子。 在无助熔剂焊接系统整体的反应是还原金属氧化物的金属,还原剂的电化学再生,氧的释放,而氢在封闭的含无焊剂焊接系统的腔室,以产生还原气氛的演化。

    Photoelectrochemical imaging system
    2.
    发明公开
    Photoelectrochemical imaging system 失效
    Photoelektrochemisches Abbildungsystem。

    公开(公告)号:EP0542061A1

    公开(公告)日:1993-05-19

    申请号:EP92118630.0

    申请日:1992-10-30

    发明人: Tench, Morgan D.

    摘要: A method and apparatus are provided for photoelectrochemical reproduction of an image on a plate or roller. For a printing press, the apparatus includes a reusable image roller coated with a oxide semiconductor. A plating solution is applied to the image roller as a thin film. The desired image is written onto the oxide semiconductor by light illumination that generates a photoelectrochemical reaction between the semiconductor and the plating solution. In a preferred embodiment, the image roller is coated with hydrophilic p-type NiO. The image is written onto the roller as dots of oleophilic metallic copper, which are formed on the NiO coating by laser-generated cathodic photoelectrodeposition. Subsequent erasure of the metallic copper image can be accomplished by chemical or electrochemical dissolution of the deposited copper. The method functions to create, erase, and recreate high-resolution images directly on a printing press roller without the necessity of precise matrix registration.

    摘要翻译: 提供了一种用于光电化学再现板或辊上的图像的方法和装置。 对于印刷机,该装置包括涂覆有氧化物半导体的可重复使用的图像辊。 将电镀溶液作为薄膜施加到图像辊上。 通过在半导体和电镀液之间产生光电化学反应的光照射将期望的图像写入氧化物半导体。 在优选实施例中,图像辊涂覆有亲水性p型NiO。 将图像作为亲油性金属铜的点写入辊上,通过激光产生的阴极光电沉积形成在NiO涂层上。 金属铜图像的后续擦除可以通过沉积的铜的化学或电化学溶解来实现。 该方法用于直接在印刷辊上创建,擦除和重新创建高分辨率图像,而无需精确的矩阵配准。