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22 条记录 (耗时 0.009 秒)

    PHOTOCATALYTIC COLOR SWITCHING OF REDOX IMAGING NANOMATERIALS OF REWRITABLE MEDIA
    1.
    发明公开
    PHOTOCATALYTIC COLOR SWITCHING OF REDOX IMAGING NANOMATERIALS OF REWRITABLE MEDIA 审中-公开
    可再生介质中氧化还原成像纳米材料的光催化色彩转换

    公开(公告)号：EP3210079A1

    公开(公告)日：2017-08-30

    申请号：EP15852045.2

    申请日：2015-10-20

    申请人： Yin, Yadong ,  Wang, Wenshou

    发明人： Yin, Yadong ,  Wang, Wenshou

    IPC分类号： G03C1/705 ,  G03C8/04 ,  G03C8/10

    CPC分类号： G03C1/705 ,  G03C1/64 ,  G03C1/732 ,  G03C1/74 ,  G03C1/775 ,  G03C8/04 ,  G03C8/10

    摘要： The production of photocatalytic color switching of redox imaging nanomaterials for rewritable media is disclosed. The new color switching system is based on photocatalytic redox reaction enabling reversible and considerably fast color switching in response to light irradiation. In accordance with an exemplary embodiment, the color switching system can include a photocatalyst and an imaging media. With the assistance of photocatalyst, UV light irradiation can rapidly reduce the redox imaging nanomaterials accompany with obvious color changing, while the resulting reduced system can be switched back to original color state through visible light irradiation or heating in air condition. The excellent performance of the new color switching system promises their potential use as an attractive rewritable media to meet increasing needs for sustainability and environmental protection.

    摘要翻译： 公开了用于可重写介质的氧化还原成像纳米材料的光催化颜色切换的产生。 新的颜色切换系统基于光催化氧化还原反应，可以在光照射的情况下实现可逆且相当快的颜色切换。 根据示例性实施例，颜色切换系统可以包括光催化剂和成像介质。 在光催化剂的帮助下，紫外光照射可以迅速降低氧化还原成像纳米材料伴随着明显的颜色变化，而通过可见光照射或在空气中加热所导致的还原系统可以切换回原始颜色状态。 新型色彩转换系统的卓越性能使其成为具有吸引力的可擦写介质，以满足日益增长的可持续发展和环境保护需求。

    METHOD OF FORMING PATTERNS
    4.
    发明公开
    METHOD OF FORMING PATTERNS 失效
    VERFAHREN ZUM FORMEN VON MUSTERN。

    公开(公告)号：EP0020776A1

    公开(公告)日：1981-01-07

    申请号：EP79901465.9

    申请日：1979-11-01

    申请人： Nippon Telegraph and Telephone Public Corporation

    发明人： YOSHIKAWA, Akira ,  OCHI, Osamu ,  HISAKI, Tomoko ,  MIZUSHIMA, Yoshihiko

    IPC分类号： H01L21/30 ,  G03F1/00 ,  G03C1/72 ,  G03C5/24

    CPC分类号： G03C1/705 ,  G03C5/56 ,  G03F1/00 ,  G03F7/0044 ,  H01L21/31116 ,  H01L21/314

    摘要： Method of forming patterns utilizing a photosensitive chalcogenide thin film comprising a lamination layer of amorphous chalcogenide thin film (2) and silver thin film (3). The amorphous chalcogenide thin film (22) of regions which are not exposed to light (6) or an accelerated particle beam and consequently are not doped with silver are removed by means of plasma etching with fluorine gas. According to this process, desired patterns of the amorphous chalcogenide thin film (21) doped with silver are left on a substrate. The remaining patterns are used as an etching mask to form the desired patterns on a substrate layer by a plasma etching method by removing a substrate layer (1 C).

    摘要翻译： 形成图案的方法，其中衬底上的光敏硫族化物膜暴露于图案限定的光或加速的粒子束，暴露部分被银涂覆，并且通过气体等离子体蚀刻除去未曝光的部分。 例如，在限定在硅晶片（1a）上的2000埃厚的SiO 2膜（1b）上形成厚度为1500埃的无定形硫族化物（Se75Ge25）膜（2），并且在其上形成80埃的银层， AgCN的分解。 然后，150秒 通过图案掩模（5）进行曝光，接着100秒。 浸在稀土中 溶胶。 的王水，然后7秒。 通过在保持在0.5托的CF 4气体上施加13.56MHZ场产生的CF 4气体等离子体进行蚀刻，并且除去未曝光部分（22）以在银上形成银掺杂Se75Ge25无定形材料（21）的图案界定层 SiO2薄膜。

    Phosphor film composition
    5.
    发明公开
    Phosphor film composition 失效
    发光层用组合物

    公开(公告)号：EP0712035A3

    公开(公告)日：1996-07-10

    申请号：EP95307453.1

    申请日：1995-10-19

    申请人： HEWLETT-PACKARD COMPANY

    发明人： Cutler, Gregory M. ,  Weber, Andreas

    IPC分类号： G03C1/705 ,  G03C7/00 ,  G03C5/16 ,  C09K11/08

    CPC分类号： C09K11/0822 ,  C09K11/0811 ,  C09K11/0816 ,  G03C1/705 ,  G03C5/16 ,  Y10S430/145

    摘要： A composition for use in constructing a photosensitive film (10) for recording an image. The composition comprises first, second, and third particles (12-14). Each particle type comprises a crystalline base material having a trap dopant and a color dopant deposited therein. Each color dopant has a different spectral sensitivity. In one embodiment, each of the trap dopants has a different activation energy for releasing electrons traps therein into the conduction band of the crystalline base material. In another embodiment, the base material is applied as a thin film and the dopant atoms (101-103) deposited therein in a pattern provide the equivalent of the three particle types (100-112).

    Method of producing printed circuit boards and products thus obtained
    7.
    发明公开
    Method of producing printed circuit boards and products thus obtained 失效
    生产印刷电路板和获得的产品的方法

    公开(公告)号：EP0066330A3

    公开(公告)日：1983-01-05

    申请号：EP82200611

    申请日：1982-05-18

    申请人： N.V. Philips' Gloeilampenfabrieken

    发明人： Jans, Johannes Maria

    IPC分类号： C23C03/02

    CPC分类号： G03C1/915 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/22 ,  G03C1/705 ,  H05K3/185 ,  H05K3/387

    摘要： The manufacture of printed circuit boards on substrate material with a thermosetting adhesive layer. The adhesive layer is roughened by spraying with a suspension of hard particles. Thereafter the surface is provided with a layer of uniformly distributed particles of a light-sensitive, semiconductive metal oxide by spraying with a suspension of said oxide particles, which oxide after exposure to light is capable of releasing copper and / or a metal which is nobler than copper from a solution of the relevant metal salt the layer is exposed to light and is sprayed prior to and/or after the exposure with a solution of the afore-said metal salt, so that metal nuclei are formed in the exposed areas. Both operations are effected by spraying and that in such a way that the semiconductive oxide and the metal salt, respectively are substantially dry when they reach the surface. After exposure, the nuclei are intensified by means of an electroless copper plating bath. The method may be a semi-additive or an additive method. The invented method makes it possible to manufacture products which are free from blisters in the copper pattern, in holes through the printed circuit board.

    Method of producing printed circuit boards
    8.
    发明公开
    Method of producing printed circuit boards 失效
    一种用于生产印刷电路的过程。

    公开(公告)号：EP0066330A2

    公开(公告)日：1982-12-08

    申请号：EP82200611.0

    申请日：1982-05-18

    申请人： Philips Electronics N.V.

    发明人： Jans, Johannes Maria

    IPC分类号： C23C18/54 ,  H05K3/38

    CPC分类号： G03C1/915 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/22 ,  G03C1/705 ,  H05K3/185 ,  H05K3/387

    摘要： The manufacture of printed circuit boards on substrate material with a thermosetting adhesive layer. The adhesive layer is roughened by spraying with a suspension of hard particles.
    Thereafter the surface is provided with a layer of uniformly distributed particles of a light-sensitive, semiconductive metal oxide by spraying with a suspension of said oxide particles, which oxide after exposure to light is capable of releasing copper and / or a metal which is nobler than copper from a solution of the relevant metal salt the layer is exposed to light and is sprayed prior to and/or after the exposure with a solution of the afore-said metal salt, so that metal nuclei are formed in the exposed areas. Both operations are effected by spraying and that in such a way that the semiconductive oxide and the metal salt, respectively are substantially dry when they reach the surface. After exposure, the nuclei are intensified by means of an electroless copper plating bath.
    The method may be a semi-additive or an additive method. The invented method makes it possible to manufacture products which are free from blisters in the copper pattern, in holes through the printed circuit board.