公开(公告)号：EP3712668A1

公开(公告)日：2020-09-23

申请号：EP19213972.3

申请日：2019-12-05

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： DeAngelo, Tim

IPC: G02B7/182

Abstract: An optical beam steering device (10) is disclosed which includes an optical component (12) for interacting with an optical beam, a gimbal (14) supporting the optical component, a roll cage (16) supporting the gimbal, and a mount (18) that houses and rotatably supports the roll cage. The roll cage and the mount include adjustment features allowing for both linear and angular adjustments of the gimbal and the roll cage.

公开(公告)号：EP3220177A1

公开(公告)日：2017-09-20

申请号：EP17158371.9

申请日：2017-02-28

Applicant: Rosemount Aerospace Inc.

Inventor： DeAngelo, Tim

IPC: G02B7/02 ,  F41G7/22

CPC classification number: G02B7/00 ,  F41G7/00 ,  F41G7/2293 ,  F42B30/006 ,  G02B7/007 ,  G02B7/02 ,  G02B7/021 ,  G02B7/025

Abstract: An optical assembly (20) for high-G application includes an optical element (22) formed from a brittle material. A rigid frame (24) with a channel surrounds the outer diameter region of the optical element (22). A compliant material (32, 34) fills the space between the rigid frame (24) and the outer diameter region of the optical element (22) to prevent physical contact between the rigid frame (24) and optical element (22) during a high-G event.

Abstract translation: 用于高G应用的光学组件（20）包括由脆性材料形成的光学元件（22）。 具有通道的刚性框架（24）围绕光学元件（22）的外径区域。 柔性材料（32,34）填充刚性框架（24）和光学元件（22）的外径区域之间的空间，以防止刚性框架（24）和光学元件（22）之间的物理接触在高 -G事件。

公开(公告)号：EP3407688A1

公开(公告)日：2018-11-28

申请号：EP18171913.9

申请日：2018-05-11

Applicant: Rosemount Aerospace Inc.

Inventor： DeAngelo, Tim

IPC: H05K1/11 ,  H01R12/52 ,  H05K3/36 ,  H05K1/14

CPC classification number: H01R12/58 ,  H01R12/52 ,  H01R43/205 ,  H05K1/11 ,  H05K1/144 ,  H05K1/145 ,  H05K3/007 ,  H05K3/366 ,  H05K3/368 ,  H05K3/4644 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325

Abstract: A circuit card assembly (10; 110; 210; 310) includes a first printed wiring board (28; 128; 228; 328) with a first receiving feature (38; 138; 238; 338) and a trace (12; 112; 212; 312) attached to the first printed wiring board (28; 128; 228; 328). The three dimensional trace (12; 112; 212; 312) is formed by layer-by-layer additive manufacturing. The three dimensional trace (12; 112; 212; 312) includes first (14; 114; 214; 314) and second ends. The first end (14; 114; 214; 314) of the three dimensional trace (12; 112; 212; 312) engages with the first receiving feature (38; 138; 238; 338) of the first printed wiring board (28; 128; 228; 328). The second end of the three dimensional trace (12; 112; 212; 312) is configured to engage with a second printed wiring board (40; 140; 240; 340).