公开(公告)号：EP2038818A4

公开(公告)日：2009-11-25

申请号：EP07767462

申请日：2007-06-19

申请人： SEMICONDUCTOR ENERGY LAB

发明人： DOZEN YOSHITAKA ,  AOKI TOMOYUKI ,  TAKAHASHI HIDEKAZU ,  YAMADA DAIKI ,  OGITA KAORI ,  KUSUMOTO NAOTO

IPC分类号： G06K19/077 ,  D21H21/48 ,  G06K19/07 ,  H01L21/336 ,  H01L29/786

CPC分类号： D21H21/48 ,  B32B29/00 ,  D21H27/32 ,  G06K19/07749 ,  H01L23/49855 ,  H01L27/1214 ,  H01L27/1255 ,  H01L27/1266 ,  H01L29/78603 ,  H01L2924/0002 ,  H01L2924/00

摘要： Paper embedded with a semiconductor device capable of communicating wirelessly is realized, whose unevenness of a portion including the semiconductor device does not stand out and the paper is thin with a thickness of less than or equal to 130 μm. A semiconductor device is provided with a circuit portion and an antenna, and the circuit portion includes a thin film transistor. The circuit portion and the antenna are separated from a substrate used during manufacturing, and are interposed between a flexible base and a sealing layer and protected. The semiconductor device can be bent, and the thickness of the semiconductor device itself is less than or equal to 30 μm. The semiconductor device is embedded in a paper in a papermaking process.