公开(公告)号：EP2891173A4

公开(公告)日：2016-03-30

申请号：EP13832999

申请日：2013-09-02

申请人： SEMICONDUCTOR TECH & INSTR INC

发明人： JIN JIAN PING ,  LEE LENG KHEAM

IPC分类号： H01L21/683 ,  H01L21/687

CPC分类号： H01L21/681 ,  B25J11/0095 ,  B25J15/0616 ,  B25J15/0658 ,  B25J15/0666 ,  G01B11/27 ,  G01N21/9501 ,  G01N2201/025 ,  H01L21/67144 ,  H01L21/67706 ,  H01L21/6838 ,  H01L21/68757 ,  Y10T29/49826

摘要： A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.

公开(公告)号：EP2891175A4

公开(公告)日：2016-03-02

申请号：EP13833045

申请日：2013-09-02

申请人： SEMICONDUCTOR TECH & INSTR INC

发明人： JIN JIAN PING ,  LEE LENG KHEAM

IPC分类号： H01L21/683 ,  H01L21/687

CPC分类号： H01L21/681 ,  B25J11/0095 ,  B25J15/0616 ,  B25J15/0658 ,  B25J15/0666 ,  G01B11/27 ,  G01N21/9501 ,  G01N2201/025 ,  H01L21/67144 ,  H01L21/67706 ,  H01L21/6838 ,  H01L21/68757 ,  Y10T29/49826

摘要： A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.