摘要:
The present invention relates in general to the field of industrial quality control processes, and more specifically to a system for measuring the thickness of a hollow glass container such as a bottle, vial or the like, and to a measuring method based on the use of such a system.
摘要:
A method of polishing a target surface of a waveguide to achieve perpendicularity relative to a reference surface is disclosed. The method includes i) providing a polishing apparatus having a polishing plate with a flat surface defining a reference plane, and an adjustable mounting apparatus configured to hold the waveguide during polishing at a plurality of angular orientations; ii) positioning an optical alignment sensor and a light reflecting apparatus such that a first collimated light beam is reflected off of a surface parallel to the reference plane, and a second perpendicular collimated light beam is reflected off of the reference surface; iii) aligning the waveguide within the polishing apparatus such that the reflections received by the optical alignment sensor align within the optical alignment sensor, thereby being indicative of perpendicularity between the reference plane and the reference surface; and iv) polishing the target surface of the aligned waveguide.
摘要:
A method of monitoring combustion properties in an interior of a boiler of the type having walls comprising a plurality of parallel steam tubes separated by a metal membrane. First and second penetrations are provided in the metal membrane between adjacent tubes on opposite sides of the boiler. A beam of light is projected through a pitch optic comprising a pitch collimating lens and a pitch relay lens, both residing outside the boiler interior. The pitch relay lens projects the beam through a penetration into the boiler interior. The beam of light is received with a catch optic substantially identical to the pitch optic residing outside the boiler interior. The strength of the collimated received beam of light is determined. At least one of the pitch collimating lens and the catch collimating lens may then be aligned to maximize the strength of the collimated received beam.
摘要:
An alignment member (10, 50) for alignment of a sensor board (12, 52) relative an optics unit (11, 51) is disclosed. The alignment member (10, 50) is arranged to couple the sensor board (12, 52) to the optics unit (11, 51). The alignment member (10, 50) comprises: a section (15) formed by a thermoplastic material and arranged to support the sensor board (12, 52); and a heating element (30a, 30b, 30c, 40, 41) which upon activation is arranged to transfer heat to the section such that the section (15) at least partly is heated to a temperature being at least the glass transition temperature for the thermoplastic material for enabling alignment of the sensor board (12, 52) relative the optics unit (11, 51). A camera arrangement (1, 5) comprising an alignment member (10, 50) and a method for aligning a sensor board relative an optics unit are also disclosed.
摘要:
The invention relates to a device (1) for measuring and alignment of a first component (2, 4) and a second component (3, 5) in relation to each other, where the device comprises a first detector unit (6) disposed to be mounted on the first component (2, 4) and a second detector unit (7) disposed to be mounted on the second component (3, 5) as well as a control unit (12) which is connected to the first detector unit (6) and the second detector unit (7). The device (1) comprises a first geometric pattern (16) disposed on the first detector unit (6) and a second geometric pattern disposed on the second detector unit (7). The position of the first geometric pattern (16) can be detected by the second detector unit (7) and the position of the second geometric pattern can be detected by the first detector unit (6). The invention also relates to a method for aligning a first component (2, 4) and a second component (3, 5).
摘要:
Presently disclosed robotic alignment systems (200) and methods (300) may allow for alignment of a platform (208) of a robot (202) with respect to an access port (218) of a part (204), such as a wing (102) of an aircraft (100). A robot (202) positioned under the wing (102) may include a base (206) and an upper platform (208) coupled together by a plurality of legs (210). The upper platform (208) may be moveable with respect to the base (206) in six degrees of freedom in order to be aligned with the access port (218) of the wing (102) so that the robot (202) may insert a tool through the access port (218) without damaging the wing (102). Disclosed robotic alignment systems (200) may include a calibration plate (226) that is inserted into the access port (218). A number of positioning devices (216) on the upper platform (208) of the robot (202) may interact with the calibration plate (226) in order to align the upper platform (208) with respect to the calibration plate (226), and thereby with respect to the access port (218).
摘要:
A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.
摘要:
A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.