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公开(公告)号：EP3012047B1
公开(公告)日：2018-11-21
申请号：EP13887342.7
申请日：2013-06-19
发明人： KAWASAKI Hiroyoshi , HASHIMOTO Tomohiko , IKEDA Atsushi , ROPPONGI Takahiro , SOMA Daisuke , SATO Isamu , KAWAMATA Yuji
IPC分类号： B22F1/00 , B22F1/02 , B23K35/14 , B23K35/26 , C22C13/00 , H01L21/60 , H05K3/34 , B23K35/30 , B23K35/02 , C22C9/00 , C22C43/00 , H01L23/498 , H01L23/556 , H01L23/00
CPC分类号： H01L24/13 , B22F1/025 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/30 , B23K35/302 , C22C9/00 , C22C13/00 , C22C43/00 , C23C28/021 , H01L23/49816 , H01L23/556 , H01L24/11 , H01L24/14 , H01L2224/111 , H01L2224/1112 , H01L2224/13014 , H01L2224/13016 , H01L2224/13111 , H01L2224/13147 , H01L2224/13347 , H01L2224/13411 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/16227 , H01L2924/1434 , H01L2924/3841 , H05K3/3457 , H05K2203/041 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01049 , H01L2924/00012 , H01L2924/00014 , H01L2924/01028 , H01L2924/01027 , H01L2924/01051 , H01L2924/01032 , H01L2924/01015 , H01L2924/01026 , H01L2924/01079 , H01L2924/01092 , H01L2924/0109 , H01L2924/01033 , H01L2924/0105 , H01L2924/01048 , H01L2924/01016 , H01L2924/01203 , H01L2924/01204 , H01L2924/0103
摘要： To provide a Cu core ball that prevents any soft errors and decreases any connection failure. A solder plating film formed on a surface of a Cu ball is an Sn solder plating film or is made of lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U content of 5 ppb or less and Th content of 5 ppb or less. The Cu ball includes purity of not less than 99.9 % through not more than 99.995%. Pb and/or Bi contents therein are a total of 1 ppm or more. A sphericity thereof is 0.95 or more. The obtained Cu core ball has ± dose of 0.0200 cph/cm 2 or less.
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公开(公告)号：EP3012047A1
公开(公告)日：2016-04-27
申请号：EP13887342.7
申请日：2013-06-19
发明人： KAWASAKI Hiroyoshi , HASHIMOTO Tomohiko , IKEDA Atsushi , ROPPONGI Takahiro , SOMA Daisuke , SATO Isamu , KAWAMATA Yuji
CPC分类号： H01L24/13 , B22F1/025 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/30 , B23K35/302 , C22C9/00 , C22C13/00 , C22C43/00 , C23C28/021 , H01L23/49816 , H01L23/556 , H01L24/11 , H01L24/14 , H01L2224/111 , H01L2224/1112 , H01L2224/13014 , H01L2224/13016 , H01L2224/13111 , H01L2224/13147 , H01L2224/13347 , H01L2224/13411 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/16227 , H01L2924/1434 , H01L2924/3841 , H05K3/3457 , H05K2203/041 , H01L2924/01082 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01049 , H01L2924/00012 , H01L2924/00014 , H01L2924/01028 , H01L2924/01027 , H01L2924/01051 , H01L2924/01032 , H01L2924/01015 , H01L2924/01026 , H01L2924/01079 , H01L2924/01092 , H01L2924/0109 , H01L2924/01033 , H01L2924/0105 , H01L2924/01048 , H01L2924/01016 , H01L2924/01203 , H01L2924/01204 , H01L2924/0103
摘要： To provide a Cu core ball that prevents any soft errors and decreases any connection failure.
A solder plating film formed on a surface of a Cu ball is an Sn solder plating film or is made of lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U content of 5 ppb or less and Th content of 5 ppb or less. The Cu ball includes purity of not less than 99.9 % through not more than 99.995%. Pb and/or Bi contents therein are a total of 1 ppm or more. A sphericity thereof is 0.95 or more. The obtained Cu core ball has α dose of 0.0200 cph/cm 2 or less.摘要翻译： 提供防止任何软错误并减少任何连接故障的铜芯球。 在Cu球的表面形成的焊锡镀膜是Sn焊锡镀膜，或者是由Sn的主要成分的无铅焊料合金构成。 焊料镀膜含有5ppb以下的U含量和5ppb以下的Th含量。 Cu球的纯度不低于99.9％，不超过99.995％。 其中Pb和/或Bi含量总共为1ppm以上。 其球形度为0.95以上。 得到的Cu芯球的剂量为0.0200cph / cm 2以下。
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