公开(公告)号：EP1321979A2

公开(公告)日：2003-06-25

申请号：EP02257616.9

申请日：2002-11-04

申请人： SHARP KABUSHIKI KAISHA

发明人： Nishikawa, Masataka

IPC分类号： H01L23/00 ,  H01L23/28

CPC分类号： H01L24/85 ,  H01L23/4334 ,  H01L23/49855 ,  H01L23/564 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0566 ,  H01L2224/05686 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/85148 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/05432 ,  H01L2924/013 ,  H01L2924/01404

摘要： A semiconductor module includes: a printed wiring board made of an insulator with conductor patterns formed on both sides thereof. An IC chip is mounted on the printed wiring board and sealed with a resin. A metallic sheet or moisture penetration blocking sheet is adhered on the IC chip surface opposite to the side that faces the printed wiring board.

摘要翻译： 一种半导体模块，包括：由具有形成在其bothsides导体图案的绝缘体的印刷布线板。 的IC芯片安装在印刷布线板和用树脂密封。 的金属片材或水分渗透阻挡片粘附在芯片上表面相对的IC到侧面做的印刷布线板。 半导体模块提供了对重环境条件的高可靠性：诸如高湿度或蒸汽加压气氛。 描述的制造方法来制造寻求的半导体模块。

公开(公告)号：EP1321979A3

公开(公告)日：2005-10-12

申请号：EP02257616.9

申请日：2002-11-04

申请人： SHARP KABUSHIKI KAISHA

发明人： Nishikawa, Masataka

IPC分类号： H01L23/00 ,  H01L23/28

CPC分类号： H01L24/85 ,  H01L23/4334 ,  H01L23/49855 ,  H01L23/564 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0566 ,  H01L2224/05686 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/85148 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/05432 ,  H01L2924/013 ,  H01L2924/01404

摘要： A semiconductor module includes: a printed wiring board made of an insulator with conductor patterns formed on both sides thereof. An IC chip is mounted on the printed wiring board and sealed with a resin. A metallic sheet or a moisture penetration blocking sheet is adhered on the IC chip surface opposite to the side that faces the printed wiring board. The semiconductor module provides high reliability against heavy environment conditions such as high humidity or vapor pressurised atmosphere. The production method to manufacture such a semiconductor module is described.