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23 条记录 (耗时 0.017 秒)

    Wire saw and method of slicing a cylindrical workpiece, e.g. an ingot
    5.
    发明公开
    Wire saw and method of slicing a cylindrical workpiece, e.g. an ingot 失效
    德尔茨堡和维尔法罕zum Zerschneiden eines zylindrischenWerkstücks，wie锭

    公开(公告)号：EP0798091A2

    公开(公告)日：1997-10-01

    申请号：EP97302064.7

    申请日：1997-03-26

    申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED

    发明人： Kiuchi, Etsuo ,  Hayakawa, Kazuo ,  Toyama, Kohei

    IPC分类号： B28D5/04 ,  B28D1/02

    CPC分类号： B28D5/0064 ,  B28D5/007 ,  B28D5/045 ,  Y02P70/179

    摘要： In a wire saw for slicing a cylindrical workpiece such as a silicon ingot so as to obtain wafers or the like, the feed rate of slurry fed to the workpiece, the viscosity of the slurry, or the feed rate of a wire is varied according to the cutting length in the workpiece or the angle between the wire and the circumference of the workpiece. It becomes possible to obtain wafers or the like, each having a uniform thickness.

    摘要翻译： 在用于切割诸如硅锭的圆柱形工件的线锯中，以获得晶片等，供给到工件的浆料的进料速率，浆料的粘度或者丝线的进给速率根据 工件中的切割长度或线材与工件周长之间的角度。 可以获得各自具有均匀厚度的晶片等。

    Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein
    8.
    发明公开
    Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein 失效
    Verfahren und Apparat zum Zerschneiden von Einkristallbarren mittels einerInnenlochsäge。

    公开(公告)号：EP0476952A2

    公开(公告)日：1992-03-25

    申请号：EP91308434.9

    申请日：1991-09-16

    申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED

    发明人： Toyama, Kohei

    IPC分类号： B28D5/02 ,  B28D7/04 ,  B23D59/00 ,  B23D59/02 ,  B23D15/12 ,  G05B19/18

    CPC分类号： B23D59/001 ,  B23D59/02 ,  B23Q11/04 ,  B23Q15/12 ,  B24B49/18 ,  B24B53/00 ,  B28D5/024 ,  B28D5/028

    摘要： An improved method of using an ID saw slicing machine (1) for slicing a single crystal ingot (6) in a direction normal to the axis of the ingot (6) to obtain wafers, of which the improvement lies in that the cutting load which the blade (2) of the ID saw slicing machine (1) imposes upon the single crystal ingot (6) is continually detected in terms of three vector elements along three mutually perpendicular directions throughout the slicing operation, and that, when the magnitude of that vector element of the cutting load which extends in the slicing direction exceeds a predetermined value, the feed rate of the ingot (6) to the blade (2) is decreased and, at the same time, the rotational speed of the blade is increased in accordance with a predetermined control pattern.

    摘要翻译： 一种改进的使用ID锯切机（1）在垂直于锭（6）的方向上切割单晶锭（6）的方法，以获得晶片，其改进之处在于切割负载 在整个切片操作中，沿着三个相互垂直的方向，以三个矢量元素连续地检测到ID锯切机（1）施加在单晶锭（6）上的刀片（2），并且当其大小 在切片方向上延伸的切削负载的向量元素超过预定值，锭（6）对叶片（2）的进给速度降低，同时叶片的转速增加 根据预定的控制模式。

    Wire saw and method of slicing a cylindrical workpiece
    10.
    发明公开
    Wire saw and method of slicing a cylindrical workpiece 失效
    Drahtsägeund Verfahren zum Zerschneiden eines zylindrischenWerkstücks

    公开(公告)号：EP1371467A1

    公开(公告)日：2003-12-17

    申请号：EP03019947.5

    申请日：1997-03-26

    申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED

    发明人： Kiuchi, Etsuo ,  Hayakawa, Kazuo ,  Toyama, Kohei

    IPC分类号： B28D5/04 ,  B28D5/00

    CPC分类号： B28D5/0064 ,  B28D5/007 ,  B28D5/045 ,  Y02P70/179

    摘要： In a wire saw for slicing a cylindrical workpiece such as a silicon ingot so as to obtain wafers or the like, the feed rate of slurry, fed to the workpiece, the viscosity of the slurry, or the feed rate of a wire is varied according to the cutting length in the workpiece or the angle between the wire and the circumference of the workpiece. It becomes possible to obtain wafers or the like, each having a uniform thickness.

    摘要翻译： 在用于切割诸如硅锭的圆柱形工件以获得晶片等的线锯中，馈送到工件的浆料的进料速率，浆料的粘度或者丝的进给速率根据 到工件的切割长度或者线与工件的圆周之间的角度。 可以获得各自具有均匀厚度的晶片等。