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    NOISE SUPPRESSING WIRING MEMBER AND PRINTED WIRING BOARD
    1.
    发明公开
    NOISE SUPPRESSING WIRING MEMBER AND PRINTED WIRING BOARD 审中-公开
    RAUSCHUNTERDRÜCKUNGS-VERDRAHTUNGSGLIED UND LEI​​TERPLATTE

    公开(公告)号：EP2048919A1

    公开(公告)日：2009-04-15

    申请号：EP07767924.9

    申请日：2007-06-29

    申请人： Shin-Etsu Polymer Co. Ltd.

    发明人： KAWAGUCHI, Toshiyuki ,  TAHARA, Kazutoki ,  SAGA, Tsutomu ,  NEGISHI, Mitsuaki

    IPC分类号： H05K1/02 ,  H05K9/00

    CPC分类号： H05K1/0234 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0191 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2201/093 ,  H05K2201/09309

    摘要： The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 µm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.

    摘要翻译： 布线构件技术领域本发明涉及一种布线构件，其包括：具有表面粗糙度Rz为2μm以下的光滑表面的铜箔层; 含有金属材料或导电陶瓷的噪声抑制层，其厚度为5〜200nm; 以及设置在铜箔层的光滑表面和噪声抑制层之间的绝缘树脂层，并且还涉及配备有配线构件的印刷线路板。 此外，本发明涉及一种噪声抑制结构，包括：第一导电层; 第二导电层; 设置在第一导电层和第二导电层之间的噪声抑制层，噪声抑制层与第一导电层电磁耦合，噪声抑制层包括金属材料或导电陶瓷，噪声抑制层 具有5〜300nm的厚度; 设置在所述第一导电层和所述噪声抑制层之间的第一绝缘层; 以及设置在所述第二导电层和所述噪声抑制层之间的第二绝缘层; 其中所述噪声抑制结构具有：所述噪声抑制层和所述第一导电层彼此面对的区域（I）; 以及区域（I）和（II）彼此相邻的区域（II），其中噪声抑制层和第一导电层彼此不相对，但噪声抑制层和第二导电层彼此面对。

    CAPACITOR AND METHOD FOR FABRICATING THE CAPACITOR
    4.
    发明公开
    CAPACITOR AND METHOD FOR FABRICATING THE CAPACITOR 有权
    KONDENSATOR UND VERFAHREN ZUR HERSTELLUNG DES KONDENSATORS

    公开(公告)号：EP1993113A1

    公开(公告)日：2008-11-19

    申请号：EP07714695.9

    申请日：2007-02-21

    申请人： SHIN-ETSU POLYMER CO., LTD.

    发明人： YOSHIDA, Kazuyoshi ,  NING, Tailu ,  FUJIKI, Hironao ,  NEGISHI, Mitsuaki

    IPC分类号： H01G9/028 ,  H01G9/00

    CPC分类号： H01G9/0036 ,  H01G9/028 ,  H01G9/042 ,  H01G11/48 ,  H01G11/52 ,  H01G11/56 ,  Y02E60/13 ,  Y10T29/417

    摘要： A capacitor having a high degree of electric strength, a high electrostatic capacity, and a low ESR, which can be readily downsized, is provided. The capacitor 10 according to the present invention includes an anode 11 made of porous valve metal, a dielectric layer 12 formed by oxidizing the surface of the anode 11, and a solid electrolyte layer 13 formed on the surface of the dielectric layer 12. The solid electrolyte layer 13 includes a π conjugated conductive polymer, a polyanion, and an ion-conductive compound.

    摘要翻译： 提供了可以容易地缩小尺寸的具有高的电强度，高静电容量和低ESR的电容器。 根据本发明的电容器10包括由多孔阀金属制成的阳极11，通过氧化阳极11的表面形成的电介质层12和形成在电介质层12的表面上的固体电解质层13.固体 电解质层13包括共轭导电聚合物，聚阴离子和离子导电化合物。