公开(公告)号：EP0137981B1

公开(公告)日：1991-08-07

申请号：EP84110077.9

申请日：1984-08-23

Applicant: SHIPLEY COMPANY INC.

Inventor： Deckert, Cheryl A. ,  Couble, Edward C. ,  Bonetti, William F.

IPC: H05K3/42 ,  H05K3/38 ,  C23C18/22

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796

公开(公告)号：EP0137981A3

公开(公告)日：1986-08-13

申请号：EP84110077

申请日：1984-08-23

Applicant: SHIPLEY COMPANY INC.

Inventor： Deckert, Cheryl A. ,  Couble, Edward C. ,  Bonetti, William F.

IPC: H05K03/42

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.

公开(公告)号：EP0137981A2

公开(公告)日：1985-04-24

申请号：EP84110077.9

申请日：1984-08-23

Applicant: SHIPLEY COMPANY INC.

Inventor： Deckert, Cheryl A. ,  Couble, Edward C. ,  Bonetti, William F.

IPC: H05K3/42 ,  H05K3/38 ,  C23C18/22

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.