公开(公告)号：EP0137981B1

公开(公告)日：1991-08-07

申请号：EP84110077.9

申请日：1984-08-23

Applicant: SHIPLEY COMPANY INC.

Inventor： Deckert, Cheryl A. ,  Couble, Edward C. ,  Bonetti, William F.

IPC: H05K3/42 ,  H05K3/38 ,  C23C18/22

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796

公开(公告)号：EP0421123A1

公开(公告)日：1991-04-10

申请号：EP90116660.3

申请日：1990-08-30

Applicant: SHIPLEY COMPANY INC.

Inventor： Rychwalski, James ,  Ciccolo, Paul J. ,  Couble, Edward C.

IPC: C23C18/26

CPC classification number: C23C26/00 ,  C23C18/26 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381 ,  Y10T428/31681

Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.

Abstract translation: 促进金属与热塑性基材如聚酰亚胺粘合的方法。 改进之处在于在蚀刻和沉积金属涂层之后的步骤之前，用内酯和含水漂洗液处理底物。 使用这种调理剂促进了基材和金属之间增加的粘合性，而在后续的加工步骤中不损失基材的内聚完整性。

公开(公告)号：EP0137981A3

公开(公告)日：1986-08-13

申请号：EP84110077

申请日：1984-08-23

Applicant: SHIPLEY COMPANY INC.

Inventor： Deckert, Cheryl A. ,  Couble, Edward C. ,  Bonetti, William F.

IPC: H05K03/42

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.

公开(公告)号：EP0137981A2

公开(公告)日：1985-04-24

申请号：EP84110077.9

申请日：1984-08-23

Applicant: SHIPLEY COMPANY INC.

Inventor： Deckert, Cheryl A. ,  Couble, Edward C. ,  Bonetti, William F.

IPC: H05K3/42 ,  H05K3/38 ,  C23C18/22

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796

Abstract: Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.