PHOTOLITHOGRAPHISCHE STRUKTURERZEUGUNG
    6.
    发明授权
    PHOTOLITHOGRAPHISCHE STRUKTURERZEUGUNG 失效
    光刻结构生产

    公开(公告)号:EP0781424B1

    公开(公告)日:1998-11-18

    申请号:EP95929739.1

    申请日:1995-09-01

    IPC分类号: G03F7/38 G03F7/022

    摘要: The invention concerns a photolithographic method of producing sub-micron structural features by applying to a substrate a photosensitive resist layer consisting of a polymer containing tert.-butyl ester or tert.-butoxycarbonyloxy groups, a photosensitive component (in the form of an ester of naphthoquinonediazide-4-sulphonic acid and an aromatic hydroxy compound) and a suitable solvent. The photoresist is then dried, illuminated imagewise, heated at a temperature between 120 and 150 DEG C for 100 to 600 s and wet-developed (single-layer resist system). The invention also concerns a method in which an analogous two-layer resist system is used.

    VERFAHREN ZUR PHOTOLITHOGRAPHISCHEN STRUKTURERZEUGUNG
    7.
    发明公开
    VERFAHREN ZUR PHOTOLITHOGRAPHISCHEN STRUKTURERZEUGUNG 失效
    用于生产光刻图案

    公开(公告)号:EP0808481A1

    公开(公告)日:1997-11-26

    申请号:EP96900861.0

    申请日:1996-01-29

    IPC分类号: G03F7 B82B1 H01L21

    摘要: The invention concerns a process for the photolithographic generation of structures in the sub-200-nm region, wherein a layer of amorphous hydrogenous carbon (a-C:H) with an optical band gap of less than 1 eV or a layer of sputtered amorphous carbon (a-C) is applied as bottom resist to a substrate (layer thickness: ≤ 500 nm). The bottom resist is provided with a layer of an electron beam-sensitive silicon-containing or silylatable photoresist as the top resist (layer thickness: ≤ 50 nm); the top resist is structured by means of scanning tunneling microscopy (STM) or scanning force microscopy (SFM) with electrons of a force of ≤ 80 eV. The structure is then imparted by etching with an anisotropic oxygen plasma to the bottom resist and then to the substrate by plasma etching.

    VERFAHREN ZUR PHOTOLITHOGRAPHISCHEN STRUKTURERZEUGUNG
    8.
    发明授权
    VERFAHREN ZUR PHOTOLITHOGRAPHISCHEN STRUKTURERZEUGUNG 失效
    用于生产光刻图案

    公开(公告)号:EP0808481B1

    公开(公告)日:1999-06-02

    申请号:EP96900861.4

    申请日:1996-01-29

    IPC分类号: G03F7/20 G03F7/09 G03F7/26

    摘要: The invention concerns a process for the photolithographic generation of structures in the sub-200-nm region, wherein a layer of amorphous hydrogenous carbon (a-C:H) with an optical band gap of less than 1 eV or a layer of sputtered amorphous carbon (a-C) is applied as bottom resist to a substrate (layer thickness: ≤ 500 nm). The bottom resist is provided with a layer of an electron beam-sensitive silicon-containing or silylatable photoresist as the top resist (layer thickness: ≤ 50 nm); the top resist is structured by means of scanning tunneling microscopy (STM) or scanning force microscopy (SFM) with electrons of a force of ≤ 80 eV. The structure is then imparted by etching with an anisotropic oxygen plasma to the bottom resist and then to the substrate by plasma etching.

    PHOTOLITHOGRAPHISCHE STRUKTURERZEUGUNG

    公开(公告)号:EP0797792B1

    公开(公告)日:1998-11-18

    申请号:EP95929737.5

    申请日:1995-09-01

    IPC分类号: G03F7/38 G03F7/022

    摘要: The invention concerns a photolithographic method of producing sub-micron structural features by applying to a substrate a photosensitive-resist layer consisting of a polymer containing carboxylic acid anhydride groups and tert.-butyl ester or tert.-butoxycarbonyloxy groups, a photosensitive component (in the form of an ester of naphthoquinonediazide-4-sulphonic acid and an aromatic or aliphatic-aromatic hydroxy compound) and a suitable solvent. The photoresist is then dried, illuminated in accordance with the circuit drawing and heated at a temperature between 120 and 150 DEG C for 100 to 600 s, after which the photoresist layer is subjected to liquid silylation and dry-developed in an anisotropic oxygen plasma.

    摘要翻译: 本发明涉及一种通过在基底上涂覆由含有羧酸酐基团和叔丁基酯或叔丁氧基羰氧基团的聚合物组成的光敏抗蚀剂层,光敏组分(在 萘醌二叠氮化物-4-磺酸与芳族或脂族 - 芳族羟基化合物的酯的形式)和合适的溶剂。 然后干燥光刻胶,根据电路图进行照明,并在120-150℃的温度下加热100-600秒,然后将光刻胶层进行液体甲硅烷基化并在各向异性氧等离子体中干显影。

    PHOTOLITHOGRAPHISCHE STRUKTURERZEUGUNG
    10.
    发明公开
    PHOTOLITHOGRAPHISCHE STRUKTURERZEUGUNG 失效
    光刻胶

    公开(公告)号:EP0781424A1

    公开(公告)日:1997-07-02

    申请号:EP95929739.0

    申请日:1995-09-01

    IPC分类号: G03F7 H01L21

    摘要: The invention concerns a photolithographic method of producing sub-micron structural features by applying to a substrate a photosensitive resist layer consisting of a polymer containing tert.-butyl ester or tert.-butoxycarbonyloxy groups, a photosensitive component (in the form of an ester of naphthoquinonediazide-4-sulphonic acid and an aromatic hydroxy compound) and a suitable solvent. The photoresist is then dried, illuminated imagewise, heated at a temperature between 120 and 150 °C for 100 to 600 s and wet-developed (single-layer resist system). The invention also concerns a method in which an analogous two-layer resist system is used.