公开(公告)号：EP2702842A4

公开(公告)日：2014-10-01

申请号：EP12864805

申请日：2012-04-10

Applicant: SOLIGIE INC

Inventor： TATE MICHAEL J ,  SIME DAVID G

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/189 ,  H05K1/038 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10037 ,  Y10T29/49204

Abstract: Embodiments relate to coupling and/or holding devices for electrically and/or mechanically contacting circuit elements, such as power sources, sensors, transducers and other devices. In one embodiment, a coupling device comprises a substrate having at least one printed conductive element and at least one fold, flap, slit, slot, perforation or other alteration configured to encourage contact between a circuit element, such as a battery, sensor, transducer or other element, and the at least one printed conductive element.

Abstract translation: 实施例涉及用于电和/或机械接触电路元件（例如电源，传感器，换能器和其它装置）的装置和/或保持装置。 在一个实施例中，耦合装置包括具有至少一个印刷导电元件和至少一个折叠，折片，狭缝，狭槽，穿孔或其它变化的基板，所述至少一个折叠，折片，狭缝，狭槽，穿孔或其它变化被配置为促进电路元件（例如电池，传感器，换能器 或其它元件，以及所述至少一个印刷导电元件。