摘要:
A fully self-aligned polycrystalline silicon emitter bipolar transistor. Self-alignment of the p + base contact (12) is achieved by using oxidised sidewalls (8) (sidewall spacers) of the emitter mesa (7) as part of the p + base contact implantation mask. Collector contact (13) alignment can be achieved using oxidised sidewalls (17) of polycrystalline silicon alignment mesas (14) defined inthe same polysilicon asthe emitter mesa (7) but deposited on oxide (2) rather than the implanted base region (5).
摘要:
A method of manufacturing a bipolar transistor (1) with semi-self-aligned p⁺ base contacts (27,27a). A base p-type region (28) is formed in a surface region of an n-type region 5 comprising a collector. An element (29) of, for example, n⁺ doped polycrystalline silicon, and comprising an emitter, is formed on the surface in contact with the base region (28). The base contacts (27,27a) are formed by implantation and using the element (29) as a mask. An n⁺ collector contact (25) is made to the n-type region (5).
摘要:
A bipolar transistor structure (1) which can be used in an integrated circuit where bipolar (1) and CMOS transistors (2, 3) are formed simultaneously on one substrate. In integrated circuit form the material, for example polycrystalline silicon, used for the gates (11, 21) of the CMOS transistors is also used for the emitters (29) of the bipolar transistors, the collectors of the bipolar devices are comprised by doped wells (5) in the substrate (4) and the base contacts of the bipolar devices are comprised by regions (27, 27a) equivalent to source and drain regions (17, 18) of the n-well MOS transistors and bridged by base implants (28). The conventional CMOS processing is modified by the addition of two masking steps and one implant (baseimplant). One masking step defines the area for the base implant (28) and the other masking step defines an area of the oxide (30) over the base implant which must be removed to allow contact between the polycrystalline silicon (29), which is suitably doped to provide the emitter, and the base (27, 27a, 28). The base contacts are produced in a semi-self-aligned manner.
摘要:
A bipolar transistor structure (1) which can be used in an integrated circuit where bipolar (1) and CMOS transistors (2, 3) are formed simultaneously on one substrate. In integrated circuit form the material, for example polycrystalline silicon, used for the gates (11, 21) of the CMOS transistors is also used for the emitters (29) of the bipolar transistors, the collectors of the bipolar devices are comprised by doped wells (5) in the substrate (4) and the base contacts of the bipolar devices are comprised by regions (27, 27a) equivalent to source and drain regions (17, 18) of the n-well MOS transistors and bridged by base implants (28). The conventional CMOS processing is modified by the addition of two masking steps and one implant (baseimplant). One masking step defines the area for the base implant (28) and the other masking step defines an area of the oxide (30) over the base implant which must be removed to allow contact between the polycrystalline silicon (29), which is suitably doped to provide the emitter, and the base (27, 27a, 28). The base contacts are produced in a semi-self-aligned manner.
摘要:
An integrated circuit for a telephone instrument provides the basic (POT) service requirement. The circuit has means whereby the transmit and receive channels may be fed via controlled attenuators incorporated in an ancillary circuit to provide hands-free operation. The circuit also includes a current limited power supply whereby connection to a further ancillary circuit including an audio amplifier may be effected to provide loudspeaker operation.