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    PACKAGED ELECTRONIC SYSTEM FORMED BY ELECTRICALLY CONNECTED AND GALVANICALLY ISOLATED DICE
    2.
    发明公开
    PACKAGED ELECTRONIC SYSTEM FORMED BY ELECTRICALLY CONNECTED AND GALVANICALLY ISOLATED DICE 审中-公开

    公开(公告)号：EP4036968A1

    公开(公告)日：2022-08-03

    申请号：EP22153019.9

    申请日：2022-01-24

    Applicant: STMicroelectronics S.r.l.

    Inventor： PACI, Dario ,  ADORNO, Silvia ,  DEL SARTO, Marco ,  CERINI, Fabrizio ,  GRITTI, Alex

    IPC: H01L23/48 ,  H01L23/538

    Abstract: A packaged electronic system having a support (55) formed by an insulating organic substrate housing a buried conductive region (56) that is floating. A first die (51) is fixed to the support and carries, on a first main surface, a first die contact region (67) capacitively coupled to a first portion of the buried conductive region. A second die (52) is fixed to the support and carries, on a first main surface, a second die contact region (67) capacitively coupled to a second portion of the buried conductive region. A packaging mass (77) encloses the first die (51), the second die (52), the first die contact region, the second die contact region, and, at least partially, the support (55).

    MEMS THERMOELECTRIC GENERATOR, MANUFACTURING PROCESS OF THE GENERATOR AND HEATING SYSTEM COMPRISING THE GENERATOR
    4.
    发明公开
    MEMS THERMOELECTRIC GENERATOR, MANUFACTURING PROCESS OF THE GENERATOR AND HEATING SYSTEM COMPRISING THE GENERATOR 审中-公开

    公开(公告)号：EP4284148A1

    公开(公告)日：2023-11-29

    申请号：EP23172050.9

    申请日：2023-05-08

    Applicant: STMicroelectronics S.r.l.

    Inventor： FERRARI, Paolo ,  VILLA, Flavio Francesco ,  DEL SARTO, Marco

    IPC: H10N10/13 ,  H10N10/17 ,  H10N19/00

    Abstract: MEMS thermoelectric generator (10) comprising: a thermoelectric cell (100) including one or more thermoelectric elements (110) partially extending on a cavity of the thermoelectric cell (100); a total thermoplastic layer (20; 20, 48) extending on the thermoelectric cell (100) and having a top surface (20a; 52a) and a bottom surface (20b) opposite to each other along a first axis (Z), the bottom surface (20b) facing the thermoelectric cell (100) and the total thermoplastic layer (20; 20, 48) being of thermally insulating material and configured to be processed through laser direct structuring, LDS, technique; a heat sink (14) configured to exchange heat with the thermoelectric cell (100) interposed, along the first axis (Z), between the heat sink (14) and the total thermoplastic layer (20; 20, 48); and a thermal via (30; 30, 50) of metal material, extending through the total thermoplastic layer (20; 20, 48) from the top surface (20a; 52a) to the bottom surface (20b) so that it is superimposed, along the first axis (Z), on the cavity (115), wherein the thermoelectric cell (100) may exchange heat with a thermal source (12) through the thermal via (30; 30, 50).

    A PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES, IN PARTICULAR ELECTROACOUSTIC MODULES
    5.
    发明公开
    A PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES, IN PARTICULAR ELECTROACOUSTIC MODULES 审中-公开

    公开(公告)号：EP3599217A1

    公开(公告)日：2020-01-29

    申请号：EP19187949.3

    申请日：2019-07-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： QUAGLIA, Fabio ,  FERRERA, Marco ,  DEL SARTO, Marco

    IPC: B81C1/00

    Abstract: A process for manufacturing MEMS devices (101), including the step of forming a first assembly (74), which comprises: a dielectric region (122); a redistribution region (128); and a plurality of unit portions (76). Each unit portion (76) of the first assembly (74) includes: a die (2, 4), arranged in the dielectric region; and a plurality of first and second connection elements (18, 20), which give out onto opposite faces of the redistribution region (128) and are connected together by means of paths (30, 32) that extend in the redistribution region (128), the first connection elements (18, 20) being coupled to the die (2, 4). The process further includes the steps of: forming a second assembly (80; 110), which comprises a plurality of respective unit portions (84; 284), each of which includes a semiconductor portion (82; 282) and third connection elements (36, 50); mechanically coupling the first and second assemblies (74, 80; 74, 110) so as to connect the third connection elements (36, 50) to corresponding second connection elements (34); and then removing at least part of the semiconductor portion (82; 282) of each unit portion (84; 284) of the second assembly (80; 110), thus forming corresponding membranes (40).

    INTEGRATED ELECTRONIC MODULE INCLUDING TWO MICROMIRRORS, AND SYSTEM INCLUDING THE ELECTRONIC MODULE
    7.
    发明公开
    INTEGRATED ELECTRONIC MODULE INCLUDING TWO MICROMIRRORS, AND SYSTEM INCLUDING THE ELECTRONIC MODULE 审中-公开

    公开(公告)号：EP3974889A1

    公开(公告)日：2022-03-30

    申请号：EP21198930.6

    申请日：2021-09-24

    Applicant: STMicroelectronics S.r.l.

    Inventor： DEL SARTO, Marco ,  GRITTI, Alex ,  MAIERNA, Amedeo ,  MAGGI, Luca

    IPC: G02B26/08 ,  G02B26/10

    Abstract: An electronic module (30) comprising: a first die (35) of semiconductor material including a first reflector (10); a second die (36) of semiconductor material including a second reflector (20); and a frame (31) including a first supporting portion and a second supporting portion (32, 33) parallel to one another. The first and second dies (35, 36) are carried, respectively, by the first and second supporting portions (32, 33) and are respectively arranged so that the first reflector (10) faces the second supporting portion and the second reflector (20) faces the first supporting portion (32). An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.

    A METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICE
    8.
    发明公开
    A METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3718961A1

    公开(公告)日：2020-10-07

    申请号：EP20164126.3

    申请日：2020-03-19

    Applicant: STMicroelectronics (Malta) Ltd ,  STMicroelectronics S.r.l.

    Inventor： FORMOSA, Kevin ,  DEL SARTO, Marco

    IPC: B81C1/00

    Abstract: A method of manufacturing electronic devices (10), comprises providing on a support member (20) such as a tape:
    - a first electronic component (12), such as a sensor, having opposed first (12a) and second (12b) surfaces and arranged on the support member (20) with the second surface (12b) towards the support member (20), wherein the first electronic component (12) has a thickness between the opposed first (12a) and second (12b) surfaces,
    - a second electronic component (14), such as an IC, mounted on a substrate (16) and arranged on the support member (20) with a substrate surface opposed the second electronic component (14) and facing towards the support member (20), wherein the substrate (16) and the second electronic component (14) have a joint thickness which is less than the thickness of the first electronic component (12),
    - molding onto the support member (20) having arranged thereon the first (12) and second (14) electronic components package molding material (24) to encapsulate the second electronic component (14) and leaving exposed the first surface (12a) of the first electronic component (12), and
    - separating the support member (20) to expose the second surface (12b) of the first electronic component (12) and the substrate surface of the substrate (16) opposed the at least one second electronic component (14) .

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