摘要:
A memory architecture (10) is described of the type comprising at least one matrix (2) of memory cells of the EEPROM type (3) organised in rows or word lines (WL) and columns or bit lines (BL), each memory cell (3) comprising a floating gate cell transistor (MC) and a selection transistor (TS) and being connected to a source line (SL) shared by the matrix (2). The memory cells (3) are organised in words (6), all the memory cells (3) belonging to a same word (6) being driven by a byte switch (5), in turn connected to at least one control gate line (CGT). Advantageously according to the invention, the memory cells (3) have accessible substrate terminals connected to a first additional line (EEW). Also a biasing method of a memory architecture is described.
摘要:
This invention relates to a method of adjusting the erase/program voltage in semiconductor non-volatile memories. The memories are formed of at least one matrix of memory cells having a floating gate, a control gate, and drain and source terminals, and are organised by the byte in rows (WL) and columns (BL), each byte comprising a group of cells having respective control gates connected in parallel with one another to a common control line (CG) through a selection element of the byte switch type, and each cell being connected to a respective control column (BL) through a selection element of the bit switch type. Advantageously, a double adjustment is provided for the program voltage of the memory cells, whereby the program voltage during the erasing phase can be higher in modulo than the program voltage during the writing phase. This is achieved by forming the bit switch element (20) inside a well (13) and the byte switch element (21) directly in the substrate.
摘要:
This invention relates to a method of adjusting the erase/program voltage in semiconductor non-volatile memories. The memories are formed of at least one matrix of memory cells having a floating gate, a control gate, and drain and source terminals, and are organized by the byte in rows (WL) and columns (BL), each byte comprising a group of cells having respective control gates connected in parallel with one another to a common control line (CG) through a selection element of the byte switch type, and each cell being connected to a respective control column (BL) through a selection element of the bit switch type. Advantageously, a double adjustment is provided for the program voltage of the memory cells, whereby the program voltage during the erasing phase can be higher in modulo than the program voltage during the writing phase. This is achieved by providing respective adjusters (4,5) connected between a generator (7) of a program voltage (Vpp) and the cell matrix, or alternatively forming the bit switch element (20) inside a well (13) and the byte switch element (21) directly in the substrate.
摘要:
This invention relates to a method of adjusting the erase/program voltage in semiconductor non-volatile memories. The memories are formed of at least one matrix of memory cells having a floating gate, a control gate, and drain and source terminals, and are organised by the byte in rows (WL) and columns (BL), each byte comprising a group of cells having respective control gates connected in parallel with one another to a common control line (CG) through a selection element of the byte switch type, and each cell being connected to a respective control column (BL) through a selection element of the bit switch type. Advantageously, a double adjustment is provided for the program voltage of the memory cells, whereby the program voltage during the erasing phase can be higher in modulo than the program voltage during the writing phase. This is achieved by forming the bit switch element (20) inside a well (13) and the byte switch element (21) directly in the substrate.
摘要:
Field effect transistor (1) integrated on a semiconductor substrate (4) with a respective active area (8) comprising:
a region of source (2) and a region of drain (3) formed in the semiconductor substrate (4), a channel region (5) interposed between said regions of source (2) and of drain (3) having a predefined nominal width (W N ), wherein said channel region (5) has an effective width (Weff) defined by a variable profile of doping.
摘要:
Phase-change memory device, wherein memory cells (2) are arranged in rows (7) and columns (6) and form a memory array. The memory cells (2) are formed by a selection device (4) of an MOS type and by a phase-change region (3) connected to the selection device. The selection device (4) is formed by a first conductive region (32) and a second conductive region (33), which extend in a substrate (31) of semiconductor material and are spaced from one another via a channel region (34), and by an isolated control region (36) connected to a respective row (7) and overlying the channel region (34). The first conductive region (32) is connected to a connection line (42) extending parallel to the rows, the second conductive region (33) is connected to the phase-change region (46), and the phase-change region is connected to a respective column (6). The first connection line (42) is a metal interconnection line and is connected to the first conductive region (32) via a source-contact region (40) made as point contact and distinct from the first connection line (42).
摘要:
A memory device is proposed. The memory device includes a plurality of memory cells (P,S), wherein each memory cell includes a storage element (P) and a selector (S) for selecting the corresponding storage element during a reading operation or a programming operation. The selector includes a unipolar element (M) and a bipolar element (D;B). The memory device further includes control means (110s) for prevalently enabling the unipolar element during the reading operation or the bipolar element during the programming operation.