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    Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom
    3.
    发明公开
    Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom 失效
    Polyhydrisches苯酚和水分子Epoxydharz und Epoxydharzzusammensetzung。

    公开(公告)号：EP0536749A1

    公开(公告)日：1993-04-14

    申请号：EP92117201.1

    申请日：1992-10-08

    申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Saito, Noriaki ,  Morimoto, Takashi ,  Takebe, Kazuo ,  Shiomi, Yutaka ,  Naitoh, Shigeki ,  Kanagawa, Shuichi

    IPC分类号： C08G59/08 ,  C08G8/04 ,  C08G59/32

    CPC分类号： C08G59/08 ,  C08G59/3218 ,  C08G59/621 ,  Y10T428/239 ,  Y10T428/24917

    摘要： A novel polyhydric phenol represented by the general formula:

    wherein R₁ to R₄ independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl group, and n represents an average number of repeating units of 0.1 to 10. With the above polyhydric phenol as starting material, there is provided an epoxy resin represented by the general formula:

    wherein R₁ to R₄, X and n are as defined above. There is provided an epoxy resin composition comprising the above epoxy resin and a curing agent. The cured products from the above epoxy resin are excellent in less hygroscopicity and have a balance between thermal resistance and curing performance.

    摘要翻译： 由以下通式表示的新型多元酚：其中R 5至R 8独立地表示氢，具有1至9个碳原子的烷基或环烷基或卤素，X表示氢，烷基 具有1至9个碳原子或芳基，n表示重复单元的平均数为0.1至10.以上述多元酚为原料，提供由以下通式表示的环氧树脂： 其中R 5至R 8，X和n如上所定义。 提供了包含上述环氧树脂和固化剂的环氧树脂组合物。 来自上述环氧树脂的固化产物具有优异的吸湿性，并且在耐热性和固化性能之间具有平衡性。

    Epoxy resin compositions and resin-encapsulated semiconductor devices
    8.
    发明公开
    Epoxy resin compositions and resin-encapsulated semiconductor devices 失效
    Epoxydharzzusammensetzungen undkunststoffumhüllteHalbleiteranordnungen。

    公开(公告)号：EP0598302A1

    公开(公告)日：1994-05-25

    申请号：EP93118081.4

    申请日：1993-11-08

    申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Sugiyama, Yasuhide ,  Shiomi, Yutaka ,  Morimoto, Takashi ,  Saito, Noriaki ,  Kitayama, Shinichiro ,  Suzuki, Michio ,  Sakiyama, Kazuo

    IPC分类号： C08G59/30 ,  C08G59/62 ,  H01L23/29 ,  C07D303/23

    CPC分类号： C07D303/22 ,  C08G59/302 ,  C08G59/621 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An epoxy resin composition which can provide cured products high in adhesion and crack resistance in soldering with high heat resistance and low moisture absorption and a semiconductor devices encapsulated with said composition are disclosed.
    The above epoxy resin composition comprises as essential components an epoxy resin represented by the following formula (1):

    wherein R₁ represents a halogen atom, an alkyl or cycloalkyl group of 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom and when two or more R₁ are present in the same or different rings, they may be the same or different and m represents an integer of 0 to 4, and a polyhydric phenol as a curing agent.

    摘要翻译： 公开了一种环氧树脂组合物，其可以提供具有高耐热性和低吸湿性的焊接中的粘合性和抗裂纹性的固化产物以及用所述组合物包封的半导体器件。 上述环氧树脂组合物包含作为必要成分的由下式（1）表示的环氧树脂：其中R1表示卤素原子，1〜6个碳原子的烷基或环烷基，取代或未取代的苯基或 卤素原子，当两个以上的R 1存在于相同或不同的环时，它们可以相同或不同，m表示0〜4的整数，作为固化剂的多元酚。

    Polyhydric phenol and epoxy resin obtained using the same
    9.
    发明公开
    Polyhydric phenol and epoxy resin obtained using the same 失效
    Polyhydrisilves苯酚和憎水剂Epoxydharz。

    公开(公告)号：EP0536748A1

    公开(公告)日：1993-04-14

    申请号：EP92117199.7

    申请日：1992-10-08

    申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Takebe, Kazuo ,  Morimoto, Takashi ,  Shiomi, Yutaka ,  Sugiyama, Yasuhide ,  Naitoh, Shigeki ,  Saito, Noriaki ,  Kanagawa, Shuichi ,  Kamio, Kunimasa

    IPC分类号： C08G8/04 ,  C08G59/08 ,  C08G59/32 ,  C08L63/00 ,  H01L23/00

    CPC分类号： C08G59/08 ,  C07D303/24 ,  C08G8/04 ,  C08G59/3218 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula:

    wherein R¹ independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R¹ may be identical or different when ℓ is 2 or more, R² independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R² may be identical or different when m is 2 or more, R³ independently represents a hydrogen atom or an alkyl group of 6 or less carbon atoms, the average recurring unit number n is 0-10, ℓ is 0-4 and m is 0-7, and can be contained as a curing agent in an epoxy resin composition which is used not only for giving cured products but also for encapsulating semiconductor devices.

    摘要翻译： 本发明提供作为缩水甘油醚化合物的原料的多元酚，其可以提供具有低吸湿性，高耐热性和改善的抗裂性的固化产物，并可用于封装半导体器件。 多元酚由下式表示：其中R 1独立地表示卤素原子，1-9个碳原子的烷基或环烷基，4个或更少个碳原子的烷氧基或芳基，和 当P为2以上时，R 1可以相同或不同，R 2独立地表示卤素原子，碳原子数为4以下的烷氧基或碳原子数6以下的烷基，R 2为氢原子， 当m为2以上时，R 3可以相同或不同，R 3独立地表示氢原子或碳原子数为6以下的烷基，平均重复单元数n为0〜10，P为0-4，m 为0-7，并且可以作为固化剂包含在环氧树脂组合物中，不仅用于得到固化产物，而且用于封装半导体器件。