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24 条记录 (耗时 0.011 秒)

    Filter comprising thin-film resonators and inductor, duplexer and fabricating methods thereof
    6.
    发明公开
    Filter comprising thin-film resonators and inductor, duplexer and fabricating methods thereof 有权
    过滤器Dünnfilmresonatorenund Induktor，Duplexer und deren Herstellungsverfahren

    公开(公告)号：EP1598934A2

    公开(公告)日：2005-11-23

    申请号：EP05253005.2

    申请日：2005-05-17

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Song, In-sang ,  Ha, Byeoung-ju ,  Park, Yun-kwon ,  Kim, Jong-seok ,  Kim, Duck-hwan ,  Nam, Kuang-woo ,  Park, Hae-seok ,  Hong, Seog-woo

    IPC分类号： H03H9/58 ,  H03H9/70 ,  H03H9/17 ,  H03H9/05 ,  H03H3/02

    CPC分类号： H03H9/564 ,  H03H3/02 ,  H03H9/0542 ,  H03H9/0571 ,  H03H9/173 ,  H03H9/568 ,  H03H9/605 ,  H03H9/706 ,  Y10T29/42

    摘要： A filter using an air gap type film bulk acoustic resonator is provided. The present filter includes a substrate on which a first port, a second port, and a ground port are formed to be connected to an external terminal; at least one first film bulk acoustic resonator serially connecting the first port to the second port on the substrate; at least one second film bulk acoustic resonator parallel connected to an interconnection node formed between the first port and the second port; and at least one inductor serially connecting the second film bulk acoustic resonator to the ground port. The inductor included in the filter is fabricated with the first and second film bulk acoustic resonators as one body. Accordingly, a small-sized filter may be fabricated through a simplified process.

    摘要翻译： 提供了使用气隙型膜体声波谐振器的滤波器。 本发明的滤波器包括：基板，其上形成有第一端口，第二端口和接地端口，以连接到外部端子; 至少一个第一膜体积声谐振器将第一端口与基板上的第二端口串联连接; 至少一个第二膜体声波谐振器并联连接到形成在所述第一端口和所述第二端口之间的互连节点; 以及将所述第二膜体声波谐振器串联连接到所述接地端口的至少一个电感器。 包括在滤波器中的电感器由第一和第二膜体声波谐振器制成为一体。 因此，可以通过简化的过程制造小尺寸滤波器。

    Method of forming a metal interconnect in a trench
    7.
    发明公开
    Method of forming a metal interconnect in a trench 审中-公开
    Herstellung einer metallischen Verbindungsleitung在ein Graben

    公开(公告)号：EP1432026A1

    公开(公告)日：2004-06-23

    申请号：EP03257982.3

    申请日：2003-12-18

    申请人： Samsung Electronics Co., Ltd.

    发明人： Shim, Dong-sik ,  Na, Kyung-won ,  Choi, Sang-on ,  Park, Hae-seok

    IPC分类号： H01L21/768

    CPC分类号： H01L21/76879

    摘要： A method for manufacturing a metal structure using a trench includes etching a semiconductor substrate to form a trench (105), depositing a seed layer (102) over the semiconductor substrate including in the trench, stacking an insulating layer (103) over the seed layer, removing a portion of the insulating layer to expose a portion of the seed layer at a bottom of the trench, filling the trench with a metal material (104), and removing the seed layer and the insulating layer on the semiconductor substrate. As a result, a subsequent process in forming a multi-layered structure may be easily carried out, thereby simplifying a manufacturing process.

    摘要翻译： 使用沟槽制造金属结构的方法包括蚀刻半导体衬底以形成沟槽（105），在包括在沟槽中的半导体衬底上沉积晶种层（102），在晶种层上层叠绝缘层（103） 去除所述绝缘层的一部分以暴露所述沟槽底部的所述种子层的一部分，用金属材料（104）填充所述沟槽，以及去除所述半导体衬底上的种子层和所述绝缘层。 结果，可以容易地进行形成多层结构的后续工艺，从而简化制造工艺。

    Infrared detector
    8.
    发明公开
    Infrared detector 审中-公开
    Infrarot-声学探测器

    公开(公告)号：EP2762845A1

    公开(公告)日：2014-08-06

    申请号：EP14152179.9

    申请日：2014-01-22

    申请人： Samsung Electronics Co., Ltd

    发明人： Park, Hae-seok ,  Nam, Sung-hyun

    IPC分类号： G01J5/20 ,  G01J5/08

    CPC分类号： G01J5/20 ,  G01J5/023 ,  G01J5/0818 ,  G01J5/0853

    摘要： An infrared detector may include a substrate (110), a resonant unit (120)spaced apart from the substrate 110), the resonant unit configured to generate heat by inducing resonance at a plurality of wavelengths of incident infrared light, a thermistor layer (130) configured to support the resonant unit and be spaced apart from the resonant unit (120), the thermistor layer having a resistance value that varies according to the heat generated in the resonant unit, and a connection unit (150) configured to support the thermistor layer (130) such that the thermistor layer is spaced apart from the substrate and electrically connect the thermistor layer to the substrate.

    摘要翻译： 红外检测器可以包括衬底（110），与衬底110间隔开的谐振单元（120）），谐振单元被配置为通过在入射的红外光的多个波长处引起谐振来产生热量，热敏电阻层（130 ），其被配置为支撑所述谐振单元并与所述谐振单元（120）间隔开，所述热敏电阻层具有根据所述谐振单元中产生的热量而变化的电阻值;以及连接单元（150），其被配置为支撑所述热敏电阻 层（130），使得热敏电阻层与衬底间隔开并将热敏电阻层电连接到衬底。

    Method for manufacturing magnetic field detecting element
    9.
    发明公开
    Method for manufacturing magnetic field detecting element 有权
    制造磁场检测元件的方法

    公开(公告)号：EP1467216A3

    公开(公告)日：2005-01-26

    申请号：EP04251015.6

    申请日：2004-02-24

    申请人： Samsung Electronics Co., Ltd.

    发明人： Shim, Dong-sik ,  Choi, Sang-on ,  Na, Kyung-won ,  Park, Hae-seok ,  Hwang, Jun-sik

    IPC分类号： G01R33/028 ,  H01L43/00 ,  G01R33/02 ,  G01R33/04

    CPC分类号： G01R33/02 ,  G01R33/04 ,  G01R33/05 ,  H01F17/0006 ,  H01F41/046

    摘要： Disclosed is a method for manufacturing a magnetic field detecting element, capable of simplifying the manufacturing process and providing a thin-type magnetic field detecting element. The disclosed method for manufacturing a magnetic field detecting element according to the present invention, is characterized in forming a seed film on the semiconductor substrate, then partially removing the seed film using a predetermined pattern in advance, for insulation of a plurality of coil lines that would be formed on the seed film, forming a soft magnetic core, and cutting off edges of the semiconductor substrate so that a plurality of the coil lines may be insulated.

    摘要翻译： 公开了一种制造磁场检测元件的方法，其能够简化制造工艺并且提供薄型磁场检测元件。 根据本发明的用于制造磁场检测元件的方法的特征在于，在半导体基板上形成籽晶膜，然后预先使用预定图案部分地去除籽晶膜，以绝缘多个线圈线 将形成在籽晶膜上，形成软磁芯，并切断半导体衬底的边缘，使得多个线圈线可以绝缘。

    Magnetic field sensing device and method for fabricating thereof
    10.
    发明公开
    Magnetic field sensing device and method for fabricating thereof 有权
    其制备磁场传感器和方法

    公开(公告)号：EP1447674A3

    公开(公告)日：2005-01-26

    申请号：EP04250701.2

    申请日：2004-02-10

    申请人： Samsung Electronics Co., Ltd.

    发明人： Na, Kyung-won ,  Choi, Sang-on ,  Shim, Dong-sik ,  Park, Hae-seok

    IPC分类号： G01R33/028 ,  H01L43/00 ,  G01R33/02 ,  G01R33/04

    CPC分类号： G01R33/02

    摘要： Disclosed is a magnetic field sensor of high sensitivity, and which is power-saving and can be manufactured with low cost in a very small size. The magnetic field sensor includes a soft magnetic core (40) formed to construct a closed-magnetic circuit on a semiconductor substrate (10), a magnetic field sensing coil (20) formed by a metal film in a shape that winds the soft magnetic core, and a drive line (50) for exciting the soft magnetic core by directly applying an electric current thereto. The drive line is formed in a rectangular angle to the magnetic field sensing coil, and connected to the both ends of the soft magnetic core in a length direction.