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1.发明公开
公开(公告)号：EP4225003A1
公开(公告)日：2023-08-09
申请号：EP22818170.7
申请日：2022-11-16
发明人： LEE, Yongwon , JUNG, Kwangho , YE, Jaeheung , JEON, Jinhwan
摘要： An electronic device according to an embodiment includes a printed circuit board including a conductive layer and a conductive pad connected to the conductive layer and exposed to an outside of the printed circuit board; an electric component disposed on a first region of the printed circuit board and the electric component electrically connected to the printed circuit board; a conductive member disposed on the conductive pad and the conductive member surrounding at least part of a periphery of the first region of the printed circuit board; and a shielding member isolating the first region of the printed circuit board from the outside of the printed circuit board by covering the electric component and the conductive member, the shielding member electrically connected to the conductive layer. In addition, various embodiments are possible.
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2.发明公开
公开(公告)号：EP3940504A1
公开(公告)日：2022-01-19
申请号：EP21195327.8
申请日：2019-04-17
发明人： JO, Jeonggyu , KIM, Joohan , KIM, Jinman , SIM, Bokyung , RHEE, Bongjae , LEE, Yongwon , JUNG, Daekwang
摘要： An electronic device includes a display including a first surface facing a first direction to output display information and a second surface facing a second direction opposite the first direction, a biometric sensor including a sensing surface disposed to face a partial area of the second surface of the display and a side surface formed in a lateral direction, a first fixing member interposed between the partial area of the second surface and the biometric sensor such that the sensing surface is attached to the partial area of the second surface, and hardened at a specified temperature, and a second fixing member attached to at least a portion of the side surface and at least a portion of a peripheral area adjacent to the partial area of the second surface and hardened by light of a specified wavelength.
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公开(公告)号：EP4319498A1
公开(公告)日：2024-02-07
申请号：EP22833399.3
申请日：2022-05-18
发明人： YANG, Hyunmo , UHM, Junwhon , PARK, Yonghyun , LEE, Yongwon , HA, Sangwon
摘要： An electronic device is provided, which includes a PCB including a first alignment mark formed on a first surface of the PCB, and an RFPCB including a plurality of layers, a rigid portion disposed on the first surface of the PCB, a flexible portion extending from the rigid portion, and a first protrusion formed as one of the plurality of layers protruding and extending from the rigid portion. A second alignment mark corresponding to the first alignment mark of the PCB is defined in the first protrusion. The first protrusion overlaps at least partially with the first alignment mark of the PCB.
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公开(公告)号：EP3697185A1
公开(公告)日：2020-08-19
申请号：EP18886956.4
申请日：2018-12-05
发明人： JO, Jeonggyu , RHEE, Bongjae , KIM, Joohan , SIM, Bokyung , LEE, Yongwon , JUNG, Daekwang , CHO, Chihyun
IPC分类号： H05K9/00 , H05K1/02 , G02F1/1333 , G01H17/00
摘要： Disclosed is an electronic device. The electronic device according to an embodiment includes a display panel including a plurality of pixels, a display driver IC that is electrically connected with the display panel and that displays contents using the plurality of pixels, a support structure disposed under one surface of the display panel and having an opening part formed therein through which a partial area of the one surface is exposed, a shielding structure disposed under at least part of the partial area of the display exposed through the opening part, the shielding structure being electrically connected with a ground area provided in the electronic device so as to block noise generated from the display panel driven by the display driver IC, and an ultrasonic sensor disposed under at least part of the shielding structure. Besides, it may be permissible to prepare various other embodiments speculated through the specification.
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公开(公告)号：EP3952622A1
公开(公告)日：2022-02-09
申请号：EP20777072.8
申请日：2020-03-19
发明人： LEE, Yongwon , KIM, Jeonghoo , KIM, Joohan , RHEE, Bongjae , YANG, Seyoung , JANG, Seyoung
摘要： Described are various embodiments related to a circuit board included in an electronic device. According to an embodiment, the circuit board includes: a first circuit board, on which at least one circuit element or at least one first electronic component included in an electronic device, is mounted; a second circuit board, on which at least one second electronic component included in the electronic device, is mounted; and a connection structure electrically connecting the first circuit board and the second circuit board through soldering. The connection structure includes: a first connection terminal disposed on the first circuit board and including at least one first connection pad; and a second connection terminal disposed on the second circuit board and including at least one second connection pad. The at least one second connection pad faces the at least one first connection pad and is electrically connected to the at least one first connection pad through the soldering. The at least one second connection pad may include a plurality of contact members which are in surface contact with a solder provided by the soldering. Various other embodiments are possible.
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6.发明公开
公开(公告)号：EP3906454A1
公开(公告)日：2021-11-10
申请号：EP20756200.0
申请日：2020-02-14
发明人： LEE, Yongwon , KIM, Il , KANG, Dareum , PARK, Chohee , BAE, Dohyun , JEONG, Hyeoncheol , JO, Jeonggyu , CHOI, Seongwoo , RHEE, Bongjae
IPC分类号： G06F1/16 , G01S7/521 , C09D163/00 , G06F3/041 , G06K9/00
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