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公开(公告)号：EP2927281A1
公开(公告)日：2015-10-07
申请号：EP13858022.0
申请日：2013-01-21
Applicant: Shengyi Technology Co., Ltd
Inventor： CHEN, Guangbing , ZENG, Xianping
IPC: C08L71/12 , C08L83/07 , C08K5/5425 , C08K5/549 , C08J5/24 , B32B27/04 , B32B15/08 , H05K1/03 , H05K3/00
Abstract: Disclosed in the present invention is a resin composition, comprising a modified polyphenylene ether resin and an organic silicon compound containing unsaturated double bonds. Also disclosed is a method for preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate obtained by the preparation method. The high-frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate in a high-frequency electronic device.
Abstract translation: 在本发明中公开了一种树脂组合物，其包含改性聚苯醚树脂和含有不饱和双键的有机硅化合物。 还公开了使用上述树脂组合物制备高频电路基板的方法和通过该制备方法获得的高频电路基板。 本发明的高频电路基板具有高玻璃化转变温度，高热分解温度，高层间粘合力，低介电常数和低介电损耗角正切，并且非常适合作为电路基板 高频电子设备。
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2.发明公开POLYPHENYL ETHER RESIN COMPOSITION AND USE THEREOF IN HIGH-FREQUENCY CIRCUIT SUBSTRATE 审中-公开聚苯基醚树脂组合物及其在高频电路基板中的用途
公开(公告)号：EP3315555A1
公开(公告)日：2018-05-02
申请号：EP16856570.3
申请日：2016-03-02
Applicant: Shengyi Technology Co., Ltd.
Inventor： CHEN, Guangbing , ZENG, Xianping , GUAN, Chiji
CPC classification number: C09J171/12 , C08G65/485 , C08G77/20 , C08J5/24 , C08J2371/12 , C08J2483/07 , C08L71/126 , C09J11/04 , C09J11/06 , H05K1/0237 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0162 , C08L83/04 , C08K5/14
Abstract: The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment.
Abstract translation: 本发明涉及聚苯醚树脂组合物及其在高频电路基板中的用途。 聚苯醚树脂组合物包含乙烯基改性聚苯醚树脂和含有不饱和双键并具有三维网状结构的有机硅树脂。 本发明的高频电路基板具有高玻璃化转变温度，高热分解温度，高层间粘合力，低介电常数和低介电损耗角正切，并且非常适合作为 高速电子设备。
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3.发明公开POLYPHENYL ETHER RESIN COMPOSITION AND USE THEREOF IN HIGH-FREQUENCY CIRCUIT SUBSTRATE 审中-公开聚苯基醚树脂组合物及其在高频电路基板中的用途
公开(公告)号：EP3315560A1
公开(公告)日：2018-05-02
申请号：EP16856571.1
申请日：2016-03-02
Applicant: Shengyi Technology Co., Ltd.
Inventor： CHEN, Guangbing , ZENG, Xianping , GUAN, Chiji , XU, Yongjing
Abstract: The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has the advantages of a low dielectric constant, a low dielectric loss, high heat resistance, low water absorption, a high interlayer adhesive force and a high bending strength, and is very suitable as a circuit substrate of high-speed electronic equipment.
Abstract translation: 本发明涉及聚苯醚树脂组合物及其在高频电路基板中的用途。 聚苯醚树脂组合物包含乙烯基改性聚苯醚树脂和含有不饱和双键并具有三维网状结构的有机硅树脂。 本发明的高频电路基板具有低介电常数，低介电损耗，高耐热性，低吸水性，高层间粘合力和高弯曲强度的优点，并且非常适合作为电路 高速电子设备的基板。
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Patent Agency Ranking4.发明公开RESIN COMPOSITION AND USES THEREOF IN HIGH-FREQUENCY CIRCUIT BOARD 审中-公开HARZZUSAMMENSETZUNG UND HOVFRENQUENZ-LEITERPLATTEN的VERWENDUNGEN
公开(公告)号：EP3056544A1
公开(公告)日：2016-08-17
申请号：EP14891459.1
申请日：2014-08-11
Applicant: Shengyi Technology Co. Ltd.
Inventor： CHEN, Guangbing , ZENG, Xianping
CPC classification number: C08L71/126 , B32B15/08 , B32B27/04 , C08J5/24 , C08J2371/12 , C08J2483/04 , C08L71/12 , C09D171/12 , H05K1/03 , H05K1/038
Abstract: The present invention discloses a resin composition, comprising an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit). The present invention further discloses a high-frequency circuit substrate prepared from the aforesaid resin composition and the uses of the aforesaid resin composition in the art. The high frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interstratified adhesive force, a low dielectric constant and a low dielectric loss tangent, and are very suitable as the circuit substrates of high frequency electronic equipments.
Abstract translation: 本发明公开了一种树脂组合物，其包含不饱和热固性改性聚苯醚树脂和含有不饱和双键并具有三维网状结构并由单官能硅氧烷单元（M单元）和四官能二氧化硅单元（Q单元）水解缩合的MQ有机硅树脂 ）。 本发明还公开了由上述树脂组合物制备的高频电路基片和本领域中上述树脂组合物的用途。 本发明的高频电路基板具有高玻璃化转变温度，高热分解温度，高层间粘合力，低介电常数和低介电损耗角正切，并且非常适合作为高频电路基板 电子设备。
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公开(公告)号：EP3315560B1
公开(公告)日：2020-02-19
申请号：EP16856571.1
申请日：2016-03-02
Applicant: Shengyi Technology Co., Ltd.
Inventor： CHEN, Guangbing , ZENG, Xianping , GUAN, Chiji , XU, Yongjing
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公开(公告)号：EP2927281B1
公开(公告)日：2020-01-08
申请号：EP13858022.0
申请日：2013-01-21
Applicant: Shengyi Technology Co., Ltd
Inventor： CHEN, Guangbing , ZENG, Xianping
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公开(公告)号：EP3056544B1
公开(公告)日：2018-10-10
申请号：EP14891459.1
申请日：2014-08-11
Applicant: Shengyi Technology Co. Ltd.
Inventor： CHEN, Guangbing , ZENG, Xianping
CPC classification number: C08L71/126 , B32B15/08 , B32B27/04 , C08J5/24 , C08J2371/12 , C08J2483/04 , C08L71/12 , C09D171/12 , H05K1/03 , H05K1/038
Abstract: The present invention discloses a resin composition, comprising an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit). The present invention further discloses a high-frequency circuit substrate prepared from the aforesaid resin composition and the uses of the aforesaid resin composition in the art. The high frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interstratified adhesive force, a low dielectric constant and a low dielectric loss tangent, and are very suitable as the circuit substrates of high frequency electronic equipments.
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8.发明公开
公开(公告)号：EP3366725A1
公开(公告)日：2018-08-29
申请号：EP16856586.9
申请日：2016-04-08
Applicant: Shengyi Technology Co., Ltd.
Inventor： CHEN, Guangbing , ZENG, Xianping
Abstract: Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl resin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative ageing resistance.
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