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1.发明公开EPOXY RESIN COMPOUND, AND, PREPREG AND CLAD COPPER LAMINATE MANUFACTURED USING THE COMPOUND 有权EPOXIDHARZVERBINDUNG UND PREPREG SOWIE UNTER VERWENDUNG DIESER VERBINDUNG HERGESTELLTES PLATTIERTES KUPFERLAMINAT
公开(公告)号：EP2896654A1
公开(公告)日：2015-07-22
申请号：EP12884738.1
申请日：2012-09-14
发明人： ZENG, Xianping , REN, Nana
CPC分类号： C08K5/5313 , B32B5/26 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/20 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2264/104 , B32B2307/204 , B32B2307/306 , B32B2307/704 , B32B2307/7265 , B32B2363/00 , B32B2457/08 , C08G59/28 , C08G59/3227 , C08G59/42 , C08G59/4246 , C08J5/24 , C08J2363/00 , C08K5/53 , C08K5/5317 , H01B3/40 , Y10T442/2213 , Y10T442/3423 , Y10T442/656 , C08L63/00
摘要： The present invention relates to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition comprises components as follows: an epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain, a phosphate salt compound and an active ester hardener; the amount of the epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain is 100 parts by weight, the amount of the phosphate salt compound is 5-50 parts by weight. The equivalent ratio of the amount of the active ester hardener, based on the ratio between epoxy equivalent and active ester equivalent, is 0.85-1.2. The prepreg and the copper-clad laminate made by using the epoxy resin composition have excellent dielectric performance, moisture-heat resistant performance, simultaneously have a high glass transition temperature and a lower water absorption rate and simultaneously realize halogen-free flame retardancy, and achieve UL-94V-0.
摘要翻译： 本发明涉及环氧树脂组合物和通过使用它们制备的预浸料和覆铜层压板。 环氧树脂组合物包含以下成分：含有3个以上环氧基并在分子链中含有氮的环氧树脂，磷酸盐化合物和活性酯硬化剂; 在分子链中含有3个以上环氧基并含有氮的环氧树脂的量为100重量份，磷酸盐化合物的量为5-50重量份。 基于环氧当量与活性酯当量之比的活性酯硬化剂的量的当量比为0.85-1.2。 通过使用环氧树脂组合物制成的预浸料坯和覆铜层压板具有优异的介电性能，耐湿热性能，同时具有高的玻璃化转变温度和较低的吸水率，同时实现无卤阻燃，并实现 UL-94V-0。
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2.发明公开
公开(公告)号：EP2896653A1
公开(公告)日：2015-07-22
申请号：EP12884451.1
申请日：2012-09-14
发明人： ZENG, Xianping , REN, Nana
CPC分类号： H05K1/0373 , B32B15/14 , B32B15/20 , B32B27/38 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/306 , B32B2307/7265 , B32B2457/08 , C08G59/28 , C08G59/3227 , C08G59/4246 , C08G59/4276 , C08J5/24 , C08J2363/00 , C08K5/0066 , C08K5/49 , H05K2201/012 , Y10T428/249921 , Y10T442/2475 , C08L63/00 , C08L67/00
摘要： The present invention relates to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition comprises components as follows: an epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain, a phosphorus-containing halogen-free flame retardant compound and an active ester hardener; the amount of the epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain is 100 parts by weight, the amount of the phosphorus-containing halogen-free flame retardant compound is 10∼150 parts by weight. The equivalent ratio of the amount of the active ester hardener, based on the ratio between epoxy equivalent and active ester equivalent, is 0.85∼1.2. The prepreg and the copper-clad laminate made by using the epoxy resin composition have excellent dielectric performance, moisture-heat resistant performance, simultaneously have a high glass transition temperature and a lower water absorption rate and simultaneously realize halogen-free flame retardancy, achieving UL-94V-0.
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3.发明授权EPOXY RESIN COMPOUND, AND, PREPREG AND COPPER-CLAD LAMINATE MANUFACTURED USING THE COMPOUND 有权环氧树脂化合物，以及使用该化合物制造的预浸料和铜箔层压板
公开(公告)号：EP2896654B1
公开(公告)日：2017-07-12
申请号：EP12884738.1
申请日：2012-09-14
发明人： ZENG, Xianping , REN, Nana
CPC分类号： C08K5/5313 , B32B5/26 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/20 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2264/104 , B32B2307/204 , B32B2307/306 , B32B2307/704 , B32B2307/7265 , B32B2363/00 , B32B2457/08 , C08G59/28 , C08G59/3227 , C08G59/42 , C08G59/4246 , C08J5/24 , C08J2363/00 , C08K5/53 , C08K5/5317 , H01B3/40 , Y10T442/2213 , Y10T442/3423 , Y10T442/656 , C08L63/00
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4.发明授权EPOXY RESIN COMPOSITION, AND, PREPREG AND COPPER CLAD LAMINATE MANUFACTURED USING THE COMPOSITION 有权环氧树脂组合物，以及使用该组合物制造的预浸料和铜箔层压板
公开(公告)号：EP2896653B1
公开(公告)日：2017-05-31
申请号：EP12884451.1
申请日：2012-09-14
发明人： ZENG, Xianping , REN, Nana
CPC分类号： H05K1/0373 , B32B15/14 , B32B15/20 , B32B27/38 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/306 , B32B2307/7265 , B32B2457/08 , C08G59/28 , C08G59/3227 , C08G59/4246 , C08G59/4276 , C08J5/24 , C08J2363/00 , C08K5/0066 , C08K5/49 , H05K2201/012 , Y10T428/249921 , Y10T442/2475 , C08L63/00 , C08L67/00
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